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2016 IEEE 8th International Workshop on Managing Technical Debt (MTD)最新文献

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Adjusting the Balance Sheet by Appending Technical Debt 通过追加技术债务调整资产负债表
Pub Date : 2016-10-01 DOI: 10.1109/MTD.2016.14
S. Akbarinasaji, A. Bener
Technical debt is a metaphor in software engineering interpreted as a trade-off between short-term benefits of postponing development activities and long-term consequences of postponing those activities. Most of the research in technical debt literature focus on identifying technical debt, justifying what to include and what to exclude in the technical debt scope and how to deal with them: either to defer the development activity or to avoid debt. However, there are only a few studies which considered technical debt as a financial obligation. In this paper, we propose to record technical debt item in the balance sheet as a kind of liability. We also review the effect of having technical debt liabilities in the balance sheet.
技术债务是软件工程中的一个隐喻,解释为推迟开发活动的短期利益与推迟这些活动的长期后果之间的权衡。技术债务文献中的大多数研究都集中在识别技术债务,证明在技术债务范围中包括什么和排除什么,以及如何处理它们:要么推迟开发活动,要么避免债务。然而,只有少数研究将技术债务视为一种财务义务。在本文中,我们建议将技术债务项目作为一种负债记录在资产负债表中。我们还回顾了在资产负债表中拥有技术债务负债的影响。
{"title":"Adjusting the Balance Sheet by Appending Technical Debt","authors":"S. Akbarinasaji, A. Bener","doi":"10.1109/MTD.2016.14","DOIUrl":"https://doi.org/10.1109/MTD.2016.14","url":null,"abstract":"Technical debt is a metaphor in software engineering interpreted as a trade-off between short-term benefits of postponing development activities and long-term consequences of postponing those activities. Most of the research in technical debt literature focus on identifying technical debt, justifying what to include and what to exclude in the technical debt scope and how to deal with them: either to defer the development activity or to avoid debt. However, there are only a few studies which considered technical debt as a financial obligation. In this paper, we propose to record technical debt item in the balance sheet as a kind of liability. We also review the effect of having technical debt liabilities in the balance sheet.","PeriodicalId":371173,"journal":{"name":"2016 IEEE 8th International Workshop on Managing Technical Debt (MTD)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117182568","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 5
Practical Technical Debt Discovery by Matching Patterns in Assessment Graph 基于评估图匹配模式的实用技术债务发现
Pub Date : 2016-10-01 DOI: 10.1109/MTD.2016.7
Andriy Shapochka, B. Omelayenko
This article reflects on experiences collected by doing technical debt assessments for many years as a primary job. It argues for a model that represents software source code and other informational artifacts as a graph with metadata describing these artifacts. Technical debt items are discovered with graph matching patterns that represent technical debt discovery patterns. These patterns automate manual work, avoid effort duplication, and boost assessment performance. The overall approach is illustrated with a prototype implementation and a case study.
本文反映了多年来作为主要工作进行技术债务评估所收集的经验。它主张用一个带有描述这些工件的元数据的图来表示软件源代码和其他信息工件的模型。通过表示技术债务发现模式的图形匹配模式发现技术债务项。这些模式使手工工作自动化,避免重复工作,并提高评估性能。通过一个原型实现和一个案例研究说明了整个方法。
{"title":"Practical Technical Debt Discovery by Matching Patterns in Assessment Graph","authors":"Andriy Shapochka, B. Omelayenko","doi":"10.1109/MTD.2016.7","DOIUrl":"https://doi.org/10.1109/MTD.2016.7","url":null,"abstract":"This article reflects on experiences collected by doing technical debt assessments for many years as a primary job. It argues for a model that represents software source code and other informational artifacts as a graph with metadata describing these artifacts. Technical debt items are discovered with graph matching patterns that represent technical debt discovery patterns. These patterns automate manual work, avoid effort duplication, and boost assessment performance. The overall approach is illustrated with a prototype implementation and a case study.","PeriodicalId":371173,"journal":{"name":"2016 IEEE 8th International Workshop on Managing Technical Debt (MTD)","volume":"29 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127791358","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
How “Specification by Example” and Test-Driven Development Help to Avoid Technial Debt “实例说明”和测试驱动开发如何帮助避免技术债务
Pub Date : 2016-10-01 DOI: 10.1109/MTD.2016.10
W. Trumler, Frances Paulisch
This paper is an industrial experience report of applying the "Specification by Example" methodology and test-driven development to the development of a core component of a healthcare product. The methods are mapped to the four quadrants of technical debt introduced by Martin Fowler in order to show how they can help to avoid the accumulation of technical debt. The resulting data show that a very low defect density can be achieved with these practices, which helps to avoid technical debt introduced for example by quick fixes during a late project phase. Performance indicators measured during development and system test are presented. These results are informally compared to approaches based on formal methods further indicating the advantage of the presented approach.
