{"title":"INTRODUCING THE NEXT GENERATION IN INSULATION","authors":"Wen‐Jei Yang, Nengli Zhang","doi":"10.1615/istp-vi.1160","DOIUrl":"https://doi.org/10.1615/istp-vi.1160","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"75 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116729540","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The coupled conduction and forced convection transport from substrate-mounted modules in a channel is numerically investigated to identify the effects of the substrate conductivity. The results presented apply to air and two-dimensional laminar flow conditions. It was found that recirculating cells as well as streamwise conduction through the substrate play an important role in predicting convective heat transfer from the printed circuit board (PCB) and modules and in determining the temperature distributions in the PCB, modules, and fluid. The dimensionless temperature and the local Nusselt number along the interface between the fluid and the module or PCB are rather complicated, and therefore, predetermined simple boundary conditions along the solid surface may be inappropriate in many conjugate heat transfer problems. In general, the results show that the maximum temperature within heat sources can be greatly reduced by increasing the conductivity of the PCB. The effectiveness of the use of highly conductive materials for PCB, however, depends on the distance between the heat generating modules on the PCB. In addition, finite thermal resistance between the module and the PCB would serve to diminish the PCB conduction effects, thereby reducing the effectiveness of the enhancement afforded by increased conductivity.
{"title":"EFFECTS OF SUBSTRATE CONDUCTIVITY ON CONVECTIVE COOLING OF ELECTRONIC COMPONENTS","authors":"Christopher Y. Choi, S. Kim, A. Ortega","doi":"10.1115/1.2905686","DOIUrl":"https://doi.org/10.1115/1.2905686","url":null,"abstract":"The coupled conduction and forced convection transport from substrate-mounted modules in a channel is numerically investigated to identify the effects of the substrate conductivity. The results presented apply to air and two-dimensional laminar flow conditions. It was found that recirculating cells as well as streamwise conduction through the substrate play an important role in predicting convective heat transfer from the printed circuit board (PCB) and modules and in determining the temperature distributions in the PCB, modules, and fluid. The dimensionless temperature and the local Nusselt number along the interface between the fluid and the module or PCB are rather complicated, and therefore, predetermined simple boundary conditions along the solid surface may be inappropriate in many conjugate heat transfer problems. In general, the results show that the maximum temperature within heat sources can be greatly reduced by increasing the conductivity of the PCB. The effectiveness of the use of highly conductive materials for PCB, however, depends on the distance between the heat generating modules on the PCB. In addition, finite thermal resistance between the module and the PCB would serve to diminish the PCB conduction effects, thereby reducing the effectiveness of the enhancement afforded by increased conductivity.","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"02 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124478005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IMPROVED KERNEL FUNCTIONS AND BOUNDARY CONDITION TREATMENT FOR THE VORTEX METHOD","authors":"Ji Zhang, E. Hussein","doi":"10.1615/istp-vi.1240","DOIUrl":"https://doi.org/10.1615/istp-vi.1240","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126551374","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"A STUDY OF HEAT TRANSFER CHARACTERISTIC OF GAS CARRYING EVAPORATION AND ITS APPLICATION","authors":"W. Q. Xu, Y. Nan, Z. Yu, Z. Shen","doi":"10.1615/istp-vi.320","DOIUrl":"https://doi.org/10.1615/istp-vi.320","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132493312","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"PATTERN TRACKING USING GRAY LEVEL DIFFERENCES AND ITS APPLICATION TO LOW VELOCITY AIRFLOW MEASUREMENT","authors":"A. Kaga, Y. Inoue, K. Yamaguchi","doi":"10.1615/istp-vi.1060","DOIUrl":"https://doi.org/10.1615/istp-vi.1060","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132777785","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1993-05-01DOI: 10.1615/INTERJFLUIDMECHRES.V25.I4-6.180
M. Ohadi, S. S. Li, A. Ansari
{"title":"HEAT TRANSFER AND PRESSURE DROP CHARACTERISTICS IN AN EHD-ENHANCED FINNED-TUBE GAS-TO-GAS HEAT EXCHANGER","authors":"M. Ohadi, S. S. Li, A. Ansari","doi":"10.1615/INTERJFLUIDMECHRES.V25.I4-6.180","DOIUrl":"https://doi.org/10.1615/INTERJFLUIDMECHRES.V25.I4-6.180","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"250 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131911163","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"THE EFFECT OF MASS FLOW RATE ON FLOW BEHAVIOUR IN A CENTRIFUGAL IMPELLER PASSAGE","authors":"N. A. Ahmed, R. Elder","doi":"10.1615/istp-vi.820","DOIUrl":"https://doi.org/10.1615/istp-vi.820","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128692983","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"THE DEVELOPMENT OF TITANIUM-AMMONIA VARIABLE CONDUCTANCE HEAT PIPE","authors":"M. Ishizuka, T. Sasaki, Y. Miyazaki","doi":"10.1615/istp-vi.660","DOIUrl":"https://doi.org/10.1615/istp-vi.660","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"20 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125955780","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"EFFECT OF THE MODULE FRONT DOOR CLOSING PROCEDURE OF A DIGITAL TRANSMISSION EQUIPMENT ON THE TEMPERATURE OF THE COMPONENTS","authors":"R. Ramos, L. Milanez","doi":"10.1615/istp-vi.610","DOIUrl":"https://doi.org/10.1615/istp-vi.610","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125419500","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Nosoko, T. Nagata, T. Shinzato, K. Oyakawa, Tsunehiro Ohmija, M. Nagai
{"title":"IMAGE ANALYSIS OF A SHADOWGRAM VISUALIZING SURFACE WAVES ON A FALLING LIQUID FILM","authors":"T. Nosoko, T. Nagata, T. Shinzato, K. Oyakawa, Tsunehiro Ohmija, M. Nagai","doi":"10.1615/istp-vi.1030","DOIUrl":"https://doi.org/10.1615/istp-vi.1030","url":null,"abstract":"","PeriodicalId":168856,"journal":{"name":"Proceeding of Transport Phenomena in Thermal Engineering. Volume 2","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1993-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122481420","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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