Pub Date : 2007-01-01DOI: 10.1201/9781439897591-38
J. W. Dini
{"title":"Changes and the future","authors":"J. W. Dini","doi":"10.1201/9781439897591-38","DOIUrl":"https://doi.org/10.1201/9781439897591-38","url":null,"abstract":"","PeriodicalId":20237,"journal":{"name":"Plating and Surface Finishing","volume":"203 1","pages":"36-37"},"PeriodicalIF":0.0,"publicationDate":"2007-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"76899218","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Chloride ion contamination at parts per billion concentrations plaques electrochemists studying barrier anodic aluminum oxide film growth and anodic aluminum oxide capacitor manufacturers. Chloride ion contamination slows film growth and reduces film quality. We have demonstrated that synthetic hydrocalcite substantially reduces the detrimental effects of chloride ion contamination in an aqueous electrolyte commonly used to grow barrier anodic aluminum oxide. We have determined that problems arise if precautions are not taken when using synthetic hydrocalcite as a chloride-ion getter in an aqueous electrolyte. Synthetic hydrocalcite is somewhat hydrophobic. If this powder is added directly to an aqueous electrolyte, some powder disperses; some floats to the top of the bath and forms scum that locally impedes anodic film formation. Commercially available powder contains a wide range of particle sizes including submicrometer-sized particles that can escape through filters into the electrolyte and cause processing problems. These problems can be over come if (1) the getter is placed in filter bags, (2) a piece of filter paper is used to skim trace amounts of getter floating on the top of the bath, (3) dummy runs are performed to scavenge chloride-ion loaded getter micelles dispersed in the bath, and (4) substrates are rinsed with a strong stream of deionized water to remove trace amounts of powder after anodization.
{"title":"The use of synthetic hydrocalcite as a chloride-ion getter for a barrier aluminum anodization process","authors":"J. Panitz, D. J. Sharp","doi":"10.2172/176817","DOIUrl":"https://doi.org/10.2172/176817","url":null,"abstract":"Chloride ion contamination at parts per billion concentrations plaques electrochemists studying barrier anodic aluminum oxide film growth and anodic aluminum oxide capacitor manufacturers. Chloride ion contamination slows film growth and reduces film quality. We have demonstrated that synthetic hydrocalcite substantially reduces the detrimental effects of chloride ion contamination in an aqueous electrolyte commonly used to grow barrier anodic aluminum oxide. We have determined that problems arise if precautions are not taken when using synthetic hydrocalcite as a chloride-ion getter in an aqueous electrolyte. Synthetic hydrocalcite is somewhat hydrophobic. If this powder is added directly to an aqueous electrolyte, some powder disperses; some floats to the top of the bath and forms scum that locally impedes anodic film formation. Commercially available powder contains a wide range of particle sizes including submicrometer-sized particles that can escape through filters into the electrolyte and cause processing problems. These problems can be over come if (1) the getter is placed in filter bags, (2) a piece of filter paper is used to skim trace amounts of getter floating on the top of the bath, (3) dummy runs are performed to scavenge chloride-ion loaded getter micelles dispersed in the bath, and (4) substrates are rinsed with a strong stream of deionized water to remove trace amounts of powder after anodization.","PeriodicalId":20237,"journal":{"name":"Plating and Surface Finishing","volume":"117 1","pages":"52-56"},"PeriodicalIF":0.0,"publicationDate":"1995-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88238507","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Electrolytic and electroless plating are becoming extremely important for forming functional thin films. Printed circuit boards are indispensable as elements of electronic equipment, and the boards are shrinking in size. Accordingly, the full additive process can be attractive as a substitute for the subtractive process. Extraneous deposition occurs easily on the circuits, however, when copper is deposited using the additive process. The sulfate and formate ions accumulated during the plating reaction are the cause of extraneous deposition, or plate-out. Nascent hydrogen is also a possible cause inasmuch as extraneous deposition develops with the evolution of hydrogen gas, as shown in Fig. 1. 1 Extraneous deposition still occurred, however, even when these related factors were eliminated. Fine inorganic particles in the plating bath are also a possible cause of extraneous deposition. 2 Accordingly, elimination of the extraneous deposition by filtration was investigated, as well as the inhibiting effect of the filtering media.
