{"title":"Interconnections and Connectors","authors":"P. Lall, M. Pecht","doi":"10.1201/9781315214085-5","DOIUrl":"https://doi.org/10.1201/9781315214085-5","url":null,"abstract":"","PeriodicalId":298078,"journal":{"name":"Handbook of Electronic Package Design","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130167294","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Layout","authors":"M. Osterman, Michael G. Pecht","doi":"10.1201/9781315214085-6","DOIUrl":"https://doi.org/10.1201/9781315214085-6","url":null,"abstract":"","PeriodicalId":298078,"journal":{"name":"Handbook of Electronic Package Design","volume":"5 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122559290","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Design for Vibration and Shock","authors":"D. B. Barker","doi":"10.1201/9781315214085-9","DOIUrl":"https://doi.org/10.1201/9781315214085-9","url":null,"abstract":"","PeriodicalId":298078,"journal":{"name":"Handbook of Electronic Package Design","volume":"51 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121280422","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-10-24DOI: 10.1201/9781315214085-10
M. Pecht
{"title":"Humidity and Corrosion Analysis and Design","authors":"M. Pecht","doi":"10.1201/9781315214085-10","DOIUrl":"https://doi.org/10.1201/9781315214085-10","url":null,"abstract":"","PeriodicalId":298078,"journal":{"name":"Handbook of Electronic Package Design","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116049562","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-10-24DOI: 10.1201/9781315214085-12
J. Y. Evans, J. Evans
{"title":"Electronic Materials and Properties","authors":"J. Y. Evans, J. Evans","doi":"10.1201/9781315214085-12","DOIUrl":"https://doi.org/10.1201/9781315214085-12","url":null,"abstract":"","PeriodicalId":298078,"journal":{"name":"Handbook of Electronic Package Design","volume":"48 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122398623","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Electronic Assemblies","authors":"D. B. Harris","doi":"10.1201/9781315214085-4","DOIUrl":"https://doi.org/10.1201/9781315214085-4","url":null,"abstract":"","PeriodicalId":298078,"journal":{"name":"Handbook of Electronic Package Design","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129477763","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Printed Wiring Board Design and Fabrication","authors":"D. B. Harris, P. Lall","doi":"10.1201/9781315214085-3","DOIUrl":"https://doi.org/10.1201/9781315214085-3","url":null,"abstract":"","PeriodicalId":298078,"journal":{"name":"Handbook of Electronic Package Design","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122959627","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Thermal Design Analysis","authors":"Dennis K. Karr, M. Palmer, D. Dancer","doi":"10.1201/9781315214085-7","DOIUrl":"https://doi.org/10.1201/9781315214085-7","url":null,"abstract":"","PeriodicalId":298078,"journal":{"name":"Handbook of Electronic Package Design","volume":"47 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117154702","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Electronic Components","authors":"D. B. Harris, M. Pecht, P. Lall","doi":"10.1063/1.3061158","DOIUrl":"https://doi.org/10.1063/1.3061158","url":null,"abstract":"","PeriodicalId":298078,"journal":{"name":"Handbook of Electronic Package Design","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-10-24","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122661023","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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