We present a tunable acoustic absorbing system. Most of the conventional acoustic absorbers can absorb an only sound of a fixed frequency. We propose an acoustic absorbing system with a tunable compliance in order to absorb variable sounds. The developed system forms an array of Helmholtz resonators with a deep hole array by a X-ray lithography. Micro deep holes are effective at low frequency. The resonator has an air cavity whose volume is controllable so as to tune its resonant frequency to a desired frequency. This paper reports the characteristics of our developed acoustic absorbing system and our project status.
{"title":"Tunable acoustic absorber with micro deep hole array","authors":"M. Yoda, S. Sugiyama, S. Akishita, S. Konishi","doi":"10.1109/MHS.1998.745778","DOIUrl":"https://doi.org/10.1109/MHS.1998.745778","url":null,"abstract":"We present a tunable acoustic absorbing system. Most of the conventional acoustic absorbers can absorb an only sound of a fixed frequency. We propose an acoustic absorbing system with a tunable compliance in order to absorb variable sounds. The developed system forms an array of Helmholtz resonators with a deep hole array by a X-ray lithography. Micro deep holes are effective at low frequency. The resonator has an air cavity whose volume is controllable so as to tune its resonant frequency to a desired frequency. This paper reports the characteristics of our developed acoustic absorbing system and our project status.","PeriodicalId":190689,"journal":{"name":"MHA'98. Proceedings of the 1998 International Symposium on Micromechatronics and Human Science. - Creation of New Industry - (Cat. No.98TH8388)","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115265001","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Miniature motors are available in sizes as small as 1.9 mm in diameter by 10 mm in length. Position sensors have not yet been implemented in these small synchronous motors below 8 mm in diameter. Open-loop control is optimal with sine-wave driving electronics, but in this case the electronic box is far from being as small as the motor. Open-loop control, like for stepping motors is usually performed, and works well at high speed. This paper presents a pulse frequency modulation (PFM) technique that can be implemented with small microcontrollers and can significantly reduce the irregularities of movement at any speed. Analysing and measuring the rotation of these small motors is an interesting and difficult problem per se. Adequate test equipment is a requirement to evaluate both open-loop and future closed-loop control algorithms.
{"title":"Control and analysis of low inertia miniature synchronous motors","authors":"J. Nicoud, O. Matthley, G. Caprari","doi":"10.1109/MHS.1998.745757","DOIUrl":"https://doi.org/10.1109/MHS.1998.745757","url":null,"abstract":"Miniature motors are available in sizes as small as 1.9 mm in diameter by 10 mm in length. Position sensors have not yet been implemented in these small synchronous motors below 8 mm in diameter. Open-loop control is optimal with sine-wave driving electronics, but in this case the electronic box is far from being as small as the motor. Open-loop control, like for stepping motors is usually performed, and works well at high speed. This paper presents a pulse frequency modulation (PFM) technique that can be implemented with small microcontrollers and can significantly reduce the irregularities of movement at any speed. Analysing and measuring the rotation of these small motors is an interesting and difficult problem per se. Adequate test equipment is a requirement to evaluate both open-loop and future closed-loop control algorithms.","PeriodicalId":190689,"journal":{"name":"MHA'98. Proceedings of the 1998 International Symposium on Micromechatronics and Human Science. - Creation of New Industry - (Cat. No.98TH8388)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115424055","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The fabrication of high-power electrostatic microactuators by the LIGA process has been investigated. Advantages of electrostatic microactuators fabricated by the LIGA process are discussed. The basic structure of the microactuators was composed of movable and fixed electrodes of Ni, an isolation layer of SiO/sub 2/ and a Si substrate, which was fabricated by one mask process. As design rules, a minimum resist width of 2 /spl mu/m, resist height of 120 /spl mu/m, maximum width of movable parts of 10 /spl mu/m, minimum width of fixed parts of 40 /spl mu/m and driving voltage of about 100 V, were decided on. A 120 /spl mu/m-thick PMMA resist was formed on a Si substrate by a casting method. The PMMA was exposed using a compact SR source "AURORA", using an X-ray mask with 7 /spl mu/m-thick Au absorber on a 2 /spl mu/m-thick poly-Si membrane. The exposed PMMA was developed by GG developer. Ni microstructures with 100 /spl mu/m-height, 2 /spl mu/m-minimum width, maximum aspect ratio of 50, 2 /spl mu/m-minimum gap were made by electroforming. The average surface roughness of the PMMA microstructure's sidewall and Ni microstructure's sidewall were 9.4 nm and 23.1 nm, respectively. Ni microstructures used for movable electrodes were separated from the substrate by lateral etching of SiO/sub 2/.
