Shuo Yin, Wenqian Zhao, Li Xie, Hong Chen, Yuzhe Ma, Tsung-Yi Ho, Bei Yu
{"title":"FuILT: Full Chip ILT System With Boundary Healing","authors":"Shuo Yin, Wenqian Zhao, Li Xie, Hong Chen, Yuzhe Ma, Tsung-Yi Ho, Bei Yu","doi":"10.1145/3626184.3633315","DOIUrl":"https://doi.org/10.1145/3626184.3633315","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"117 16","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140285094","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Unified 3D-IC Multi-Chiplet System Design Solution","authors":"Wang-Tyng Lay","doi":"10.1145/3626184.3635279","DOIUrl":"https://doi.org/10.1145/3626184.3635279","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"95 6","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140285125","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"PANEL: EDA Challenges at Advanced Technology Nodes B","authors":"Guang-Wan Liao","doi":"10.1145/3626184.3639699","DOIUrl":"https://doi.org/10.1145/3626184.3639699","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"68 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140284766","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Satisfiability Modulo Theories-Based Qubit Mapping for Trapped-Ion Quantum Computing Systems","authors":"Wei-Hsiang Tseng, Yao-Wen Chang, J. Jiang","doi":"10.1145/3626184.3633329","DOIUrl":"https://doi.org/10.1145/3626184.3633329","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"223 1","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140284785","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Large Language Models for EDA: Future or Mirage?","authors":"Zhuolun He, Bei Yu","doi":"10.1145/3626184.3639700","DOIUrl":"https://doi.org/10.1145/3626184.3639700","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"14 2","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140284949","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
J. Choy, Stéphane Moreau, Catherine Brunet-Manquat, V. Sukharev, A. Kteyan
{"title":"Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects","authors":"J. Choy, Stéphane Moreau, Catherine Brunet-Manquat, V. Sukharev, A. Kteyan","doi":"10.1145/3626184.3635284","DOIUrl":"https://doi.org/10.1145/3626184.3635284","url":null,"abstract":"","PeriodicalId":517596,"journal":{"name":"Proceedings of the 2024 International Symposium on Physical Design","volume":"11 2","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-03-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140284736","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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