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Electroless Nickel/Immersion Silver—A New Surface Finish PCB Applications 化学镀镍/浸银——一种新的表面处理PCB应用
Pub Date : 2013-01-01 DOI: 10.1016/S0026-0576(13)70171-5
Ernest Long Ph.D, Lenora Toscano

Electroless nickel/immersion gold (ENIG) has been the primary, high-performance surface finish used in the PCB industry for some decades now. Market research confirms that in terms of processed surface area per year, ENIG useage is second only to organic solderability preservatives (OSP) [1]. ENIG is typically described as a surface finish which is labor intensive to work with at the fabrication level, but its high-performance characteristics mitigates this fact to a great extent. Electroless nickel/immersion gold is designed to deliver a highly corrosion resistant and superior solderable surface. This finish is also commonly used for aluminum wire bond applications.

With significant volatility in precious metal pricing and the constant demand for better products at cheaper prices, original equipment manufacturers (OEM's) are being driven to search for ways to reduce cost whilst not sacrificing quality. The layer of gold metal on an ENIG-treated surface, although thin, adds a prohibitively high premium to the cost of this finish.

MacDermid has developed an electroless nickel/immersion silver (ENImAg) process that delivers the performance characteristics afforded by ENIG and eliminates the concern associated with the use of a high priced metal, such as gold. This change, from using gold to silver, also has the added benefit of eliminating a cyanide-containing process from the fabrication house. Applying, qualifying for and maintaining a cyanide license is a cost adder for the ENIG process.

This paper expands on the work conducted in 2010's “A New Surface Finish for the Electronics Industry [2].” Process flow and the associated chemical steps will be discussed to alleviate concerns of fabrication difficulties. This work will detail additional performance characterization and discuss the surface finish performance on a production scale. The test data presented will include solderability, tarnish and corrosion resistance, aluminum wire bonding and contact performance.

几十年来,化学镀镍/浸金(ENIG)一直是PCB行业中主要的高性能表面处理剂。市场研究证实,就每年的加工表面积而言,ENIG的使用量仅次于有机可焊性防腐剂(OSP)。ENIG通常被描述为在制造层面进行劳动密集型的表面处理,但其高性能特性在很大程度上减轻了这一事实。化学镀镍/浸金设计提供高度耐腐蚀和优越的可焊接表面。这种光洁度也通常用于铝线粘合应用。随着贵金属价格的大幅波动以及对以更低价格提供更好产品的持续需求,原始设备制造商(OEM)正在寻求在不牺牲质量的情况下降低成本的方法。在经过enigg处理的表面上的金金属层虽然很薄,但却增加了过高的溢价。MacDermid开发了一种化学镀镍/浸银(ENImAg)工艺,该工艺具有ENIG提供的性能特点,并消除了与使用高价金属(如黄金)相关的担忧。这种改变,从使用金到银,还有一个额外的好处,即从制造车间消除含氰过程。申请、认证和维护氰化物许可证是ENIG流程的成本增加因素。本文扩展了2010年“电子工业新表面处理b[2]”中进行的工作。将讨论工艺流程和相关的化学步骤,以减轻对制造困难的担忧。这项工作将详细说明其他性能表征,并讨论生产规模上的表面光洁度性能。测试数据将包括可焊性、光泽和耐腐蚀性、铝线粘合和接触性能。
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引用次数: 11
Finishers' Directory 终结者的目录
Pub Date : 2013-01-01 DOI: 10.1016/S0026-0576(13)70180-6
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引用次数: 0
New Developments in DC Acid Copper for Vertical Plating Tanks 立式镀槽用直流酸性铜的新进展
Pub Date : 2013-01-01 DOI: 10.1016/S0026-0576(13)70172-7
George Milad
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引用次数: 1
Zincate- or Stannate–Free Plating of Aluminum and its Alloys 铝及其合金的无锌或无锡电镀
Pub Date : 2013-01-01 DOI: 10.1016/S0026-0576(13)70173-9
John Bibber

For more than 80 years now the most generally accepted process for the preparation of aluminum and it alloys for plating has involved the use of a “zincate” or “stannate” processing solution. Environmental issues relative to the use of these processes are becoming more and more of a problem. The process itself is long and involved and will differ from one alloy to another. This article presents a much more environmentally acceptable alternative that is considerably easier to work with, gives far more consistent results and is more cost effective.

80多年来,制备电镀用铝及其合金的最普遍接受的工艺是使用“锌酸盐”或“锡酸盐”加工溶液。与使用这些过程有关的环境问题正日益成为一个问题。这个过程本身是漫长而复杂的,不同的合金也会有所不同。本文提出了一种更环保的可接受的替代方案,它更容易使用,结果更加一致,成本效益更高。
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引用次数: 0
‘Iron Clad’
Pub Date : 2013-01-01 DOI: 10.1016/S0026-0576(13)70175-2
Reginald Tucker
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引用次数: 0
Run Charts as a Test of System Performance 运行图作为系统性能的测试
Pub Date : 2012-11-01 DOI: 10.1016/S0026-0576(13)70191-0
L. Flott
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引用次数: 1
Upcoming Events 即将来临的事件
Pub Date : 2012-11-01 DOI: 10.1016/S0026-0576(13)70196-X
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引用次数: 0
Accelerated Corrosion Testing 加速腐蚀试验
Pub Date : 2012-11-01 DOI: 10.1016/S0026-0576(13)70186-7
Raymund Singleton
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引用次数: 0
How High Temperatures Affect Adhesives and Sealants 高温如何影响粘合剂和密封剂
Pub Date : 2012-11-01 DOI: 10.1016/S0026-0576(13)70189-2
E. Petrie
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引用次数: 0
Type “Industrial” First 先输入“工业”
Pub Date : 2012-11-01 DOI: 10.1016/S0026-0576(13)70190-9
John Durkee
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引用次数: 0
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Metal Finishing
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