Sungho Lee, Y. Susumago, Z. Qian, N. Takahashi, H. Kino, Tetsu Tanaka, T. Fukushima
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引用次数: 1
Abstract
We have fabricated a new 3D-IC embedded flexible hybrid system (FHS) based on a Fan-Out Wafer-Level Packaging (FOWLP). The unique FHS structure is consisting of PDMS as a flexible substrate in which the 3D-IC with through-Si vias (TSVs) and microbumps are embedded. The mechanical and electrical properties of the 3D-IC embedded FHS are characterized by using repeated bending test with the TSV/microbump daisy chains. The new FHS can be expected to be used as high-performance wearable device systems for biomedical applications.
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