{"title":"Study on fabrication of high aspect ratio electrostatic microactuators using LIGA process","authors":"R. Kondo, K. Suzuki, S. Sugiyama","doi":"10.1109/MHS.1998.745772","DOIUrl":"https://doi.org/10.1109/MHS.1998.745772","url":null,"abstract":"The fabrication of high-power electrostatic microactuators by the LIGA process has been investigated. Advantages of electrostatic microactuators fabricated by the LIGA process are discussed. The basic structure of the microactuators was composed of movable and fixed electrodes of Ni, an isolation layer of SiO/sub 2/ and a Si substrate, which was fabricated by one mask process. As design rules, a minimum resist width of 2 /spl mu/m, resist height of 120 /spl mu/m, maximum width of movable parts of 10 /spl mu/m, minimum width of fixed parts of 40 /spl mu/m and driving voltage of about 100 V, were decided on. A 120 /spl mu/m-thick PMMA resist was formed on a Si substrate by a casting method. The PMMA was exposed using a compact SR source \"AURORA\", using an X-ray mask with 7 /spl mu/m-thick Au absorber on a 2 /spl mu/m-thick poly-Si membrane. The exposed PMMA was developed by GG developer. Ni microstructures with 100 /spl mu/m-height, 2 /spl mu/m-minimum width, maximum aspect ratio of 50, 2 /spl mu/m-minimum gap were made by electroforming. The average surface roughness of the PMMA microstructure's sidewall and Ni microstructure's sidewall were 9.4 nm and 23.1 nm, respectively. Ni microstructures used for movable electrodes were separated from the substrate by lateral etching of SiO/sub 2/.","PeriodicalId":190689,"journal":{"name":"MHA'98. Proceedings of the 1998 International Symposium on Micromechatronics and Human Science. - Creation of New Industry - (Cat. No.98TH8388)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126887283","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
T. Yamamoto, H. Kotera, T. Hirasam, Y. Sakamoto, S. Shima
A diffusion layer, that is likely to be formed at the interface of the multilayered thin film, would affect its mechanical properties. The thinner the thin film, the more significant would be the effect. We measure the thickness of the diffusion layer at the vicinity of Al/SiO/sub 2/ and Al/Si wafer interfaces with the aid of Auger electron spectroscopy (AES). In this paper, we investigate the effect of heat treatment after fabrication of the thin films on the diffusion at these interfaces. We thereby estimate the thickness of the diffusion layer and discuss the effect of temperature on its thickness.
{"title":"A study of diffusion in layered thin film [MEMS]","authors":"T. Yamamoto, H. Kotera, T. Hirasam, Y. Sakamoto, S. Shima","doi":"10.1109/MHS.1998.745753","DOIUrl":"https://doi.org/10.1109/MHS.1998.745753","url":null,"abstract":"A diffusion layer, that is likely to be formed at the interface of the multilayered thin film, would affect its mechanical properties. The thinner the thin film, the more significant would be the effect. We measure the thickness of the diffusion layer at the vicinity of Al/SiO/sub 2/ and Al/Si wafer interfaces with the aid of Auger electron spectroscopy (AES). In this paper, we investigate the effect of heat treatment after fabrication of the thin films on the diffusion at these interfaces. We thereby estimate the thickness of the diffusion layer and discuss the effect of temperature on its thickness.","PeriodicalId":190689,"journal":{"name":"MHA'98. Proceedings of the 1998 International Symposium on Micromechatronics and Human Science. - Creation of New Industry - (Cat. No.98TH8388)","volume":"44 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123372423","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
An explicit equation which describes the strain-resistance relation, so-called elastoresistance, has been derived by means of piezoresistance and elastic coefficients. Typical examples of elastoresistance coefficients for p-Si have been calculated and illustrated as a function of crystal orientations in the principal crystal planes. The strain sensitivity of semiconductive piezoresistor and its dependence on the crystal orientation has been obtained from the illustration. As examples, a single transducer for a biaxial strain measurement and shear strain transducer have been explained. The optimum crystal plane and orientation for this purpose have been discussed.
