弗劳恩霍夫在3D集成电路方面的初步和持续贡献

2019 International 3D Systems Integration Conference (3DIC) Pub Date : 2019-10-01 DOI:10.1109/3DIC48104.2019.9058871

P. Ramm, A. Klumpp, C. Landesberger, J. Weber, A. Heinig, P. Schneider, Guenter Elst, M. Engelhardt

{"title":"弗劳恩霍夫在3D集成电路方面的初步和持续贡献","authors":"P. Ramm, A. Klumpp, C. Landesberger, J. Weber, A. Heinig, P. Schneider, Guenter Elst, M. Engelhardt","doi":"10.1109/3DIC48104.2019.9058871","DOIUrl":null,"url":null,"abstract":"Pioneering contributions of Fraunhofer in the field of 3D IC integration are presented, as well as recent 3D design and technology developments with a dedicated focus on the application of heterogeneous systems.","PeriodicalId":440556,"journal":{"name":"2019 International 3D Systems Integration Conference (3DIC)","volume":"170 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":"{\"title\":\"Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration\",\"authors\":\"P. Ramm, A. Klumpp, C. Landesberger, J. Weber, A. Heinig, P. Schneider, Guenter Elst, M. Engelhardt\",\"doi\":\"10.1109/3DIC48104.2019.9058871\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Pioneering contributions of Fraunhofer in the field of 3D IC integration are presented, as well as recent 3D design and technology developments with a dedicated focus on the application of heterogeneous systems.\",\"PeriodicalId\":440556,\"journal\":{\"name\":\"2019 International 3D Systems Integration Conference (3DIC)\",\"volume\":\"170 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"1\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International 3D Systems Integration Conference (3DIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3DIC48104.2019.9058871\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC48104.2019.9058871","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

摘要

介绍了Fraunhofer在3D IC集成领域的开创性贡献，以及最近的3D设计和技术发展，专注于异构系统的应用。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

查看原文

微信好友朋友圈 QQ好友复制链接

本刊更多论文

Fraunhofer's Initial and Ongoing Contributions in 3D IC Integration

Pioneering contributions of Fraunhofer in the field of 3D IC integration are presented, as well as recent 3D design and technology developments with a dedicated focus on the application of heterogeneous systems.

求助全文

通过发布文献求助，成功后即可免费获取论文全文。去求助

来源期刊

2019 International 3D Systems Integration Conference (3DIC)

自引率

0.00%

发文量