P. Ramm, A. Klumpp, C. Landesberger, J. Weber, A. Heinig, P. Schneider, Guenter Elst, M. Engelhardt
{"title":"Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration","authors":"P. Ramm, A. Klumpp, C. Landesberger, J. Weber, A. Heinig, P. Schneider, Guenter Elst, M. Engelhardt","doi":"10.1109/3DIC48104.2019.9058871","DOIUrl":null,"url":null,"abstract":"Pioneering contributions of Fraunhofer in the field of 3D IC integration are presented, as well as recent 3D design and technology developments with a dedicated focus on the application of heterogeneous systems.","PeriodicalId":440556,"journal":{"name":"2019 International 3D Systems Integration Conference (3DIC)","volume":"170 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC48104.2019.9058871","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
Pioneering contributions of Fraunhofer in the field of 3D IC integration are presented, as well as recent 3D design and technology developments with a dedicated focus on the application of heterogeneous systems.