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Tri-band Dual Substrate Aperture Coupled Microstrip Antenna for C, X, and Ku Band Applications 三波段双基片孔径耦合微带天线C, X,和Ku波段应用
Pub Date : 2023-01-26 DOI: 10.58399/gtmx8376
Jasmine Vijithra Ayyappan, Milton Arulappan, Beno Austin Dharma Raj
The design work presents a triple Y-fed dual substrate aperture coupled microstrip antenna that operates in C, X, and Ku bands. The overall dimension of the antenna is 50*40*1.894 mm. The antenna has four layers with two dissimilar substrates. A unique triple Y-structured feed line connected to a quarter-wave transformer forms the first layer of the design and shows a greater impact on impedance matching. A superimposed modified defected ground structure is sandwiched between two dissimilar substrates, FR4 and RT5880. The FR4 substrate is placed above the triple Y feed structure over which superimposed DGS is placed to obtain enhanced bandwidth. The third layer is formed by placing the second substrate RT5880 above the ground plane. The dielectric constant of the lower substrate is considered higher than the upper substrate to avoid undesired radiations at unwanted frequencies. A patch with three rectangular slots is placed over the RT5880 substrate for having tri-band characteristics. The patch is excited effectively through the slots in the ground plane thereby enhancing the coupling between the patch and the feed resulting in maximum radiation of RF energy. With this, an enhanced bandwidth of 12.66%, 16.67%, and 7.19% in all three bands is attained. Besides, the proposed design has a gain of 3.265 dBi at the C band, 3.305 dBi at the X band, and 4.385 dBi at the Ku band. The fabricated antenna is tested and the results are compared for both simulated and measured values. The results emphasize that a tri-band antenna can be used effectively in operating frequencies including the 5G wireless application band.
本设计提出了一种工作在C、X和Ku波段的三重y馈电双基片孔径耦合微带天线。天线的外形尺寸为50*40*1.894 mm。天线有四层,有两个不同的衬底。连接到四分之一波变压器的独特三y结构馈线构成了设计的第一层,对阻抗匹配有更大的影响。在两个不同的衬底FR4和RT5880之间夹了一个叠加的改进缺陷接地结构。FR4基板置于三重Y馈电结构之上,在该馈电结构上放置叠加DGS以获得增强带宽。通过将第二基板RT5880置于地平面上方形成第三层。下部衬底的介电常数被认为比上部衬底高,以避免在不需要的频率下产生不希望的辐射。具有三个矩形槽的贴片放置在RT5880基板上,以具有三带特性。贴片通过地平面中的槽有效地激发,从而增强了贴片与馈线之间的耦合,从而产生最大的射频能量辐射。这样,在所有三个频带中获得了12.66%,16.67%和7.19%的增强带宽。此外,该设计在C波段增益为3.265 dBi,在X波段增益为3.305 dBi,在Ku波段增益为4.385 dBi。对制作的天线进行了测试,并对模拟值和实测值进行了比较。结果强调,三波段天线可以有效地用于包括5G无线应用频段在内的工作频率。
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JOURNAL OF HIGH-FREQUENCY COMMUNICATION TECHNOLOGIES
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