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XVI ICT '97. Proceedings ICT'97. 16th International Conference on Thermoelectrics (Cat. No.97TH8291)最新文献

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Peculiarities of electrophysical properties of Bi/sub 2/Te/sub 3/ doped with Sn Sn掺杂Bi/sub 2/Te/sub 3/的电物理特性
M.K. Zhitinskaya, S. Nemov, T. E. Svechnikova
The influence of doping with Sn atoms is investigated in details. The method of additional doping with electroactive impurities is used. The peculiarities of kinetic coefficients of Bi/sub 2/Te/sub 3/ doped with Sn and J simultaneously are discussed. There is good reason to believe that these peculiarities are due to Sn-resonant states.
详细研究了锡原子掺杂的影响。采用外加掺杂电活性杂质的方法。讨论了Sn和J同时掺杂Bi/sub 2/Te/sub 3/的动力学系数的特殊性。有充分的理由相信这些特性是由sn共振态引起的。
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引用次数: 0
The thermocouple temperature instability 热电偶温度不稳定
B. Goltsman, Y. Ravich
It has been demonstrated that the thermocouple with strong dependence of the thermoelectric parameters can be in the regime of temperature instability. The criterion of the instability origin has been calculated in the case when the Joule heat flow to the external junctions is absorbed by the Peltier effect and the temperature deviations of thermoelectric parameters can strongly break the heat balance. In this case only the Seebeck coefficient temperature dependence and the thermocouple figure of merit value determine the instability criterion. The thermocouple in the unstable regime can be used as a memory cell, a temperature amplifier and a temperature element very sensitive to the voltage.
结果表明,对热电参数有较强依赖性的热电偶可以处于温度不稳定状态。计算了外结的焦耳热流被珀尔帖效应吸收,热电参数的温度偏差会强烈破坏热平衡的情况下的不稳定源判据。在这种情况下,只有塞贝克系数的温度依赖关系和热电偶的优值图确定了不稳定性判据。处于不稳定状态的热电偶可以用作存储单元、温度放大器和对电压非常敏感的温度元件。
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引用次数: 4
Thermoelectric properties of Bi and Bi/sub 2/Te/sub 3/ composites Bi和Bi/sub 2/Te/sub 3/复合材料的热电性能
T. Huber, R. Calcao
It has been suggested that microengineering traditional thermoelectric materials into composites may lead to a significant improvement in their thermoelectric performance because of the reduction of phonon thermal conductivity from phonon scattering at the grain boundaries and interfaces. At the fundamental level the composite figure of merit ZT may be dramatically increased over that for bulk because of the increase of the electronic density of states that occur in low dimensionality systems. One approach for the fabrication of nanostructured materials is the utilization of nanochannel insulators as a matrix for the synthesis of dense composites using high pressure injection (HPI) of the semiconductor melt. We discuss the synthesis and structural properties of oriented Bi/sub 2/Te/sub 3/ nanowire arrays in Anopore porous alumina as well as random networks of Bi/sub 2/Te/sub 3/ nanocrystals. The trigonal Bi/sub 2/Te/sub 3/ crystallites that form the wire are oriented with the basal plane of the hexagonal plane, i.e., the plane of highest conductivity, along the wire length. Bi wire arrays are similarly oriented. This structural effect is directly a result of the processing using the HPI technique. Another implication of our results is that wire arrays have a higher figure of merit than random networks.
