{"title":"纳米结构硅的传热及热流控制技术","authors":"M. Nomura","doi":"10.1109/3DIC48104.2019.9058844","DOIUrl":null,"url":null,"abstract":"Heat transfer in Si nanostructure is not only an interesting topic in fundamental physics, but also an important practical study for efficient heat dissipation in electronic devices. In this paper, we discuss characteristic thermal phonon transport property in nanostructured Si membranes, where the dimension is smaller than phonon mean free path. We mainly focus on heat flux control technique in Si membranes using ballisticity and wave nature of phonons, which may be useful for deeper understanding of thermal dissipation in electronic devices with nanostructures.","PeriodicalId":440556,"journal":{"name":"2019 International 3D Systems Integration Conference (3DIC)","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":"{\"title\":\"Heat Transfer in Nanostructured Si and Heat Flux Control Technique\",\"authors\":\"M. Nomura\",\"doi\":\"10.1109/3DIC48104.2019.9058844\",\"DOIUrl\":null,\"url\":null,\"abstract\":\"Heat transfer in Si nanostructure is not only an interesting topic in fundamental physics, but also an important practical study for efficient heat dissipation in electronic devices. In this paper, we discuss characteristic thermal phonon transport property in nanostructured Si membranes, where the dimension is smaller than phonon mean free path. We mainly focus on heat flux control technique in Si membranes using ballisticity and wave nature of phonons, which may be useful for deeper understanding of thermal dissipation in electronic devices with nanostructures.\",\"PeriodicalId\":440556,\"journal\":{\"name\":\"2019 International 3D Systems Integration Conference (3DIC)\",\"volume\":\"43 1\",\"pages\":\"0\"},\"PeriodicalIF\":0.0000,\"publicationDate\":\"2019-10-01\",\"publicationTypes\":\"Journal Article\",\"fieldsOfStudy\":null,\"isOpenAccess\":false,\"openAccessPdf\":\"\",\"citationCount\":\"0\",\"resultStr\":null,\"platform\":\"Semanticscholar\",\"paperid\":null,\"PeriodicalName\":\"2019 International 3D Systems Integration Conference (3DIC)\",\"FirstCategoryId\":\"1085\",\"ListUrlMain\":\"https://doi.org/10.1109/3DIC48104.2019.9058844\",\"RegionNum\":0,\"RegionCategory\":null,\"ArticlePicture\":[],\"TitleCN\":null,\"AbstractTextCN\":null,\"PMCID\":null,\"EPubDate\":\"\",\"PubModel\":\"\",\"JCR\":\"\",\"JCRName\":\"\",\"Score\":null,\"Total\":0}","platform":"Semanticscholar","paperid":null,"PeriodicalName":"2019 International 3D Systems Integration Conference (3DIC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/3DIC48104.2019.9058844","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
Heat Transfer in Nanostructured Si and Heat Flux Control Technique
Heat transfer in Si nanostructure is not only an interesting topic in fundamental physics, but also an important practical study for efficient heat dissipation in electronic devices. In this paper, we discuss characteristic thermal phonon transport property in nanostructured Si membranes, where the dimension is smaller than phonon mean free path. We mainly focus on heat flux control technique in Si membranes using ballisticity and wave nature of phonons, which may be useful for deeper understanding of thermal dissipation in electronic devices with nanostructures.