E. Bourjot, P. Stewart, C. Dubarry, E. Lagoutte, E. Rolland, N. Bresson, G. Romano, D. Scevola, V. Balan, J. Dechamp, M. Zussy, G. Mauguen, C. Castan, L. Sanchez, A. Jouve, F. Fournel, S. Chéramy
{"title":"Towards a Complete Direct Hybrid Bonding D2W Integration Flow: Known-Good-Dies and Die Planarization Modules Development","authors":"E. Bourjot, P. Stewart, C. Dubarry, E. Lagoutte, E. Rolland, N. Bresson, G. Romano, D. Scevola, V. Balan, J. Dechamp, M. Zussy, G. Mauguen, C. Castan, L. Sanchez, A. Jouve, F. Fournel, S. Chéramy","doi":"10.1109/3DIC48104.2019.9058783","DOIUrl":null,"url":null,"abstract":"Die-to-wafer stacking is very promising for the next 3DIC generation since it offers the ability to assemble several dies with small interconnection pitches. This paper proposes an overall integration scheme D2W HB process to reinforce its robustness and its economical relevance for microelectronics industry. Firstly, a KGD strategy was developed to be compatible with hybrid bonding. A successful D2W bonding was demonstrated with tested pads. Secondly, the development of the planarization of stacked dies is presented.","PeriodicalId":440556,"journal":{"name":"2019 International 3D Systems Integration Conference (3DIC)","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC48104.2019.9058783","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
Die-to-wafer stacking is very promising for the next 3DIC generation since it offers the ability to assemble several dies with small interconnection pitches. This paper proposes an overall integration scheme D2W HB process to reinforce its robustness and its economical relevance for microelectronics industry. Firstly, a KGD strategy was developed to be compatible with hybrid bonding. A successful D2W bonding was demonstrated with tested pads. Secondly, the development of the planarization of stacked dies is presented.
京公网安备 11010802042870号
京ICP备2023020795号-1
分享
求助内容：
应助结果提醒方式：
扫码关注我们
