Hierarchical Design Methodology and Optimization for Proximity Communication based Contactless 3D ThruChip Interface

Abstract

For the first time, this work systematically develops the complete serial link by using hierarchical modeling with serial link power and delay models. This paper presents a comprehensive design methodology and optimization using analytical expressions that analyzes the intrinsic energy and area trade-offs of an inductive coupling based high speed serial link. Further, we also demonstrate that equalization is a potential technique of breaking the intrinsic energy and area trade-offs of a TCI channel and reduces link power consumption and inductor area.