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2019 IEEE/ACM International Conference on Technical Debt (TechDebt)最新文献

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Supporting Analysis of Technical Debt Causes and Effects with Cross-Company Probabilistic Cause-Effect Diagrams 基于跨公司概率因果关系图的技术债务因果分析
Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00009
Nicolli Rios, R. Spínola, Manoel G. Mendonça, C. Seaman
Understanding TD causes can support development teams in defining actions that could be taken to prevent the occurrence of debt items. Understanding the effects of TD could aid in prioritization of TD items to pay off to minimize possible negative consequences for the project. Existing work has revealed 105 causes and 85 effects of TD, and this high number can make it difficult to make practical use of this information. Without a consolidated representation, we would need to rely on a set of tables and isolated pieces of data. In this work, we propose the use of cross-company probabilistic cause-effect diagrams to represent information about TD causes and effects. We hypothesize that such diagrams can be useful to support TD cause/effect analysis sessions and empirically investigate this issue. Results from a case study performed with 72 participants indicate that the diagrams are able to positively support the management of TD, making it easier to identify its causes and the effects of its presence. Most of the participants also agreed that, by using the proposed diagrams, they gain agility, productivity, performance, and effectiveness. Finally, 89% of the participants stated that the use of the diagrams helped them to identify causes and effects of TD that they would not have identified without their support.
了解开发开发的原因可以帮助开发团队确定可以采取的行动,以防止债务项目的发生。了解输配电的影响可以帮助对输配电项目进行优先排序,从而最大限度地减少对项目可能产生的负面影响。现有的工作已经揭示了TD的105个原因和85个结果,这个高数字可能使实际使用这些信息变得困难。如果没有统一的表示,我们将需要依赖一组表和孤立的数据块。在这项工作中,我们建议使用跨公司的概率因果图来表示TD的因果信息。我们假设这样的图表对于支持TD的因果分析会议和实证调查这个问题是有用的。对72名参与者进行的案例研究的结果表明,图表能够积极地支持TD的管理,使其更容易确定其存在的原因和影响。大多数参与者还同意,通过使用建议的图,他们获得了敏捷性、生产力、性能和有效性。最后,89%的参与者表示,图表的使用帮助他们确定了TD的原因和结果,如果没有他们的支持,他们将无法确定这些原因和结果。
{"title":"Supporting Analysis of Technical Debt Causes and Effects with Cross-Company Probabilistic Cause-Effect Diagrams","authors":"Nicolli Rios, R. Spínola, Manoel G. Mendonça, C. Seaman","doi":"10.1109/TechDebt.2019.00009","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00009","url":null,"abstract":"Understanding TD causes can support development teams in defining actions that could be taken to prevent the occurrence of debt items. Understanding the effects of TD could aid in prioritization of TD items to pay off to minimize possible negative consequences for the project. Existing work has revealed 105 causes and 85 effects of TD, and this high number can make it difficult to make practical use of this information. Without a consolidated representation, we would need to rely on a set of tables and isolated pieces of data. In this work, we propose the use of cross-company probabilistic cause-effect diagrams to represent information about TD causes and effects. We hypothesize that such diagrams can be useful to support TD cause/effect analysis sessions and empirically investigate this issue. Results from a case study performed with 72 participants indicate that the diagrams are able to positively support the management of TD, making it easier to identify its causes and the effects of its presence. Most of the participants also agreed that, by using the proposed diagrams, they gain agility, productivity, performance, and effectiveness. Finally, 89% of the participants stated that the use of the diagrams helped them to identify causes and effects of TD that they would not have identified without their support.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"255 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129047940","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 35
A Proposed Model-Driven Approach to Manage Architectural Technical Debt Life Cycle 一种管理架构技术债务生命周期的模型驱动方法
Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00025
B. Pérez, D. Correal, H. Astudillo
Architectural Technical Debt (ATD) is a metaphor used to describe consciously decisions taken by software architects to accomplish short-term goals but possibly negatively affecting the long-term health of the system. However, difficulties arise when repayment strategies are defined because software architects need to be aware of the consequences of these strategies over others decisions in the software architecture. This article proposes REBEL, a semi-automated model-driven approach that exploits natural language processing, machine learning and model checking techniques on heterogeneous project artifacts to build a model that allows to locate and visualize the impact produced by the consciously injected ATD and its repayment strategy on the other architectural decisions. The technique is illustrated with a data analytics project in Colombia where software architects are unaware of the consequences of the repayment strategies. This proposal seeks to support teams of architects to make explicit the current and future impact of the ATD injected as a result of decisions taken, focusing on the architectural level rather than code level.
