提高良率的工具通用性分析

G. Kong
{"title":"提高良率的工具通用性分析","authors":"G. Kong","doi":"10.1109/ASMC.2002.1001604","DOIUrl":null,"url":null,"abstract":"ULSI semiconductor processing today involves hundreds of process steps through various semiconductor processing tools. Any tool excursion could lead to serious and costly yield problems. Tool commonality among bad lots is a proven technique to identify the root cause of the problem. As the complexity of process and the number of process steps increase, it is a very challenging task to pin point which tool is the source of problem and at which process step it occurs. Taking advantage of electronic lot tracking systems, systematic tool commonality analysis is capable of effectively identifying the problem source. The critical elements of successful tool commonality analysis are discussed and summarized in this paper, including sample size selection, raw data classification, statistical analysis, time series and analysis of tools with multiple entry points within the same process flow. Several pitfalls of the analysis are identified and discussed. This analysis is successfully applied on a yield enhancement effort in an advanced volume manufacturing fab.","PeriodicalId":64779,"journal":{"name":"半导体技术","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2002-08-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"19","resultStr":"{\"title\":\"Tool commonality analysis for yield enhancement\",\"authors\":\"G. Kong\",\"doi\":\"10.1109/ASMC.2002.1001604\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"ULSI semiconductor processing today involves hundreds of process steps through various semiconductor processing tools. Any tool excursion could lead to serious and costly yield problems. Tool commonality among bad lots is a proven technique to identify the root cause of the problem. As the complexity of process and the number of process steps increase, it is a very challenging task to pin point which tool is the source of problem and at which process step it occurs. Taking advantage of electronic lot tracking systems, systematic tool commonality analysis is capable of effectively identifying the problem source. The critical elements of successful tool commonality analysis are discussed and summarized in this paper, including sample size selection, raw data classification, statistical analysis, time series and analysis of tools with multiple entry points within the same process flow. Several pitfalls of the analysis are identified and discussed. This analysis is successfully applied on a yield enhancement effort in an advanced volume manufacturing fab.\",\"PeriodicalId\":64779,\"journal\":{\"name\":\"半导体技术\",\"volume\":null,\"pages\":null},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2002-08-07\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"19\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"半导体技术\",\"FirstCategoryId\":\"1087\",\"ListUrlMain\":\"https://doi.org/10.1109/ASMC.2002.1001604\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"半导体技术","FirstCategoryId":"1087","ListUrlMain":"https://doi.org/10.1109/ASMC.2002.1001604","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 19

摘要

ULSI半导体加工今天涉及数百个过程步骤,通过各种半导体加工工具。任何工具偏差都可能导致严重且代价高昂的产量问题。不良批次之间的工具共性是一种已被证明的技术,可以识别问题的根本原因。随着工艺的复杂性和工艺步骤的增加,确定哪一种工具是问题的根源,哪一种工艺步骤发生了问题,是一项非常具有挑战性的任务。利用电子批号跟踪系统,系统的工具通用性分析能够有效地识别问题的根源。本文讨论和总结了成功的工具通用性分析的关键要素,包括样本量的选择、原始数据的分类、统计分析、时间序列以及在同一过程流中具有多个入口点的工具的分析。本文指出并讨论了这种分析的几个缺陷。该分析已成功应用于先进量产晶圆厂的良率提升工作。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
查看原文
分享 分享
微信好友 朋友圈 QQ好友 复制链接
本刊更多论文
Tool commonality analysis for yield enhancement
ULSI semiconductor processing today involves hundreds of process steps through various semiconductor processing tools. Any tool excursion could lead to serious and costly yield problems. Tool commonality among bad lots is a proven technique to identify the root cause of the problem. As the complexity of process and the number of process steps increase, it is a very challenging task to pin point which tool is the source of problem and at which process step it occurs. Taking advantage of electronic lot tracking systems, systematic tool commonality analysis is capable of effectively identifying the problem source. The critical elements of successful tool commonality analysis are discussed and summarized in this paper, including sample size selection, raw data classification, statistical analysis, time series and analysis of tools with multiple entry points within the same process flow. Several pitfalls of the analysis are identified and discussed. This analysis is successfully applied on a yield enhancement effort in an advanced volume manufacturing fab.
求助全文
通过发布文献求助,成功后即可免费获取论文全文。 去求助
来源期刊
自引率
0.00%
发文量
8436
期刊最新文献
A manufacturable shallow trench isolation process for sub-0.2 um DRAM technologies Ultra-dilute silicon wafer clean chemistry for fabrication of RF microwave devices Planarization yield limiters for wafer-scale 3D ICs Statistical modeling and analysis of wafer test fail counts An approach for improving yield with intentional defects
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
已复制链接
已复制链接
快去分享给好友吧!
我知道了
×
扫码分享
扫码分享
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1