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Essence of Integrated Circuits and Packaging Design 集成电路与封装设计的本质
Electronic Packaging Science and Technology
Pub Date : 2021-12-17 DOI: 10.1002/9781119418344.ch6
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引用次数: 0
Artificial Intelligence in Electronic Packaging Reliability 电子封装可靠性中的人工智能
Electronic Packaging Science and Technology
Pub Date : 2021-12-17 DOI: 10.1002/9781119418344.ch14
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引用次数: 0
Electromigration 电迁移
Electronic Packaging Science and Technology
Pub Date : 2021-12-17 DOI: 10.1002/9781119418344.ch10
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引用次数: 1
Performance, Power, Thermal, and Reliability 性能，功率，热和可靠性
Electronic Packaging Science and Technology
Pub Date : 2021-12-17 DOI: 10.1002/9781119418344.ch7
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引用次数: 0
Solid‐State Reactions Between Copper and Solder 铜和焊料之间的固态反应
Electronic Packaging Science and Technology
Pub Date : 2021-12-17 DOI: 10.1002/9781119418344.ch5
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引用次数: 0
Cu‐to‐Cu and Other Bonding Technologies in Electronic Packaging 电子封装中的Cu - to - Cu和其他键合技术
Electronic Packaging Science and Technology
Pub Date : 2021-12-17 DOI: 10.1002/9781119418344.ch2
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引用次数: 0
Solid–Liquid Interfacial Diffusion Reaction (SLID) Between Copper and Solder 铜和焊料之间的固液界面扩散反应(slide)
Electronic Packaging Science and Technology
Pub Date : 2021-12-17 DOI: 10.1002/9781119418344.ch4
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引用次数: 0
Randomly‐Oriented and (111) Uni‐directionally‐Oriented Nanotwin Copper 随机取向和(111)单向取向纳米孪晶铜
Electronic Packaging Science and Technology
Pub Date : 2021-12-17 DOI: 10.1002/9781119418344.ch3
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引用次数: 0
Irreversible Processes in Electronic Packaging Technology 电子封装技术中的不可逆过程
Electronic Packaging Science and Technology
Pub Date : 2021-12-17 DOI: 10.1002/9781119418344.ch9
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引用次数: 0
Failure Analysis 失效分析
Electronic Packaging Science and Technology
Pub Date : 2021-12-17 DOI: 10.1002/9781119418344.ch13
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引用次数: 0
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