架构技术债务(ATD)是一个比喻,用来描述软件架构师为实现短期目标而做出的有意识的决定,但可能会对系统的长期健康产生负面影响。然而,当定义偿还策略时,困难就出现了,因为软件架构师需要意识到这些策略对软件架构中其他决策的影响。本文提出了REBEL,这是一种半自动化的模型驱动方法,它利用自然语言处理、机器学习和异质项目工件的模型检查技术来构建一个模型,该模型允许定位和可视化有意识注入的ATD及其偿还策略对其他架构决策产生的影响。该技术以哥伦比亚的一个数据分析项目为例,其中软件架构师没有意识到偿还策略的后果。本提案旨在支持架构师团队明确指出由于所做决策而注入的ATD对当前和未来的影响,重点放在架构级别而不是代码级别。
{"title":"A Proposed Model-Driven Approach to Manage Architectural Technical Debt Life Cycle","authors":"B. Pérez, D. Correal, H. Astudillo","doi":"10.1109/TechDebt.2019.00025","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00025","url":null,"abstract":"Architectural Technical Debt (ATD) is a metaphor used to describe consciously decisions taken by software architects to accomplish short-term goals but possibly negatively affecting the long-term health of the system. However, difficulties arise when repayment strategies are defined because software architects need to be aware of the consequences of these strategies over others decisions in the software architecture. This article proposes REBEL, a semi-automated model-driven approach that exploits natural language processing, machine learning and model checking techniques on heterogeneous project artifacts to build a model that allows to locate and visualize the impact produced by the consciously injected ATD and its repayment strategy on the other architectural decisions. The technique is illustrated with a data analytics project in Colombia where software architects are unaware of the consequences of the repayment strategies. This proposal seeks to support teams of architects to make explicit the current and future impact of the ATD injected as a result of decisions taken, focusing on the architectural level rather than code level.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126851101","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
TDMentions: A Dataset of Technical Debt Mentions in Online Posts TDMentions:在线帖子中提到的技术债务数据集
Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00031
Morgan Ericsson, Anna Wingkvist
The term technical debt is easy to understand as a metaphor, but can quickly grow complex in practice. We contribute with a dataset, TDMentions, that enables researchers to study how developers and end users use the term technical debt in online posts and discussions. The dataset consists of posts from news aggregators and Q&A-sites, blog posts, and issues and commits on GitHub.
技术债务这个术语作为隐喻很容易理解,但在实践中可能很快变得复杂。我们提供了一个数据集,TDMentions,使研究人员能够研究开发人员和最终用户如何在在线帖子和讨论中使用术语技术债务。该数据集包括来自新闻聚合器和问答网站的文章、博客文章以及GitHub上的问题和提交。
{"title":"TDMentions: A Dataset of Technical Debt Mentions in Online Posts","authors":"Morgan Ericsson, Anna Wingkvist","doi":"10.1109/TechDebt.2019.00031","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00031","url":null,"abstract":"The term technical debt is easy to understand as a metaphor, but can quickly grow complex in practice. We contribute with a dataset, TDMentions, that enables researchers to study how developers and end users use the term technical debt in online posts and discussions. The dataset consists of posts from news aggregators and Q&A-sites, blog posts, and issues and commits on GitHub.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125857918","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
How (not ) to Remove Technical Debt in Testing Environments 如何(不)消除测试环境中的技术债务
Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00008
Valentin Guerlesquin
All software systems, from new developments to legacy systems, suffer from test automation backlogs, i.e., manual tests that stagnate the rate of development and innovation. I argue that such backlogs are really technical debt. I expose here six behavior that may ruin your goal to remove test automation technical debt.
