基于电子封装经验的光伏组件寿命预测方法改进

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765781

M. Guyenot, E. Peter, P. Zerrer, F. Kraemer, S. Wiese

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引用次数: 7

摘要

光伏组件和汽车电子产品都设计为在该领域使用20年以上。它们表现出许多相似之处，例如材料组合(硅，铜，无铅互连)，现场负载，资格测试等。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Enhancing the lifetime prediction methodology for photovoltaic modules based on electronic packaging experience

Photovoltaic modules as well as automotive electronics are both designed to perform more than 20 years in the field. They show many similarities, for example the material combinations (Silicon, copper, lead free interconnection), the field loads, qualification tests, etc.

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2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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