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STT MRAM Development and Its Integration with BEOL Process for Embedded Applications 嵌入式应用的STT MRAM开发及其与BEOL工艺的集成
Pub Date : 2012-06-04 DOI: 10.1149/ma2012-02/37/2814
T. Sugii, Y. Iba, M. Aoki, H. Noshiro, K. Tsunoda, A. Hatada, M. Nakabayashi, Y. Yamazaki, A. Takahashi, C. Yoshida
Introduction In this paper, we report the current status of our spintransfer torque magnetic RAM (STT-MRAM) development and its integration with the BEOL process for embedded applications with 300-mm facilities. Our STT-MRAM technology for low power dissipation features a top-pinned magnetic tunnel junction (MTJ), strain-engineering, and a naturally oxidized MgO barrier. Our integration technology features highly selective etching with triple-level resist, Ta hard mask, and a selfaligned contact process. We integrated our MRAM into 300-mm BEOL, where the MTJ is integrated between Cu interconnects. These features are described below.
在本文中,我们报告了我们的自旋传递扭矩磁性RAM (STT-MRAM)的开发现状及其与嵌入式应用300毫米设备BEOL工艺的集成。我们的STT-MRAM低功耗技术具有顶钉磁隧道结(MTJ),应变工程和自然氧化MgO势垒。我们的集成技术具有高选择性蚀刻,具有三级抗蚀剂,硬掩膜和自对齐接触工艺。我们将MRAM集成到300mm BEOL中,其中MTJ集成在Cu互连之间。这些特性描述如下。
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引用次数: 1
A Complementary Half-Swing Bus Architecture and its Application for Wide Band SRAM Macro 一种互补半摆总线结构及其在宽带SRAM宏中的应用
Pub Date : 1997-10-16 DOI: 10.1049/IP-CDS:19982269
Y. Nakase, A. Iwabu, Kondo Harufusa, K. Mashiko, Y. Matsuda, T. Tokuda
A complementary half-swing bus architecture is proposed for high speed and low power operation. The bus is composed of pairs of lines. The bus operates with three steps every cycle. In the first two steps, both bus lines within a pair are set at a half of the supply voltage. In the last step, each bus level is determined independently according to their data whether it is driven to the supply voltage or ground level, or remains unchanged. Then, each bus line swings the upper or lower half of the supply voltage exclusively. This simple architecture is able to transfer data in mutual direction at higher speed without an area penalty. It is applied to an SRAM macro with 112-bit bus for an ATM switch LSI. The 84 K-bit macro is fabricated in an area of 3.5 mm/spl times/4.2 mm with a 0.5 /spl mu/m CMOS process technology. Experimental results indicate that it operates beyond 200 MHz at the supply voltage of 3.3 V. From a cross-talk consideration, the cross-talk works such as to enlarge the operation margin. Simulation results show that the worst case power dissipation and the peak current due to simultaneous switching are reduced by half and by 66%, respectively, compared with full swing architectures.
提出了一种互补的半摆总线结构,用于高速低功耗运行。公共汽车由几对线路组成。公共汽车每循环三步运行。在前两个步骤中,一对内的两条母线都设置为电源电压的一半。最后一步,各母线电平根据各自的数据独立确定是被驱动到电源电压还是地电平,还是保持不变。然后,每条母线只振荡电源电压的上半部分或下半部分。这种简单的体系结构能够以更高的速度在相互方向上传输数据,而不会造成面积损失。该方法应用于ATM交换机LSI的112位总线SRAM宏。84 k位宏是在3.5 mm/spl倍/4.2 mm的面积上用0.5 /spl mu/m的CMOS工艺技术制造的。实验结果表明,在3.3 V电源电压下,其工作频率可达200 MHz以上。从相声的角度考虑,相声作品如能扩大经营边际。仿真结果表明,与全摆幅结构相比,最坏情况下的功耗和同时开关引起的峰值电流分别降低了一半和66%。
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引用次数: 2
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Technical report of IEICE. ICD
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