所有的软件系统,从新的开发到遗留系统,都受到测试自动化积压的困扰,也就是说,手工测试会使开发和创新的速度停滞不前。我认为这样的积压实际上是技术债务。我在这里列出了六种可能破坏您消除测试自动化技术债务目标的行为。
{"title":"How (not ) to Remove Technical Debt in Testing Environments","authors":"Valentin Guerlesquin","doi":"10.1109/TechDebt.2019.00008","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00008","url":null,"abstract":"All software systems, from new developments to legacy systems, suffer from test automation backlogs, i.e., manual tests that stagnate the rate of development and innovation. I argue that such backlogs are really technical debt. I expose here six behavior that may ruin your goal to remove test automation technical debt.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125246033","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Lessons from the Exponential Growth of Refactoring Research in the Last Decade 过去十年重构研究的指数级增长的经验教训
Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00020
Danny Dig
In the last decade refactoring research has seen exponential growth. I will attempt to map this vast landscape and the advances that the community has made by answering questions such as who does what, when, where, why, and how. I will muse on some of the factors contributing to the growth of the field (e.g., refactoring the definition of refactoring to include other artifacts besides source code), the adoption of research into industry, and the lessons that we learned along this journey. This talk will present the value of prioritizing the important tasks, yet often the difficult ones. Several cases studies will show that everything worth doing is uphill all the way. This will inspire and equip you so that you can make a difference, with people who make a difference, at a time when it makes a difference.
在过去的十年里,重构研究呈指数级增长。我将尝试通过回答诸如谁在做什么、何时、何地、为什么以及如何做等问题来描绘这一广阔的图景和社区取得的进步。我将仔细考虑一些促成该领域发展的因素(例如,重构重构的定义,以包括源代码以外的其他工件),将研究成果应用到行业中,以及我们在此过程中学到的经验教训。这个演讲将展示优先处理重要任务的价值,但往往是困难的任务。几个案例研究将表明,所有值得做的事情都是一路向上的。这将激励你,装备你,使你能够有所作为,与有作为的人,在有作为的时候有所作为。
{"title":"Lessons from the Exponential Growth of Refactoring Research in the Last Decade","authors":"Danny Dig","doi":"10.1109/TechDebt.2019.00020","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00020","url":null,"abstract":"In the last decade refactoring research has seen exponential growth. I will attempt to map this vast landscape and the advances that the community has made by answering questions such as who does what, when, where, why, and how. I will muse on some of the factors contributing to the growth of the field (e.g., refactoring the definition of refactoring to include other artifacts besides source code), the adoption of research into industry, and the lessons that we learned along this journey. This talk will present the value of prioritizing the important tasks, yet often the difficult ones. Several cases studies will show that everything worth doing is uphill all the way. This will inspire and equip you so that you can make a difference, with people who make a difference, at a time when it makes a difference.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"238 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134108006","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
DV8: Automated Architecture Analysis Tool Suites DV8:自动化架构分析工具套件
Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00015
Yuanfang Cai, R. Kazman
This paper present our tool suite called DV8. The objective of DV8 is to measure software modularity, detect architecture anti-patterns as technical debts, quantify the maintenance cost of each instance of an anti-pattern, and enable return on investment analyses of architectural debts. Different from other tools, DV8 integrates data from both source code and revision history. We now elaborate on each of DV8's capabilities
本文介绍了我们的工具套件DV8。DV8的目标是度量软件模块化,检测作为技术债务的体系结构反模式,量化每个反模式实例的维护成本,并支持对体系结构债务进行投资分析的回报。与其他工具不同,DV8集成了来自源代码和修订历史的数据。现在我们详细介绍DV8的每一项功能
{"title":"DV8: Automated Architecture Analysis Tool Suites","authors":"Yuanfang Cai, R. Kazman","doi":"10.1109/TechDebt.2019.00015","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00015","url":null,"abstract":"This paper present our tool suite called DV8. The objective of DV8 is to measure software modularity, detect architecture anti-patterns as technical debts, quantify the maintenance cost of each instance of an anti-pattern, and enable return on investment analyses of architectural debts. Different from other tools, DV8 integrates data from both source code and revision history. We now elaborate on each of DV8's capabilities","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132910213","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 13
Silverthread CodeMRI Care 银线代码 MRI 护理
Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00019
Daniel J. Sturtevant
Silverthread CodeMRI Care and Technical Health Improvement Plan is a collection of tools designed to produce objective architectural measurement and actionable improvement. These tools have been successfully applied within a DoD development environment wherein a small team was able to measurably improve the architectural health and software economic outcomes of their codebase within months.
