Pub Date : 2023-05-31DOI: 10.7317/pk.2023.47.3.361
H. Hwangbo, Hyun-Woo Kim, Soon-Hoon Kwon, S. Jeon
{"title":"Reinforcing Resins with Fumed Silica for DLP 3D Printing of Abrasion-resistant Parts","authors":"H. Hwangbo, Hyun-Woo Kim, Soon-Hoon Kwon, S. Jeon","doi":"10.7317/pk.2023.47.3.361","DOIUrl":"https://doi.org/10.7317/pk.2023.47.3.361","url":null,"abstract":"","PeriodicalId":20349,"journal":{"name":"Polymer Korea","volume":"43 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"81426436","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-31DOI: 10.7317/pk.2023.47.3.354
Minguen Kim, Chang S. Park, N. Jo
: In order to increase the thermal conductivity of the heat dissipation material, it is necessary to increase the content of alumina, a thermally conductive ceramic filler, and a typical heat dissipation material forms a continuous heat transfer path when the filler content is 50 wt% or more. However, as the content of the ceramic filler increases, the tensile strength of the heat dissipation material decreases, which is an obstacle to commercialization and market expansion. Therefore, in this study, a continuous heat transfer path was formed by selectively dispersing a thermally conductive filler using polystyrene-poly(methyl methacrylate) diblock copolymer and adding carbon nanotubes to an extent capable of maintaining electrical insulation to act as a heat transfer bridge between ceramic fillers. In the end, an electrically insulating heat dissipation material with improved thermal conductivity and tensile strength was manufactured by increasing the heat transfer efficiency of the thermally conductive ceramic filler to form a continuous heat transfer path even when the filler content is 50 wt% or less.
{"title":"Heat Dissipation Material with Alumina Selectively Dispersed Using PS-PMMA Diblock Copolymer","authors":"Minguen Kim, Chang S. Park, N. Jo","doi":"10.7317/pk.2023.47.3.354","DOIUrl":"https://doi.org/10.7317/pk.2023.47.3.354","url":null,"abstract":": In order to increase the thermal conductivity of the heat dissipation material, it is necessary to increase the content of alumina, a thermally conductive ceramic filler, and a typical heat dissipation material forms a continuous heat transfer path when the filler content is 50 wt% or more. However, as the content of the ceramic filler increases, the tensile strength of the heat dissipation material decreases, which is an obstacle to commercialization and market expansion. Therefore, in this study, a continuous heat transfer path was formed by selectively dispersing a thermally conductive filler using polystyrene-poly(methyl methacrylate) diblock copolymer and adding carbon nanotubes to an extent capable of maintaining electrical insulation to act as a heat transfer bridge between ceramic fillers. In the end, an electrically insulating heat dissipation material with improved thermal conductivity and tensile strength was manufactured by increasing the heat transfer efficiency of the thermally conductive ceramic filler to form a continuous heat transfer path even when the filler content is 50 wt% or less.","PeriodicalId":20349,"journal":{"name":"Polymer Korea","volume":"219 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-05-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"89378553","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-05-25DOI: 10.7317/pk.2023.47.3.257
Atlıhan Gökmen
{"title":"Investigation on Wear Behavior of PETG and PLA Parts Fabricated with Fused Deposition Modelling Under Different Wear Conditions","authors":"Atlıhan Gökmen","doi":"10.7317/pk.2023.47.3.257","DOIUrl":"https://doi.org/10.7317/pk.2023.47.3.257","url":null,"abstract":"","PeriodicalId":20349,"journal":{"name":"Polymer Korea","volume":"48 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-05-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"73911205","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-31DOI: 10.7317/pk.2023.47.2.212
Hyeon-Gyeong Oh, Do-Hyun Kim, Sang-Ho Cha, Sang-Bum Kim
{"title":"Facile Preparation and Characterization of Transparent Polyurethane Using Eugenol-Based Bio-Polyol via Thiol-ene Reaction","authors":"Hyeon-Gyeong Oh, Do-Hyun Kim, Sang-Ho Cha, Sang-Bum Kim","doi":"10.7317/pk.2023.47.2.212","DOIUrl":"https://doi.org/10.7317/pk.2023.47.2.212","url":null,"abstract":"","PeriodicalId":20349,"journal":{"name":"Polymer Korea","volume":"11 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"77110389","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-31DOI: 10.7317/pk.2023.47.2.181
Seo Y. Park, Thi Phuc Le, Hye-Eun Shim, Sun-Woong Kang, K. Huh
{"title":"Preparation and Characterization of Blend Thermogel System for Biomedical Applications","authors":"Seo Y. Park, Thi Phuc Le, Hye-Eun Shim, Sun-Woong Kang, K. Huh","doi":"10.7317/pk.2023.47.2.181","DOIUrl":"https://doi.org/10.7317/pk.2023.47.2.181","url":null,"abstract":"","PeriodicalId":20349,"journal":{"name":"Polymer Korea","volume":"46 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"83105450","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-31DOI: 10.7317/pk.2023.47.2.171
Su-Bin Park, Won-Yong Jeon, Young-Bong Choi
{"title":"Electrochemical Glucose Sensing by Using Glucose Dehydrogenase Enzyme and the Synthesized Poly-ruthenium Mediator","authors":"Su-Bin Park, Won-Yong Jeon, Young-Bong Choi","doi":"10.7317/pk.2023.47.2.171","DOIUrl":"https://doi.org/10.7317/pk.2023.47.2.171","url":null,"abstract":"","PeriodicalId":20349,"journal":{"name":"Polymer Korea","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"91554926","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-31DOI: 10.7317/pk.2023.47.2.233
S. Choe, S. Kim, Se-Eun Kim, S. Kim, J. Seo, Sunja Park, J. Song, G. Khang
{"title":"Gellan Gum/Polyvinyl Alcohol Hydrogels with Stress Relaxation Property for Application as Retinal Pigment Epithelial Cell Carrier","authors":"S. Choe, S. Kim, Se-Eun Kim, S. Kim, J. Seo, Sunja Park, J. Song, G. Khang","doi":"10.7317/pk.2023.47.2.233","DOIUrl":"https://doi.org/10.7317/pk.2023.47.2.233","url":null,"abstract":"","PeriodicalId":20349,"journal":{"name":"Polymer Korea","volume":"1 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"88705595","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-31DOI: 10.7317/pk.2023.47.2.164
Eun-Jin Jang, Youn-Cheol Kim
{"title":"Study on the Crystallization Behavior and Rheological Properties of Nylon 6/Expanded Graphite Composites","authors":"Eun-Jin Jang, Youn-Cheol Kim","doi":"10.7317/pk.2023.47.2.164","DOIUrl":"https://doi.org/10.7317/pk.2023.47.2.164","url":null,"abstract":"","PeriodicalId":20349,"journal":{"name":"Polymer Korea","volume":"27 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"80322814","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-03-31DOI: 10.7317/pk.2023.47.2.221
R. Ragupathy, T. S. Kumar, S. Vishvanathperumal
{"title":"Effect of Halloysite Nanotubes (HNTs) on Mechanical Properties of EPDM/NBR Blend-Nanocomposites","authors":"R. Ragupathy, T. S. Kumar, S. Vishvanathperumal","doi":"10.7317/pk.2023.47.2.221","DOIUrl":"https://doi.org/10.7317/pk.2023.47.2.221","url":null,"abstract":"","PeriodicalId":20349,"journal":{"name":"Polymer Korea","volume":"154 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"86294812","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
京公网安备 11010802042870号
京ICP备2023020795号-1
扫码关注我们
求助内容：
应助结果提醒方式：