由于晶界和界面声子散射导致的声子热导率降低,传统热电材料的微工程化可能导致其热电性能的显著改善。在基本水平上,由于在低维系统中发生的态的电子密度的增加,复合性能图ZT可能比块体的复合性能图ZT显著增加。制备纳米结构材料的一种方法是利用纳米通道绝缘体作为基体,利用半导体熔体的高压注入(HPI)合成致密复合材料。讨论了定向Bi/sub - 2/Te/sub - 3/纳米线阵列的合成和结构性质,以及Bi/sub - 2/Te/sub - 3/纳米晶体的随机网络。形成线材的三角形Bi/sub 2/Te/sub 3/晶体沿线材长度取向于六方平面的基底面,即电导率最高的平面。双线阵列也是类似的。这种结构效应是使用HPI技术处理的直接结果。我们的结果的另一个含义是,线阵列具有比随机网络更高的价值数字。
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引用次数: 1
Preparation and thermoelectric properties of CoSb/sub 3/ thin films on GaAs(100) substrate GaAs(100)衬底CoSb/ sub3 /薄膜的制备及其热电性能
H. Anno, T. Sakakibara, Y. Notohara, H. Tashiro, T. Koyanagi, H. Kaneko, K. Matsubara
The thin film growth of CoSb/sub 3/ on a semi-insulating GaAs(100) substrate was made by using magnetron rf-sputtering, and the electrical and thermoelectric properties of the films were studied with relation to annealing temperature and film thickness. Polycrystalline films with the skutterudite structure were successfully grown on the GaAs(100) substrate. The obtained films were found to be p-type, and their hole mobility, electrical conductivity, and Seebeck coefficient significantly changed depending on the annealing temperature and the thickness. A huge Seebeck coefficient of 600 /spl mu/V/K, which is about three times as large as the value of a p-type single crystal, was obtained for a thin film annealed at 750/spl deg/C with thickness of 71 nm, and the power factor reached the value of 2/spl times/10/sup -4/ W/cm K/sup 2/. The variation in the thermoelectric properties with the annealing temperature and the thickness can be explained well in terms of a model which takes into account a carrier energy filtering effect by potential barriers at grain boundaries. According to the model, the Seebeck coefficient increases with increasing potential barrier height and also decreases with increasing carrier concentration.
采用磁控射频溅射技术在半绝缘GaAs(100)衬底上生长CoSb/ sub3 /薄膜,研究了薄膜的电学和热电性能与退火温度和薄膜厚度的关系。在GaAs(100)衬底上成功地生长出了具有方晶结构的多晶薄膜。所得薄膜为p型薄膜,其空穴迁移率、电导率和塞贝克系数随退火温度和厚度的变化而显著变化。对厚度为71 nm、温度为750/spl℃的薄膜进行退火处理,得到了600 /spl mu/V/K的巨大塞贝克系数,约为p型单晶的3倍,功率因数达到2/spl倍/10/sup -4/ W/cm K/sup 2/。热电性能随退火温度和厚度的变化可以用考虑晶界势垒载流子能量滤波效应的模型来解释。根据模型,塞贝克系数随势垒高度的增加而增大,随载流子浓度的增加而减小。
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引用次数: 9
Thermoelectric cascade for cryosurgical destroyer 用于冷冻驱逐舰的热电级联
T. Wartanowicz, A. Czarnecki
The paper is a continuation of our investigations on a thermoelectric cooling system for medical applications in cryosurgical destroyers. It concerns experimental analysis of a three-stage thermoelectric cascade based on Melcor modules. The experiments have been conducted for two working conditions: first-maximum temperature difference /spl Delta/T/sub max/ and the second-maximum cooling capacity Q/sub 0max/. The best obtained results are as follows: maximum temperature difference /spl Delta/T=115.5 K for supplying current I=3.1 A, maximum cooling capacity Q/sub 0/=8.05 W for supplying current I=2.8 A. Moreover the results have been applied to verify the method of numerical optimization of thermoelectric multistage systems elaborated in the framework of our previous research. That verification is in good agreement with the experimental results. The experiments have confirmed that the temperature of the cold side of the cascade can reach the level of 200 K (-73/spl deg/C) while the cooling capacity at the same time equals Q/sub 0/=1 W.
