Electrostatic Shield TSVs to Suppress Coupling Among Stacked ICs

Abstract

Multi chip modules (MCMs) employing three-dimensionally stacked ICs (3DS-ICs) are expected to be the integration method to achieve high performance by integrating memories and processors densely. In such a densely assembled modules, crosstalk between closely placed 3DS-ICs like a stacked memories and processors. In this study, we propose a shielding method using through-silicon vias (TSVs) to suppress stack-to-stack crosstalk, we created MCM model for 3-D electromagnetic solver and simulated result showed good noise suppression effect, simulation result also showed higher suppression ratio as larger number of stacked ICs.