K. Hamaguchi, M. Nakata, Kouta Segawa, N. Suzuki, T. Nonaka
{"title":"材料性能对2.5D & FO封装翘曲和焊点可靠性影响的研究","authors":"K. Hamaguchi, M. Nakata, Kouta Segawa, N. Suzuki, T. Nonaka","doi":"10.1109/3DIC48104.2019.9058902","DOIUrl":null,"url":null,"abstract":"Warpage and solder joint reliability of 2.5D and fan-out packages were investigated using Finite Element Method comparing with the flip chip package. It revealed that the warpage could be reduced to about 50% and the solder joint reliability could be increased to 1.2 times. Regarding the FO package, using the higher elastic modulus underfill material was effective to improve the both of the warpage and the solder joint reliability. It also indicated that the optimization of the combination of the material properties of underfill and the substrate core were required for the other two packages.","PeriodicalId":440556,"journal":{"name":"2019 International 3D Systems Integration Conference (3DIC)","volume":"109 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package\",\"authors\":\"K. Hamaguchi, M. Nakata, Kouta Segawa, N. Suzuki, T. Nonaka\",\"doi\":\"10.1109/3DIC48104.2019.9058902\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Warpage and solder joint reliability of 2.5D and fan-out packages were investigated using Finite Element Method comparing with the flip chip package. It revealed that the warpage could be reduced to about 50% and the solder joint reliability could be increased to 1.2 times. Regarding the FO package, using the higher elastic modulus underfill material was effective to improve the both of the warpage and the solder joint reliability. It also indicated that the optimization of the combination of the material properties of underfill and the substrate core were required for the other two packages.\",\"PeriodicalId\":440556,\"journal\":{\"name\":\"2019 International 3D Systems Integration Conference (3DIC)\",\"volume\":\"109 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International 3D Systems Integration Conference (3DIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3DIC48104.2019.9058902\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC48104.2019.9058902","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Investigation of the Influence of Material Properties on Warpage and Solder Joint Reliability of 2.5D & FO Package
Warpage and solder joint reliability of 2.5D and fan-out packages were investigated using Finite Element Method comparing with the flip chip package. It revealed that the warpage could be reduced to about 50% and the solder joint reliability could be increased to 1.2 times. Regarding the FO package, using the higher elastic modulus underfill material was effective to improve the both of the warpage and the solder joint reliability. It also indicated that the optimization of the combination of the material properties of underfill and the substrate core were required for the other two packages.
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