Silverthread CodeMRI护理和技术健康改进计划是一个工具集合,旨在产生客观的架构测量和可操作的改进。这些工具已经成功地应用于DoD开发环境中,其中一个小团队能够在几个月内显著地改善其代码库的架构健康和软件经济结果。
{"title":"Silverthread CodeMRI Care","authors":"Daniel J. Sturtevant","doi":"10.1109/TechDebt.2019.00019","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00019","url":null,"abstract":"Silverthread CodeMRI Care and Technical Health Improvement Plan is a collection of tools designed to produce objective architectural measurement and actionable improvement. These tools have been successfully applied within a DoD development environment wherein a small team was able to measurably improve the architectural health and software economic outcomes of their codebase within months.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134086785","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Delta Maintainability Model: Measuring Maintainability of Fine-Grained Code Changes 增量可维护性模型:测量细粒度代码更改的可维护性
Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00030
M. D. Biase, Ayushi Rastogi, M. Bruntink, A. Deursen
Existing maintainability models are used to identify technical debt of software systems. Targeting entire codebases, such models lack the ability to determine shortcomings of smaller, fine-grained changes. This paper proposes a new maintainability model – the Delta Maintainability Model (DMM) – to measure fine-grained code changes, such as commits, by adapting and extending the SIG Maintainability Model. DMM categorizes changed lines of code into low and high risk, and then uses the proportion of low risk change to calculate a delta score. The goal of the DMM is twofold: first, producing meaningful and actionable scores; second, compare and rank the maintainability of fine-grained modifications. We report on an initial study of the model, with the goal of understanding if the adapted measurements from the SIG Maintainability Model suit the fine-grained scope of the DMM. In a manual inspection process for 100 commits, 67 cases matched the expert judgment. Furthermore, we report an exploratory empirical study on a data set of DMM scores on 3,017 issue-fixing commits of four open source and four closed source systems. Results show that the scores of DMM can be used to compare and rank commits, providing developers with a means to do root cause analysis on activities that impacted maintainability and, thus, address technical debt at a finer granularity.
现有的可维护性模型用于识别软件系统的技术债务。针对整个代码库,这种模型缺乏确定较小的、细粒度更改的缺点的能力。本文提出了一个新的可维护性模型——Delta可维护性模型(DMM)——通过适应和扩展SIG可维护性模型来度量细粒度的代码更改,比如提交。DMM将更改的代码行分为低风险和高风险,然后使用低风险更改的比例来计算增量分数。DMM的目标有两个:第一,产生有意义和可操作的分数;其次,对细粒度修改的可维护性进行比较和排序。我们报告了对模型的初步研究,目的是了解来自SIG可维护性模型的适应度量是否适合DMM的细粒度范围。在100个提交的人工检查过程中,有67个案例符合专家的判断。此外,我们报告了一项探索性实证研究,该研究对四个开源和四个闭源系统的3,017个问题修复提交的DMM分数数据集进行了研究。结果表明,DMM的分数可以用于比较和对提交进行排序,为开发人员提供了一种方法,可以对影响可维护性的活动进行根本原因分析,从而在更细的粒度上处理技术债务。
{"title":"The Delta Maintainability Model: Measuring Maintainability of Fine-Grained Code Changes","authors":"M. D. Biase, Ayushi Rastogi, M. Bruntink, A. Deursen","doi":"10.1109/TechDebt.2019.00030","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00030","url":null,"abstract":"Existing maintainability models are used to identify technical debt of software systems. Targeting entire codebases, such models lack the ability to determine shortcomings of smaller, fine-grained changes. This paper proposes a new maintainability model – the Delta Maintainability Model (DMM) – to measure fine-grained code changes, such as commits, by adapting and extending the SIG Maintainability Model. DMM categorizes changed lines of code into low and high risk, and then uses the proportion of low risk change to calculate a delta score. The goal of the DMM is twofold: first, producing meaningful and actionable scores; second, compare and rank the maintainability of fine-grained modifications. We report on an initial study of the model, with the goal of understanding if the adapted measurements from the SIG Maintainability Model suit the fine-grained scope of the DMM. In a manual inspection process for 100 commits, 67 cases matched the expert judgment. Furthermore, we report an exploratory empirical study on a data set of DMM scores on 3,017 issue-fixing commits of four open source and four closed source systems. Results show that the scores of DMM can be used to compare and rank commits, providing developers with a means to do root cause analysis on activities that impacted maintainability and, thus, address technical debt at a finer granularity.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"42 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132893836","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 18
How Deep is the Mud: Fathoming Architecture Technical Debt Using Designite 泥沼有多深:使用Designite分析架构技术债务
Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00018
Tushar Sharma
The quality of software architecture is an important concern for any software development team. Architecture smells represent quality issues at architecture granularity. Identifying and refactoring them periodically is a necessity to keep architecture quality high. We present Designite, a software design quality assessment tool, that identifies seven well-known architecture smells. Along with the identification, the tool provides supplementary information such as cause and responsible classes for each identified smell instance to help developers understand and refactor the smell. The tool is relevant and useful in both research and practice context. Software developers may use it to identify technical debt instances and to refactor them. On the other hand, software engineering researchers may use the tool to carry out large-scale empirical studies concerning code smells.
