A simple chain-extension reaction using diisocyanate as a chain extender was adopted to increase the molecular weight of low-molecular-weight (LMW) poly(lactic acid) (PLA) synthesized via direct polycondensation and to recover the molecular weight of commercial PLA after service life. The slow reaction between diisocyanate and the carboxylic acid terminus of PLA was successfully accelerated using a Mg(II) catalyst, affording a linear chain-extended PLA (cePLA) connected through amide bonds. To increase the number of amide bonds, which exhibit higher thermal stability than the urethane bonds that are formed in the more common chain-extension reactions between isocyanates and the hydroxy terminus of PLA, a telechelic LMW-PLA having carboxylic acid groups at both termini was prepared. Subsequent reaction of this LMW-PLA with diisocyanate in the presence of a Mg(II) catalyst afforded a cePLA with high molecular weight (Mw > 180 × 103 g/mol) and enhanced stability against thermal degradation, while showing identical mechanical properties and biodegradability as commercial PLA.
{"title":"Diisocyanate-based chain extension via Mg(II) catalyzed amide formation to high-molecular-weight poly(lactic acid)","authors":"Nobuyuki Kawashima, Shin-ichi Usugi, Ryohei Ogawa","doi":"10.1002/pol.20230284","DOIUrl":"https://doi.org/10.1002/pol.20230284","url":null,"abstract":"<p>A simple chain-extension reaction using diisocyanate as a chain extender was adopted to increase the molecular weight of low-molecular-weight (LMW) poly(lactic acid) (PLA) synthesized via direct polycondensation and to recover the molecular weight of commercial PLA after service life. The slow reaction between diisocyanate and the carboxylic acid terminus of PLA was successfully accelerated using a Mg(II) catalyst, affording a linear chain-extended PLA (cePLA) connected through amide bonds. To increase the number of amide bonds, which exhibit higher thermal stability than the urethane bonds that are formed in the more common chain-extension reactions between isocyanates and the hydroxy terminus of PLA, a telechelic LMW-PLA having carboxylic acid groups at both termini was prepared. Subsequent reaction of this LMW-PLA with diisocyanate in the presence of a Mg(II) catalyst afforded a cePLA with high molecular weight (M<sub>w</sub> > 180 × 10<sup>3</sup> g/mol) and enhanced stability against thermal degradation, while showing identical mechanical properties and biodegradability as commercial PLA.</p>","PeriodicalId":199,"journal":{"name":"Journal of Polymer Science Part A: Polymer Chemistry","volume":"61 20","pages":"2506-2513"},"PeriodicalIF":2.702,"publicationDate":"2023-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41229756","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Currently, there is limited literature on the introduction of naphthalene ring into phthalonitrile. In this study, we have successfully synthesized a novel phthalonitrile monomer (CPND) by incorporating a symmetrical rigid naphthalene ring structure, long flexible chains, and high-density cyano groups into the resin. The monomer is being cured with two different agents and procedures to investigate the impact of curing agent structure and ramp-up procedure on polymer properties. The structure of the monomer is being verified using nuclear magnetic resonance (NMR), infrared spectroscopy (FTIR), and wide-angle X-ray diffraction (WAXD). Differential scanning calorimetry (DSC) results reveal that the monomer has a low melting point of 111°C, making it easily processable. After mixing with the curing agent in the appropriate proportion, it has a calculated processing window of 129–135°C. Thermogravimetric analysis (TGA) reveals that the polymers exhibit remarkable thermal stability, with all T5% above 470°C under a nitrogen atmosphere. Additionally, the results obtained from dynamic mechanical analysis (DMA) indicate that the polymer, which is cured using APPH as a curing agent, displays favorable thermo-mechanical properties. The storage modulus of the polymers at room temperature is all higher than 3330 MPa, respectively. Moreover, the glass transition temperature is found to be higher than 400°C, signifying the excellent thermo-mechanical properties of the polymer.