{"title":"Application of precision filtration to an electroless copper plating bath","authors":"T. Fujinami, H. Honma","doi":"10.4139/SFJ.46.1035","DOIUrl":"https://doi.org/10.4139/SFJ.46.1035","url":null,"abstract":"Electrolytic and electroless plating are becoming extremely important for forming functional thin films. Printed circuit boards are indispensable as elements of electronic equipment, and the boards are shrinking in size. Accordingly, the full additive process can be attractive as a substitute for the subtractive process. Extraneous deposition occurs easily on the circuits, however, when copper is deposited using the additive process. The sulfate and formate ions accumulated during the plating reaction are the cause of extraneous deposition, or plate-out. Nascent hydrogen is also a possible cause inasmuch as extraneous deposition develops with the evolution of hydrogen gas, as shown in Fig. 1. 1 Extraneous deposition still occurred, however, even when these related factors were eliminated. Fine inorganic particles in the plating bath are also a possible cause of extraneous deposition. 2 Accordingly, elimination of the extraneous deposition by filtration was investigated, as well as the inhibiting effect of the filtering media.","PeriodicalId":20237,"journal":{"name":"Plating and Surface Finishing","volume":"12 1","pages":"22-24"},"PeriodicalIF":0.0,"publicationDate":"1995-11-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"87422850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Because water is the base of most electrolytes the electroplater must handle, hydrogen's influence on the properties of various layers in the electrodeposition process is very important. How and why this is true will be discussed in this, an edited version of the 34th William Blum Lecture, presented by the author at the Opening Session of SUR/FIN® '93-Anaheim
{"title":"Hydrogen in electrodeposits : of decisive importance, but much neglected","authors":"C. Raub","doi":"10.1380/JSSSJ.15.630","DOIUrl":"https://doi.org/10.1380/JSSSJ.15.630","url":null,"abstract":"Because water is the base of most electrolytes the electroplater must handle, hydrogen's influence on the properties of various layers in the electrodeposition process is very important. How and why this is true will be discussed in this, an edited version of the 34th William Blum Lecture, presented by the author at the Opening Session of SUR/FIN® '93-Anaheim","PeriodicalId":20237,"journal":{"name":"Plating and Surface Finishing","volume":"87 1","pages":"30-38"},"PeriodicalIF":0.0,"publicationDate":"1994-12-10","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81078038","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Spent electroless copper can plate out in drain lines if the solution is still active when it reaches the overflow valve of the plating tank. This can result in clogged drain lines, necessitating more frequent cleaning and/or replacement. Correcting this problem with chemical additions to deactivate the solution requires careful analysis of the waste treatment process. Here's how one circuit board manufacturer handled the delicate situation.
{"title":"WASTE TREATMENT PROCESS FOR ELECTROLESS COPPER","authors":"J. Holly","doi":"10.1108/EB046111","DOIUrl":"https://doi.org/10.1108/EB046111","url":null,"abstract":"Spent electroless copper can plate out in drain lines if the solution is still active when it reaches the overflow valve of the plating tank. This can result in clogged drain lines, necessitating more frequent cleaning and/or replacement. Correcting this problem with chemical additions to deactivate the solution requires careful analysis of the waste treatment process. Here's how one circuit board manufacturer handled the delicate situation.","PeriodicalId":20237,"journal":{"name":"Plating and Surface Finishing","volume":"17 1","pages":"24-27"},"PeriodicalIF":0.0,"publicationDate":"1990-04-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89975159","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
A process has been developed for the production of adherent nickel deposits of good quality on steel without the use of an electric current. The deposition of nickel is brought about by chemical reduction of a nickel salt with hypophosphites in a hot ammoniacal solution. The reaction is catalytic and, under the prescribed conditions of concentration and pH, no reduction occurs in the solution unless certain metals, such as steel or nickel, are introduced into the bath. The reduction then occurs only at the surface of the immersed metal with the production of a coating of nickel of 96 to 97 percent purity.
{"title":"Nickel plating on steel by chemical reduction","authors":"A. Brenner, G. Riddell","doi":"10.6028/JRES.037.019","DOIUrl":"https://doi.org/10.6028/JRES.037.019","url":null,"abstract":"A process has been developed for the production of adherent nickel deposits of good quality on steel without the use of an electric current. The deposition of nickel is brought about by chemical reduction of a nickel salt with hypophosphites in a hot ammoniacal solution. The reaction is catalytic and, under the prescribed conditions of concentration and pH, no reduction occurs in the solution unless certain metals, such as steel or nickel, are introduced into the bath. The reduction then occurs only at the surface of the immersed metal with the production of a coating of nickel of 96 to 97 percent purity.","PeriodicalId":20237,"journal":{"name":"Plating and Surface Finishing","volume":"132 1","pages":"54-56"},"PeriodicalIF":0.0,"publicationDate":"1946-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"75200029","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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