Pub Date : 2015-11-23DOI: 10.1109/3DIC.2015.7334470
S. Iyer
{"title":"Invited talk: Some challenges in scaling 3D ICs to a broader application set","authors":"S. Iyer","doi":"10.1109/3DIC.2015.7334470","DOIUrl":"https://doi.org/10.1109/3DIC.2015.7334470","url":null,"abstract":"","PeriodicalId":256498,"journal":{"name":"IEEE International Conference on 3D System Integration","volume":"7 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123038020","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-11-23DOI: 10.1109/3DIC.2015.7334554
R. Patti
{"title":"Invited talk: Progress in 3D integrated circuits","authors":"R. Patti","doi":"10.1109/3DIC.2015.7334554","DOIUrl":"https://doi.org/10.1109/3DIC.2015.7334554","url":null,"abstract":"","PeriodicalId":256498,"journal":{"name":"IEEE International Conference on 3D System Integration","volume":"326 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115764899","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2015-11-23DOI: 10.1109/3DIC.2015.7334561
T. Ogita
{"title":"Invited talk: Technology and overview of Sony's 3D stacked CMOS image sensor","authors":"T. Ogita","doi":"10.1109/3DIC.2015.7334561","DOIUrl":"https://doi.org/10.1109/3DIC.2015.7334561","url":null,"abstract":"","PeriodicalId":256498,"journal":{"name":"IEEE International Conference on 3D System Integration","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2015-11-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133681095","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 1900-01-01DOI: 10.1109/3DIC.2012.6263027
M. H. Jabbar, D. Houzet, O. Hammami
{"title":"3D multiprocessor with 3D NoC architecture based on Tezzaron technology","authors":"M. H. Jabbar, D. Houzet, O. Hammami","doi":"10.1109/3DIC.2012.6263027","DOIUrl":"https://doi.org/10.1109/3DIC.2012.6263027","url":null,"abstract":"","PeriodicalId":256498,"journal":{"name":"IEEE International Conference on 3D System Integration","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130037077","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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