本文是将“实例说明”方法和测试驱动开发应用于医疗保健产品核心组件开发的行业经验报告。这些方法被映射到Martin Fowler引入的技术债务的四个象限,以显示它们如何帮助避免技术债务的积累。结果数据表明,使用这些实践可以实现非常低的缺陷密度,这有助于避免例如在项目后期的快速修复中引入的技术债务。给出了在开发和系统测试期间测量的性能指标。这些结果非正式地与基于正式方法的方法进行了比较,进一步表明了所提出方法的优势。
{"title":"How “Specification by Example” and Test-Driven Development Help to Avoid Technial Debt","authors":"W. Trumler, Frances Paulisch","doi":"10.1109/MTD.2016.10","DOIUrl":"https://doi.org/10.1109/MTD.2016.10","url":null,"abstract":"This paper is an industrial experience report of applying the \"Specification by Example\" methodology and test-driven development to the development of a core component of a healthcare product. The methods are mapped to the four quadrants of technical debt introduced by Martin Fowler in order to show how they can help to avoid the accumulation of technical debt. The resulting data show that a very low defect density can be achieved with these practices, which helps to avoid technical debt introduced for example by quick fixes during a late project phase. Performance indicators measured during development and system test are presented. These results are informally compared to approaches based on formal methods further indicating the advantage of the presented approach.","PeriodicalId":371173,"journal":{"name":"2016 IEEE 8th International Workshop on Managing Technical Debt (MTD)","volume":"71 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132747683","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
The Perception of Technical Debt in the Embedded Systems Domain: An Industrial Case Study 嵌入式系统领域技术债务的感知:一个工业案例研究
Pub Date : 2016-10-01 DOI: 10.1109/MTD.2016.8
Areti Ampatzoglou, Apostolos Ampatzoglou, A. Chatzigeorgiou, P. Avgeriou, P. Abrahamsson, A. Martini, Uwe Zdun, Kari Systä
Technical Debt Management (TDM) has drawn the attention of software industries during the last years, including embedded systems. However, we currently lack an overview of how practitioners from this application domain perceive technical debt. To this end, we conducted a multiple case study in the embedded systems industry, to investigate: (a) the expected life-time of components that have TD, (b) the most frequently occurring types of TD in them, and (c) the significance of TD against run-time quality attributes. The case study was performed on seven embedded systems industries (telecommunications, printing, smart manufacturing, sensors, etc.) from five countries (Greece, Netherlands, Sweden, Austria, and Finland). The results of the case study suggest that: (a) maintainability is more seriously considered when the expected lifetime of components is larger than ten years, (b) the most frequent types of debt are test, architectural, and code debt, and (c) in embedded systems the run-time qualities are prioritized compared to design-time qualities that are usually associated with TD. The obtained results can be useful for both researchers and practitioners: the former can focus their research on the most industrially-relevant aspects of TD, whereas the latter can be informed about the most common types of TD and how to focus their TDM processes.
技术债务管理(TDM)在过去几年中引起了软件行业的注意,包括嵌入式系统。然而,我们目前缺乏关于这个应用领域的从业者如何看待技术债务的概述。为此,我们在嵌入式系统行业中进行了多个案例研究,以调查:(a)具有TD的组件的预期寿命,(b)其中最频繁发生的TD类型,以及(c) TD对运行时质量属性的重要性。案例研究是在来自五个国家(希腊、荷兰、瑞典、奥地利和芬兰)的七个嵌入式系统行业(电信、印刷、智能制造、传感器等)进行的。案例研究的结果表明:(a)当组件的预期生命周期大于十年时,可维护性被更认真地考虑,(b)最常见的债务类型是测试、架构和代码债务,以及(c)在嵌入式系统中,与通常与TD相关的设计时质量相比,运行时质量被优先考虑。获得的结果对研究人员和从业者都很有用:前者可以将他们的研究重点放在与工业最相关的TD方面,而后者可以了解最常见的TD类型以及如何关注他们的TDM过程。
{"title":"The Perception of Technical Debt in the Embedded Systems Domain: An Industrial Case Study","authors":"Areti Ampatzoglou, Apostolos Ampatzoglou, A. Chatzigeorgiou, P. Avgeriou, P. Abrahamsson, A. Martini, Uwe Zdun, Kari Systä","doi":"10.1109/MTD.2016.8","DOIUrl":"https://doi.org/10.1109/MTD.2016.8","url":null,"abstract":"Technical Debt Management (TDM) has drawn the attention of software industries during the last years, including embedded systems. However, we currently lack an overview of how practitioners from this application domain perceive technical debt. To this end, we conducted a multiple case study in the embedded systems industry, to investigate: (a) the expected life-time of components that have TD, (b) the most frequently occurring types of TD in them, and (c) the significance of TD against run-time quality attributes. The case study was performed on seven embedded systems industries (telecommunications, printing, smart manufacturing, sensors, etc.) from five countries (Greece, Netherlands, Sweden, Austria, and Finland). The results of the case study suggest that: (a) maintainability is more seriously considered when the expected lifetime of components is larger than ten years, (b) the most frequent types of debt are test, architectural, and code debt, and (c) in embedded systems the run-time qualities are prioritized compared to design-time qualities that are usually associated with TD. The obtained results can be useful for both researchers and practitioners: the former can focus their research on the most industrially-relevant aspects of TD, whereas the latter can be informed about the most common types of TD and how to focus their TDM processes.","PeriodicalId":371173,"journal":{"name":"2016 IEEE 8th International Workshop on Managing Technical Debt (MTD)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129221094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 32
