P. Ramm, A. Klumpp, C. Landesberger, J. Weber, A. Heinig, P. Schneider, Guenter Elst, M. Engelhardt
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引用次数: 1
Abstract
Pioneering contributions of Fraunhofer in the field of 3D IC integration are presented, as well as recent 3D design and technology developments with a dedicated focus on the application of heterogeneous systems.
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