本文是我们对冷冻驱逐舰医学应用热电冷却系统研究的延续。研究了基于Melcor模块的三级热电级联的实验分析。实验采用两种工况:第一最大温差/spl Delta/T/sub max/和第二最大制冷量Q/sub 0max/。得到的最佳结果为:供电电流I=3.1 A时最大温差/spl Delta/T=115.5 K,供电电流I=2.8 A时最大制冷量Q/sub 0/=8.05 W。结果还验证了在前人研究框架内阐述的热电多级系统的数值优化方法。验证结果与实验结果吻合较好。实验证实,叶栅冷侧温度可达到200 K (-73/spl℃),同时制冷量为Q/sub 0/=1 W。
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引用次数: 1
Precise methods and equipment for thermoelectric cooling modules parameters measurement 热电冷却模块参数测量的精密方法和设备
L. Anatychuk, N. I. Varich, A. Shchedrin
The investigation results of thermal compensation systems for thermoelectric cooling modules parameters determination have been given. Thermoelectric thermal meters were used at heat balance sensors, stage thermoelectric batteries were used as compensating heat and cold sources. Methods and devices made it possible to determine parameters of thermoelectric cooling modules with increased accuracy.
给出了热电冷却模块参数确定的热补偿系统的研究结果。热平衡传感器采用热电式测温仪,级热电电池作为补偿冷热源。方法和设备使得确定热电冷却模块的参数具有更高的准确性。
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引用次数: 1
Preparation of iridium silicide thin films by means of electron beam evaporation 电子束蒸发法制备硅化铱薄膜
R. Kurt, W. Pitschke, A. Heinrich, J. Schumann, K. Wetzig
Iridium silicide thin films were prepared by means of electron beam evaporation. The deposition process was monitored by measuring the deposition rates using quartz-crystal oscillators and the temperature at the rear of the substrate. The film composition was determined by means of energy dispersive X-ray analysis (EDX). It changes systematically as a result of the geometric arrangement of the evaporators and of the substrate permitting the preparation of layers with continually varied range of stoichiometry during one deposition experiment. The structure of the layers becomes amorphous when the substrates temperature becomes lower than 373 K during deposition process. The impurity concentration of the layers was determined by means of mass spectrometry to be less than 600 at.-ppm which is about 2 orders of magnitude less than that of layers deposited by means of magnetron sputtering.
采用电子束蒸发法制备了硅化铱薄膜。通过测量石英晶体振荡器的沉积速率和衬底后部的温度来监测沉积过程。用能量色散x射线分析(EDX)测定了膜的成分。由于蒸发器和衬底的几何排列允许在一次沉积实验中制备具有连续变化的化学计量范围的层,因此它会系统地变化。在沉积过程中,当衬底温度低于373 K时,层的结构变为非晶态。用质谱法测定各层杂质浓度小于600 at。-ppm,比磁控溅射法沉积的层低约2个数量级。
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引用次数: 1
Thermoelectric properties of sintered Bi using plasma-treated powder 等离子体处理烧结铋的热电性能
Y. Lee, R. Isobe, M. Yomura, I. Nakamoto, T. Koyanagi
Sintered Bi was prepared by using the plasma-treated powder in order to improve their thermoelectric figure of merit. Surfaces of Bi raw powder were modified in the Ar, H/sub 2/, O/sub 2/ and SbCl/sub 3/ rf-plasmas prior to sintering, and Bi was sintered using the powder obtained by the spark plasma sintering. For Bi samples sintered using O/sub 2/ plasma-treated powder, the electrical conductivity /spl sigma/ was increased in spite of growth of Bi oxides, as compared with that of the untreated one. The increase in /spl sigma/ is attributed to the increase in the carrier concentration. As a result, the thermoelectric figure of merit at room temperature was improved 1.5 times as high as that of the untreated one. The improvement of thermoelectric properties of sintered Bi was observed also in the case of other gas plasma treatment.