Towards Assessing the Technical Debt of Undesired Software Behaviors in Design Patterns 对设计模式中不需要的软件行为的技术债务的评估
Pub Date : 2016-10-01 DOI: 10.1109/MTD.2016.13
Derek Reimanis, C. Izurieta
Providing software developers and researchers with useful technical debt analysis tools is an instrumental outcome of software engineering and technical debt research. Such tools aggregate industry best practices to provide users with organized and quantifiable metrics that can help minimize the time it takes to synthesize and make an intelligent future decision regarding a system. Today, most tools rely primarily on structural measurements from static analysis to generate results. However, it is also necessary to consider measurements that capture the behavior of software, as these represent additional complexities within a system that structural measurements are incapable of detecting. Herein, we present our position, that more effort needs to be placed towards understanding software behavior so that technical debt analysis tools can begin supporting them, in order to provide tool users with a more accurate and complete view of their system. In this paper, we describe this problem in the context of design patterns and outline an effective method to talk about behaviors in the future. We create and classify two example behaviors using our method, both of which increase the technical debt in their respective design pattern applications.
为软件开发人员和研究人员提供有用的技术债务分析工具是软件工程和技术债务研究的重要成果。这些工具汇集了行业最佳实践,为用户提供有组织的、可量化的指标,这些指标可以帮助最大限度地减少综合和做出有关系统的智能未来决策所需的时间。今天,大多数工具主要依赖于静态分析的结构测量来生成结果。然而,也有必要考虑捕获软件行为的度量,因为这些度量代表了系统中结构度量无法检测到的额外复杂性。在这里,我们提出了我们的立场,需要更多的努力来理解软件行为,以便技术债务分析工具可以开始支持它们,以便为工具用户提供更准确和完整的系统视图。在本文中,我们在设计模式的背景下描述了这个问题,并概述了未来讨论行为的有效方法。我们使用我们的方法创建并分类了两个示例行为,这两个示例行为都增加了各自设计模式应用程序中的技术债务。
{"title":"Towards Assessing the Technical Debt of Undesired Software Behaviors in Design Patterns","authors":"Derek Reimanis, C. Izurieta","doi":"10.1109/MTD.2016.13","DOIUrl":"https://doi.org/10.1109/MTD.2016.13","url":null,"abstract":"Providing software developers and researchers with useful technical debt analysis tools is an instrumental outcome of software engineering and technical debt research. Such tools aggregate industry best practices to provide users with organized and quantifiable metrics that can help minimize the time it takes to synthesize and make an intelligent future decision regarding a system. Today, most tools rely primarily on structural measurements from static analysis to generate results. However, it is also necessary to consider measurements that capture the behavior of software, as these represent additional complexities within a system that structural measurements are incapable of detecting. Herein, we present our position, that more effort needs to be placed towards understanding software behavior so that technical debt analysis tools can begin supporting them, in order to provide tool users with a more accurate and complete view of their system. In this paper, we describe this problem in the context of design patterns and outline an effective method to talk about behaviors in the future. We create and classify two example behaviors using our method, both of which increase the technical debt in their respective design pattern applications.","PeriodicalId":371173,"journal":{"name":"2016 IEEE 8th International Workshop on Managing Technical Debt (MTD)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129323845","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 10
Database Design Debts through Examining Schema Evolution 从模式演化的角度分析数据库设计债
Pub Date : 2016-10-01 DOI: 10.1109/MTD.2016.9
Mashel Al-Barak, R. Bahsoon
Causes of the database debt can stem from ill-conceptual, logical, and/or physical database design decisions, violations to key design databases principles, use of anti-patterns etc. In this paper, we explore the problem of relational database design debt and define the problem. We develop a taxonomy, which classifies various types of debts that can relate to conceptual, logical and physical design of a database. We define the concept of Database Design Debt, discuss their origin, causes and preventive mechanisms. We draw on MediaWiki case study and examine its database schema evolution to support our work. The contribution hopes to make database designers and application developers aware of these debts so they can minimize/avoid their consequences on a given system.