{"title":"Crystal anisotropy of elastoresistance effect of semiconductive piezoresistor and its application to transducers","authors":"T. Toriyama, S. Sugiyama","doi":"10.1109/MHS.1998.745779","DOIUrl":"https://doi.org/10.1109/MHS.1998.745779","url":null,"abstract":"An explicit equation which describes the strain-resistance relation, so-called elastoresistance, has been derived by means of piezoresistance and elastic coefficients. Typical examples of elastoresistance coefficients for p-Si have been calculated and illustrated as a function of crystal orientations in the principal crystal planes. The strain sensitivity of semiconductive piezoresistor and its dependence on the crystal orientation has been obtained from the illustration. As examples, a single transducer for a biaxial strain measurement and shear strain transducer have been explained. The optimum crystal plane and orientation for this purpose have been discussed.","PeriodicalId":190689,"journal":{"name":"MHA'98. Proceedings of the 1998 International Symposium on Micromechatronics and Human Science. - Creation of New Industry - (Cat. No.98TH8388)","volume":"31 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114343828","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
We present a drastically advanced microstereolithography named "Super IH process". The most unique feature of this process is that liquid UV (Ultra Violet) polymer can be solidified at a pinpoint position in 3D space by optimizing apparatus and focusing condition of the laser beam. This pinpoint exposure enables us to make a real 3D microstructure without any support parts or sacrificial layers. Therefore freely movable micromechanisms such as gear rotators and free connected chains can be made easily. Moreover, several problems which conventional microstereolithography has are completely solved. Submicron fabrication resolution was achieved by simple desk top apparatus. Since total fabrication time of the super IH process is extremely fast, it is easy to apply to mass production 3D microfabrication process.
{"title":"New microstereolithography (Super-IH process) to create 3D freely movable micromechanism without sacrificial layer technique","authors":"S. Maruo, K. Ikuta","doi":"10.1109/MHS.1998.745760","DOIUrl":"https://doi.org/10.1109/MHS.1998.745760","url":null,"abstract":"We present a drastically advanced microstereolithography named \"Super IH process\". The most unique feature of this process is that liquid UV (Ultra Violet) polymer can be solidified at a pinpoint position in 3D space by optimizing apparatus and focusing condition of the laser beam. This pinpoint exposure enables us to make a real 3D microstructure without any support parts or sacrificial layers. Therefore freely movable micromechanisms such as gear rotators and free connected chains can be made easily. Moreover, several problems which conventional microstereolithography has are completely solved. Submicron fabrication resolution was achieved by simple desk top apparatus. Since total fabrication time of the super IH process is extremely fast, it is easy to apply to mass production 3D microfabrication process.","PeriodicalId":190689,"journal":{"name":"MHA'98. Proceedings of the 1998 International Symposium on Micromechatronics and Human Science. - Creation of New Industry - (Cat. No.98TH8388)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130159053","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Micro SMA (shape memory alloy) thin film is a good material for a microactuator of a micromachine on silicone wafer, because of it merits: i) low driving voltage, ii) big force per volume and weight, iii) faster response compared to bulk SMA actuator. However there is a problem in fabricating micro SMA thin film actuator on silicone wafer; that is, how to prestrain automatically. We propose to use polyimide that shrinks to about one-half of the original size following heat treatment as a material to prestrain SMA thin films. Trial productions of bending type SMA thin film actuators were made. This actuator curls at room temperature and becomes straight at a high temperature of about 80/spl deg/C.
{"title":"A new micro SMA thin film actuator prestrained by polyimide","authors":"K. Kuribayashi, T. Fujii","doi":"10.1109/MHS.1998.745775","DOIUrl":"https://doi.org/10.1109/MHS.1998.745775","url":null,"abstract":"Micro SMA (shape memory alloy) thin film is a good material for a microactuator of a micromachine on silicone wafer, because of it merits: i) low driving voltage, ii) big force per volume and weight, iii) faster response compared to bulk SMA actuator. However there is a problem in fabricating micro SMA thin film actuator on silicone wafer; that is, how to prestrain automatically. We propose to use polyimide that shrinks to about one-half of the original size following heat treatment as a material to prestrain SMA thin films. Trial productions of bending type SMA thin film actuators were made. This actuator curls at room temperature and becomes straight at a high temperature of about 80/spl deg/C.","PeriodicalId":190689,"journal":{"name":"MHA'98. Proceedings of the 1998 International Symposium on Micromechatronics and Human Science. - Creation of New Industry - (Cat. No.98TH8388)","volume":"522 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122821567","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This paper describes two processes for the microstructuring of carbide and boride cermets by laser microcladding/selective sintering using a pulsed Nd:YAG laser. The first part deals with the microcladding of carbide cermet [Cr/sub 3/C/sub 2/-NiCr] with varying percentage content of metal carbide [Cr/sub 3/C/sub 2/]. The results show that as the metal carbide content decreased from 70% to 50% of its value; cracks are reduced but the hardness decreased considerably. The second part discusses the selective laser sintering of boride cermets. The results show that liquid phase sintering seems to be more effective, in which the metallic part NiMo acts as a binder to the metal boride counterpart [(MoW)/sub 2/NiB/sub 2/]. From the microstructure analysis it appears that the Ni-Mo metal has formed a film on the boride resulting in agglomeration of the particles.
