H. Warashina, H. Kawasaki, H. Nagai, T. Yamaguchi, N. Sato, Y. Kikuchi, X. Sun
{"title":"利用挥发性材料的先进气隙形成方案","authors":"H. Warashina, H. Kawasaki, H. Nagai, T. Yamaguchi, N. Sato, Y. Kikuchi, X. Sun","doi":"10.1109/IITC51362.2021.9537549","DOIUrl":null,"url":null,"abstract":"As a solution for RC delay of BEOL interconnect, we developed a novel air gap formation scheme. This scheme uses a volatile material (VM) and allows us to omit one lithography step, which was required for conventional air gap formation. It is possible to apply this scheme to subtractive interconnect scheme too. In this study, we will introduce the basic characteristics of VM and demonstrate the novel air gap integration through e-tests.","PeriodicalId":6823,"journal":{"name":"2021 IEEE International Interconnect Technology Conference (IITC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2021-07-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":"{\"title\":\"Advanced Air Gap Formation Scheme Using Volatile Material\",\"authors\":\"H. Warashina, H. Kawasaki, H. Nagai, T. Yamaguchi, N. Sato, Y. Kikuchi, X. Sun\",\"doi\":\"10.1109/IITC51362.2021.9537549\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"As a solution for RC delay of BEOL interconnect, we developed a novel air gap formation scheme. This scheme uses a volatile material (VM) and allows us to omit one lithography step, which was required for conventional air gap formation. It is possible to apply this scheme to subtractive interconnect scheme too. In this study, we will introduce the basic characteristics of VM and demonstrate the novel air gap integration through e-tests.\",\"PeriodicalId\":6823,\"journal\":{\"name\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2021-07-06\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"5\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2021 IEEE International Interconnect Technology Conference (IITC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/IITC51362.2021.9537549\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 IEEE International Interconnect Technology Conference (IITC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IITC51362.2021.9537549","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Advanced Air Gap Formation Scheme Using Volatile Material
As a solution for RC delay of BEOL interconnect, we developed a novel air gap formation scheme. This scheme uses a volatile material (VM) and allows us to omit one lithography step, which was required for conventional air gap formation. It is possible to apply this scheme to subtractive interconnect scheme too. In this study, we will introduce the basic characteristics of VM and demonstrate the novel air gap integration through e-tests.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