数据库债务的原因可能源于概念错误、逻辑和/或物理数据库设计决策、违反关键的数据库设计原则、使用反模式等。本文探讨了关系数据库设计债的问题,并对其进行了定义。我们开发了一个分类法,对各种类型的债务进行分类,这些债务可能与数据库的概念、逻辑和物理设计有关。定义了数据库设计债的概念,讨论了数据库设计债的起源、原因和预防机制。我们利用MediaWiki的案例研究,研究其数据库模式的演变,以支持我们的工作。该贡献希望使数据库设计人员和应用程序开发人员意识到这些债务,以便他们可以最大限度地减少/避免它们对给定系统的影响。
{"title":"Database Design Debts through Examining Schema Evolution","authors":"Mashel Al-Barak, R. Bahsoon","doi":"10.1109/MTD.2016.9","DOIUrl":"https://doi.org/10.1109/MTD.2016.9","url":null,"abstract":"Causes of the database debt can stem from ill-conceptual, logical, and/or physical database design decisions, violations to key design databases principles, use of anti-patterns etc. In this paper, we explore the problem of relational database design debt and define the problem. We develop a taxonomy, which classifies various types of debts that can relate to conceptual, logical and physical design of a database. We define the concept of Database Design Debt, discuss their origin, causes and preventive mechanisms. We draw on MediaWiki case study and examine its database schema evolution to support our work. The contribution hopes to make database designers and application developers aware of these debts so they can minimize/avoid their consequences on a given system.","PeriodicalId":371173,"journal":{"name":"2016 IEEE 8th International Workshop on Managing Technical Debt (MTD)","volume":"46 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124390904","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 11
Technical Debt Indexes Provided by Tools: A Preliminary Discussion 工具提供的技术债务指标:初步讨论
Pub Date : 2016-10-01 DOI: 10.1109/MTD.2016.11
F. Fontana, Riccardo Roveda, M. Zanoni
In software maintenance and evolution, it is important to assess both code and architecture in order to identify issues to be solved to improve software quality. Different tools provide some kind of index giving us an overall evaluation of a project to be used when managing its technical debt. In this paper, we outline how the indexes, that we call in general Technical Debt Indexes, provided by five different tools are computed. We describe their principal features and differences, what aspects they are missing, and we outline if (and how) the indexes take into account architectural problems that could have a major impact on the architectural debt. We show that the indexes rely on different information sources and measure different quantities.
在软件维护和发展中,为了确定要解决的问题以提高软件质量,评估代码和体系结构是很重要的。不同的工具提供了某种索引,让我们在管理技术债务时对项目进行全面评估。在本文中,我们概述了如何计算由五种不同工具提供的指数,我们通常称之为技术债务指数。我们描述了它们的主要特性和差异,它们缺少哪些方面,并且我们概述了索引是否(以及如何)考虑了可能对体系结构债务产生重大影响的体系结构问题。我们表明,这些指标依赖于不同的信息源,测量不同的量。
{"title":"Technical Debt Indexes Provided by Tools: A Preliminary Discussion","authors":"F. Fontana, Riccardo Roveda, M. Zanoni","doi":"10.1109/MTD.2016.11","DOIUrl":"https://doi.org/10.1109/MTD.2016.11","url":null,"abstract":"In software maintenance and evolution, it is important to assess both code and architecture in order to identify issues to be solved to improve software quality. Different tools provide some kind of index giving us an overall evaluation of a project to be used when managing its technical debt. In this paper, we outline how the indexes, that we call in general Technical Debt Indexes, provided by five different tools are computed. We describe their principal features and differences, what aspects they are missing, and we outline if (and how) the indexes take into account architectural problems that could have a major impact on the architectural debt. We show that the indexes rely on different information sources and measure different quantities.","PeriodicalId":371173,"journal":{"name":"2016 IEEE 8th International Workshop on Managing Technical Debt (MTD)","volume":"55 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2016-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124816665","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 34
期刊
2016 IEEE 8th International Workshop on Managing Technical Debt (MTD)
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