{"title":"Structural design and synthesis of naphthalene-containing phthalonitrile polymer with excellent processability and high temperature properties","authors":"Zhiyi Jia, Xinyang Zhang, Xinyang Wang, Tao Zhao, Xinggang Chen, Minjie Wu, Jianxin Rong, Dianqiu Jia, Xiaoyan Yu, Qingxin Zhang","doi":"10.1002/pol.20230295","DOIUrl":"https://doi.org/10.1002/pol.20230295","url":null,"abstract":"<p>Currently, there is limited literature on the introduction of naphthalene ring into phthalonitrile. In this study, we have successfully synthesized a novel phthalonitrile monomer (CPND) by incorporating a symmetrical rigid naphthalene ring structure, long flexible chains, and high-density cyano groups into the resin. The monomer is being cured with two different agents and procedures to investigate the impact of curing agent structure and ramp-up procedure on polymer properties. The structure of the monomer is being verified using nuclear magnetic resonance (NMR), infrared spectroscopy (FTIR), and wide-angle X-ray diffraction (WAXD). Differential scanning calorimetry (DSC) results reveal that the monomer has a low melting point of 111°C, making it easily processable. After mixing with the curing agent in the appropriate proportion, it has a calculated processing window of 129–135°C. Thermogravimetric analysis (TGA) reveals that the polymers exhibit remarkable thermal stability, with all <i>T</i><sub>5%</sub> above 470°C under a nitrogen atmosphere. Additionally, the results obtained from dynamic mechanical analysis (DMA) indicate that the polymer, which is cured using APPH as a curing agent, displays favorable thermo-mechanical properties. The storage modulus of the polymers at room temperature is all higher than 3330 MPa, respectively. Moreover, the glass transition temperature is found to be higher than 400°C, signifying the excellent thermo-mechanical properties of the polymer.</p>","PeriodicalId":199,"journal":{"name":"Journal of Polymer Science Part A: Polymer Chemistry","volume":"61 19","pages":"2292-2302"},"PeriodicalIF":2.702,"publicationDate":"2023-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"41085105","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Emerging researchers interview—Junpeng Wang, The University of Akron","authors":"","doi":"10.1002/pol.20230487","DOIUrl":"https://doi.org/10.1002/pol.20230487","url":null,"abstract":"","PeriodicalId":199,"journal":{"name":"Journal of Polymer Science Part A: Polymer Chemistry","volume":"61 15","pages":"1545-1546"},"PeriodicalIF":2.702,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://onlinelibrary.wiley.com/doi/epdf/10.1002/pol.20230487","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"6066703","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-08-01eCollection Date: 2023-12-01DOI: 10.1002/ped4.12393
S M D K Ganga Senarathna, Tobias Strunk, Michael Petrovski, Sarah Woodland, Kevin T Batty
{"title":"Physicochemical compatibility of pentoxifylline injection with high-concentration parenteral medications.","authors":"S M D K Ganga Senarathna, Tobias Strunk, Michael Petrovski, Sarah Woodland, Kevin T Batty","doi":"10.1002/ped4.12393","DOIUrl":"10.1002/ped4.12393","url":null,"abstract":"","PeriodicalId":199,"journal":{"name":"Journal of Polymer Science Part A: Polymer Chemistry","volume":"57 16","pages":"263-267"},"PeriodicalIF":1.9,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10693661/pdf/","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"72409052","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
The cover image was created by Tianmin Cao and Xun Wang. The blue background with radio waves indicates the high frequency telecommunication era. Important functional groups including the pyridine ring, imide ring, tert-butyl, and amide bond are displayed in the upper left corner with concentric circles, indicating the cooperative synergistic effects of these functional groups. The backbone of polyimide films is highlighted with hydrogen bonding, and the films' potential application in chips and flexible circuits are illustrated in image bottom. (DOI: 10.1002/pol.20230217)