多层模堆的工艺复杂性和成本考虑

2019 International 3D Systems Integration Conference (3DIC) Pub Date : 2019-10-01 DOI:10.1109/3DIC48104.2019.9058876

D. Velenis, J. D. Vos, Soon-Wook Kim, J. Derakhshandeh, P. Bex, G. Capuz, S. Suhard, K. Rebibis, S. V. Huylenbroeck, E. Marinissen, A. Phommahaxay, Andy Miller, G. Beyer, G. V. D. Plas, E. Beyne

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摘要

数据处理需求的增加和数据延迟的减少推动了对高性能系统和内存应用的多层3D堆栈的需求。本文考虑了不同的多层堆叠方法，包括晶圆到晶圆(W2W)和晶圆到晶圆(D2D)堆叠。每种方法的复杂性是根据制造成本及其对堆叠系统成品率的影响来评估的。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Process Complexity and Cost Considerations of Multi-Layer Die Stacks

The increased requirements of data processing and reduced data latency has driven the demand for multi-layer 3D stacks for high performance systems and memory applications. In this paper, different approaches for multi-layer stacking are considered, including wafer-to-wafer (W2W) and die-to-die (D2D) stacking. The complexity of each approach is evaluated in terms of manufacturing cost and its impact on the stacked-system yield.

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2019 International 3D Systems Integration Conference (3DIC)

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