软件架构的质量对于任何软件开发团队来说都是一个重要的关注点。架构气味代表架构粒度上的质量问题。定期识别和重构它们是保持体系结构高质量的必要条件。我们介绍Designite,一个软件设计质量评估工具,它可以识别七种众所周知的建筑气味。除了识别之外,该工具还为每个识别的气味实例提供了补充信息,例如原因和负责类,以帮助开发人员理解和重构气味。该工具在研究和实践背景下都是相关和有用的。软件开发人员可以使用它来识别技术债务实例并对其进行重构。另一方面,软件工程研究人员可以使用该工具进行有关代码气味的大规模实证研究。
{"title":"How Deep is the Mud: Fathoming Architecture Technical Debt Using Designite","authors":"Tushar Sharma","doi":"10.1109/TechDebt.2019.00018","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00018","url":null,"abstract":"The quality of software architecture is an important concern for any software development team. Architecture smells represent quality issues at architecture granularity. Identifying and refactoring them periodically is a necessity to keep architecture quality high. We present Designite, a software design quality assessment tool, that identifies seven well-known architecture smells. Along with the identification, the tool provides supplementary information such as cause and responsible classes for each identified smell instance to help developers understand and refactor the smell. The tool is relevant and useful in both research and practice context. Software developers may use it to identify technical debt instances and to refactor them. On the other hand, software engineering researchers may use the tool to carry out large-scale empirical studies concerning code smells.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133573303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 8
Teamscale: Tackle Technical Debt and Control the Quality of Your Software 团队规模:处理技术债务并控制软件质量
Pub Date : 2019-05-26 DOI: 10.1109/TechDebt.2019.00016
Roman Haas, Rainer Niedermayr, Elmar Jürgens
Teamscale is a software intelligence platform, that is, it creates transparency on code quality and the underlying software development process. This makes it possible for developers, testers and managers to better understand and control technical debt of their systems. In this paper, we give an overview of Teamscale and how this tool can be used in practice to control and lower technical debt in the long run. We explain which code analyses can be used to identify and address technical debt. Teamscale is available for free for research and teaching purposes at www.teamscale.io.
Teamscale是一个软件智能平台,也就是说,它创建了代码质量和底层软件开发过程的透明度。这使得开发人员、测试人员和管理人员能够更好地理解和控制他们系统的技术债务。在本文中,我们给出了Teamscale的概述,以及如何在实践中使用这个工具来控制和降低长期的技术债务。我们解释了哪些代码分析可以用来识别和处理技术债务。Teamscale可以在www.teamscale.io上免费获得,用于研究和教学目的。
{"title":"Teamscale: Tackle Technical Debt and Control the Quality of Your Software","authors":"Roman Haas, Rainer Niedermayr, Elmar Jürgens","doi":"10.1109/TechDebt.2019.00016","DOIUrl":"https://doi.org/10.1109/TechDebt.2019.00016","url":null,"abstract":"Teamscale is a software intelligence platform, that is, it creates transparency on code quality and the underlying software development process. This makes it possible for developers, testers and managers to better understand and control technical debt of their systems. In this paper, we give an overview of Teamscale and how this tool can be used in practice to control and lower technical debt in the long run. We explain which code analyses can be used to identify and address technical debt. Teamscale is available for free for research and teaching purposes at www.teamscale.io.","PeriodicalId":197657,"journal":{"name":"2019 IEEE/ACM International Conference on Technical Debt (TechDebt)","volume":"17 3","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-05-26","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114110144","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 9
期刊
2019 IEEE/ACM International Conference on Technical Debt (TechDebt)
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