利用等离子体处理后的粉末制备烧结铋,以提高其热电性能。烧结前在Ar、H/sub 2/、O/sub 2/和SbCl/sub 3/ rf等离子体中对Bi原料粉末进行表面改性,用火花等离子体烧结得到的粉末烧结Bi。对于用O/sub /等离子体处理的粉末烧结的Bi样品,与未处理的样品相比,尽管Bi氧化物的生长,但电导率/spl σ /有所提高。/spl σ /的增加归因于载流子浓度的增加。结果,室温下的热电优值比未处理的提高了1.5倍。在其他气体等离子体处理的情况下,烧结铋的热电性能也得到了改善。
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引用次数: 1
Semiconducting transition metal silicides: electronic structure, electrical and thermoelectrical properties 半导体过渡金属硅化物:电子结构、电学和热电性质
H. Lange, S. Brehme, W. Henrion, A. Heinrich, G. Behr, H. Griessmann, A. Filonov, V. E. Borisenko
The actual knowledge existing on electronic structure determinations for semiconducting transition metal silicides obtained from band structure calculations and investigations of optical interband spectra is reviewed. The emphasis is put on the information available for the semiconducting 3d transition metal silicides which is combined with recently gained experimental and theoretical data for the semiconducting 4d and 5d transition metal silicides. From band structure studies and optical investigations it is concluded that most semiconducting transition metal silicides are indirect-gap materials. An electrical data analysis indicates that all non-intentionally doped semiconducting silicides exhibit hole conduction with relatively high carrier concentrations even in epitaxial films and single crystals. The experimental electron to hole mobility ratios are less than unity, i.e. mobilities of electrons are usually much lower than those of holes. Effective masses seem to be /spl ges/1 free electron mass for most semiconducting silicides. The extensive work done on the electrical and thermoelectrical properties of semiconducting iron disilicide thin films and single crystals is considered in more detail.
评述了从带结构计算和带间光谱研究中获得的半导体过渡金属硅化物电子结构测定的实际知识。重点介绍了半导体三维过渡金属硅化物的现有信息,并结合了最近获得的半导体4d和5d过渡金属硅化物的实验和理论数据。从带结构研究和光学研究中得出结论,大多数半导体过渡金属硅化物是间接间隙材料。电学数据分析表明,即使在外延膜和单晶中,所有非故意掺杂的半导体硅化物也表现出相对较高载流子浓度的空穴导电。实验中电子与空穴的迁移率比小于1,即电子的迁移率通常远低于空穴的迁移率。对于大多数半导体硅化物,有效质量似乎是/spl /1自由电子质量。对半导体二硅化铁薄膜和单晶的电学和热电性质所做的大量工作进行了更详细的考虑。
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引用次数: 4
Fabrication of ternary iron disilicides as thermoelectric semiconductors by sintering using elemental powders 用元素粉末烧结制备三元二硅化铁热电半导体
Y. Ohta, S. Miura, Y. Mishima
Sintering process to fabricate iron disilicides with a fine grain structure is pursued using elemental powders as starting materials. Additions of Al to the binary Fe-Si system are attempted. This is because Al has a considerably lower melting point than Fe and Si and hence liquid Al phase would be involved upon sintering to help accelerate the reaction kinetics to form iron disilicides. Sintering of ternary iron disilicides is attempted also with additions of Co and Cu, the former being an n-type dopant while the latter might promote metal-to-semiconductor transition upon annealing after sintering. Effects of such additions are examined on the sintering kinetics, constituent phases in the products, and their thermoelectric properties. It is shown that fabrication of sintered iron disilicides using elemental powders becomes possible with Al additions, for which a mechanism of sintering in the Fe-Si-Al ternary system is proposed. Also a series of demonstrations is given for the changes in thermoelectric properties with difference in doping element.
以单质粉末为原料,采用烧结工艺制备了具有细晶粒结构的二硅化铁。尝试在二元铁硅体系中加入Al。这是因为Al的熔点比Fe和Si低得多,因此在烧结时,液态Al相将参与,以帮助加速反应动力学,形成二硅化铁。本文还尝试了Co和Cu的加入对三元二硅化铁的烧结,前者是n型掺杂剂,而后者在烧结后退火后可能促进金属向半导体的转变。研究了这些添加剂对烧结动力学、产物组成相及其热电性能的影响。结果表明,Al的加入使单质粉末烧结二硅化铁成为可能,并提出了Fe-Si-Al三元体系烧结的机理。并对不同掺杂元素对热电性能的影响进行了一系列的论证。
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引用次数: 0
期刊
XVI ICT '97. Proceedings ICT'97. 16th International Conference on Thermoelectrics (Cat. No.97TH8291)
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