Pub Date : 2025-10-30DOI: 10.1109/JFLEX.2025.3627533
Cláudia S. Buga;Júlio C. Viana
Technological advancements in flexible electronics and smart sensing are enabling the development of electronic skins that mimic their biological counterpart more closely. Achieving this requires the use of flexible materials, additive manufacturing processes, and reliable multimodal sensor architectures. This work presents a flexible multisensor platform integrating resistive pressure, temperature, and humidity sensors. Individual sensors were first characterized, then integrated and encapsulated with a polydimethylsiloxane (PDMS) layer for protection and mechanical robustness. Temperature sensors exhibited a linear thermal response, with a slight reduction in sensitivity after encapsulation. Humidity sensors, selectively left unencapsulated, maintained stable performance. Pressure sensors preserved their sensitivity profile, with enhanced low-pressure sensitivity (<10 kPa) but reduced high-pressure response due to PDMS compression limits. Cross-sensitivity tests under varying environmental conditions revealed minimal interference, although digital filtering reduces baseline noise in idle pressure sensors. The proposed platform demonstrates the feasibility of scalable, multimodal e-skins for wearable electronics, soft robotics, and human–machine interfaces.
{"title":"On the Development of Pressure, Temperature, and Humidity Sensors for Electronic Skins","authors":"Cláudia S. Buga;Júlio C. Viana","doi":"10.1109/JFLEX.2025.3627533","DOIUrl":"https://doi.org/10.1109/JFLEX.2025.3627533","url":null,"abstract":"Technological advancements in flexible electronics and smart sensing are enabling the development of electronic skins that mimic their biological counterpart more closely. Achieving this requires the use of flexible materials, additive manufacturing processes, and reliable multimodal sensor architectures. This work presents a flexible multisensor platform integrating resistive pressure, temperature, and humidity sensors. Individual sensors were first characterized, then integrated and encapsulated with a polydimethylsiloxane (PDMS) layer for protection and mechanical robustness. Temperature sensors exhibited a linear thermal response, with a slight reduction in sensitivity after encapsulation. Humidity sensors, selectively left unencapsulated, maintained stable performance. Pressure sensors preserved their sensitivity profile, with enhanced low-pressure sensitivity (<10 kPa) but reduced high-pressure response due to PDMS compression limits. Cross-sensitivity tests under varying environmental conditions revealed minimal interference, although digital filtering reduces baseline noise in idle pressure sensors. The proposed platform demonstrates the feasibility of scalable, multimodal e-skins for wearable electronics, soft robotics, and human–machine interfaces.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"4 12","pages":"460-467"},"PeriodicalIF":0.0,"publicationDate":"2025-10-30","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145674878","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-10-13DOI: 10.1109/JFLEX.2025.3620764
Kaushik U. Godbole;Rui Chen;Suresh K. Sitaraman
Existing literature has mostly focused on assessing the reliability of flexible and stretchable materials under monotonic uniaxial stretching. Although most wearable patches and smart textiles undergo biaxial stretching, there is limited literature that examines the performance and reliability of these materials under biaxial stretching. The existing literature on biaxial stretching has also confined itself to monotonic stretching and does not discuss fatigue biaxial stretching. Thus, this work aims to illustrate the electrical performance and the reliability of flexible materials under fatigue biaxial stretching. This article outlines an approach to perform fatigue biaxial stretching experiments to test the performance and reliability of stretchable materials before deployment. In this work, the fatigue biaxial stretching parameters, such as the mean strain and the strain amplitude, have been selected as a function of the monotonic failure strain. By conducting tests on stretchable thermoset substrate samples that were screen-printed with a silver micro-flake conductor ink, this work has developed a unique predictive model that relates the fatigue-life of the printed conductor as a function of the applied mean strain and the applied strain amplitude. In addition, this work has also examined the average rate of resistance increase and how it is related to the applied mean strain and the applied strain amplitude. In this work, it is found that the failure of the samples under biaxial fatigue loading is dependent on both the mean strain and strain amplitude. However, it is also found in this work that the number of cycles to fatigue failure has a much higher sensitivity to the strain amplitude than to the mean strain. It is further seen that when the strain amplitude is kept constant, the rate of increase in the conductor resistance per cycle is higher when the mean strain is increased.