{"title":"Laser microstructuring of composite powder materials","authors":"Y. Kathuria","doi":"10.1109/MHS.1998.745758","DOIUrl":"https://doi.org/10.1109/MHS.1998.745758","url":null,"abstract":"This paper describes two processes for the microstructuring of carbide and boride cermets by laser microcladding/selective sintering using a pulsed Nd:YAG laser. The first part deals with the microcladding of carbide cermet [Cr/sub 3/C/sub 2/-NiCr] with varying percentage content of metal carbide [Cr/sub 3/C/sub 2/]. The results show that as the metal carbide content decreased from 70% to 50% of its value; cracks are reduced but the hardness decreased considerably. The second part discusses the selective laser sintering of boride cermets. The results show that liquid phase sintering seems to be more effective, in which the metallic part NiMo acts as a binder to the metal boride counterpart [(MoW)/sub 2/NiB/sub 2/]. From the microstructure analysis it appears that the Ni-Mo metal has formed a film on the boride resulting in agglomeration of the particles.","PeriodicalId":190689,"journal":{"name":"MHA'98. Proceedings of the 1998 International Symposium on Micromechatronics and Human Science. - Creation of New Industry - (Cat. No.98TH8388)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116036351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
We have been developing micromachine technologies under a Japanese national project. In this paper, our automotive and non-automotive applications of the micromachine technology is discussed, and our micromachine technology development under the project is described.
{"title":"Micromachine technology development and its applications","authors":"S. Akita","doi":"10.1109/MHS.1998.745745","DOIUrl":"https://doi.org/10.1109/MHS.1998.745745","url":null,"abstract":"We have been developing micromachine technologies under a Japanese national project. In this paper, our automotive and non-automotive applications of the micromachine technology is discussed, and our micromachine technology development under the project is described.","PeriodicalId":190689,"journal":{"name":"MHA'98. Proceedings of the 1998 International Symposium on Micromechatronics and Human Science. - Creation of New Industry - (Cat. No.98TH8388)","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115303578","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Millimeter size machines based on modern precision machining have various potential applications. Especially in case of a small pipe, it necessary to develop a new type of micro robot to carry an edgy current detector or CCD-camera for inspection of internal defects. Hence we attempted to design a new type of micro robot for small pipes. The dimensions of the prototype are /spl Phi/15/spl times/30 mm and the weight is 25 g. According to an experiment, it was shown this robot can climb in pipe of 20 mm diameter with a speed of about 6-8 mm/s in horizontal or in vertical under an applied voltage 12-20 volt, 30-70 Hz. This paper describes the structure and the principle of the motion of the robot.
{"title":"Micro robot in small pipe with electromagnetic actuator","authors":"Linzhi Sun, P. Sun, Xin-jie Qin, Cun-min Wang","doi":"10.1109/MHS.1998.745789","DOIUrl":"https://doi.org/10.1109/MHS.1998.745789","url":null,"abstract":"Millimeter size machines based on modern precision machining have various potential applications. Especially in case of a small pipe, it necessary to develop a new type of micro robot to carry an edgy current detector or CCD-camera for inspection of internal defects. Hence we attempted to design a new type of micro robot for small pipes. The dimensions of the prototype are /spl Phi/15/spl times/30 mm and the weight is 25 g. According to an experiment, it was shown this robot can climb in pipe of 20 mm diameter with a speed of about 6-8 mm/s in horizontal or in vertical under an applied voltage 12-20 volt, 30-70 Hz. This paper describes the structure and the principle of the motion of the robot.","PeriodicalId":190689,"journal":{"name":"MHA'98. Proceedings of the 1998 International Symposium on Micromechatronics and Human Science. - Creation of New Industry - (Cat. No.98TH8388)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1998-11-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125738327","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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