J. Pavio
{"title":"RF Package Design and Development","authors":"J. Pavio","doi":"10.1201/9781420039979-13","DOIUrl":"https://doi.org/10.1201/9781420039979-13","url":null,"abstract":"","PeriodicalId":347017,"journal":{"name":"Commercial Wireless Circuits and Components Handbook","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2003-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128761997","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0