{"title":"Electrical Reliability of Conductor Printed on Stretchable Substrate Under Biaxial Fatigue Loading","authors":"Kaushik U. Godbole;Rui Chen;Suresh K. Sitaraman","doi":"10.1109/JFLEX.2025.3620764","DOIUrl":"https://doi.org/10.1109/JFLEX.2025.3620764","url":null,"abstract":"Existing literature has mostly focused on assessing the reliability of flexible and stretchable materials under monotonic uniaxial stretching. Although most wearable patches and smart textiles undergo biaxial stretching, there is limited literature that examines the performance and reliability of these materials under biaxial stretching. The existing literature on biaxial stretching has also confined itself to monotonic stretching and does not discuss fatigue biaxial stretching. Thus, this work aims to illustrate the electrical performance and the reliability of flexible materials under fatigue biaxial stretching. This article outlines an approach to perform fatigue biaxial stretching experiments to test the performance and reliability of stretchable materials before deployment. In this work, the fatigue biaxial stretching parameters, such as the mean strain and the strain amplitude, have been selected as a function of the monotonic failure strain. By conducting tests on stretchable thermoset substrate samples that were screen-printed with a silver micro-flake conductor ink, this work has developed a unique predictive model that relates the fatigue-life of the printed conductor as a function of the applied mean strain and the applied strain amplitude. In addition, this work has also examined the average rate of resistance increase and how it is related to the applied mean strain and the applied strain amplitude. In this work, it is found that the failure of the samples under biaxial fatigue loading is dependent on both the mean strain and strain amplitude. However, it is also found in this work that the number of cycles to fatigue failure has a much higher sensitivity to the strain amplitude than to the mean strain. It is further seen that when the strain amplitude is kept constant, the rate of increase in the conductor resistance per cycle is higher when the mean strain is increased.","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"4 12","pages":"446-459"},"PeriodicalIF":0.0,"publicationDate":"2025-10-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145674836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-10-07DOI: 10.1109/JFLEX.2025.3609434
Jasmin Aghassi-Hagmann;Niels Benson;Riccardo Colella;Luisa Petti;Almudena Rivadeneyra;Dimitra G. Georgiadou
{"title":"Editorial for the 2024 International Flexible Electronics Technology Conference (IFETC) held in Bologna, Italy","authors":"Jasmin Aghassi-Hagmann;Niels Benson;Riccardo Colella;Luisa Petti;Almudena Rivadeneyra;Dimitra G. Georgiadou","doi":"10.1109/JFLEX.2025.3609434","DOIUrl":"https://doi.org/10.1109/JFLEX.2025.3609434","url":null,"abstract":"","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"4 8","pages":"295-297"},"PeriodicalIF":0.0,"publicationDate":"2025-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11195942","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145236687","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-10-07DOI: 10.1109/JFLEX.2025.3612599
{"title":"IEEE Journal on Flexible Electronics Call for Papers: Cross Society Special Issue (ISCAS 2025 and IFETC 2025) on Flexible Hybrid Electronics: Next-Generation Circuits and Systems for Wearable Intelligence","authors":"","doi":"10.1109/JFLEX.2025.3612599","DOIUrl":"https://doi.org/10.1109/JFLEX.2025.3612599","url":null,"abstract":"","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"4 8","pages":"358-359"},"PeriodicalIF":0.0,"publicationDate":"2025-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11195955","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145236666","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2025-10-07DOI: 10.1109/JFLEX.2025.3612550
{"title":"IEEE Journal on Flexible Electronics Call for Papers: Special Issue on Memristor Technology: From Circuit Theory to Device Physics and Applications","authors":"","doi":"10.1109/JFLEX.2025.3612550","DOIUrl":"https://doi.org/10.1109/JFLEX.2025.3612550","url":null,"abstract":"","PeriodicalId":100623,"journal":{"name":"IEEE Journal on Flexible Electronics","volume":"4 8","pages":"360-360"},"PeriodicalIF":0.0,"publicationDate":"2025-10-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=11195954","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"145236696","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：