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Physical Adversarial Example in Car Plate Recognition Systems based on SA Algorithm 基于 SA 算法的车牌识别系统中的物理对抗示例
IF 4.5 4区 计算机科学 Q1 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-08-13 DOI: 10.1109/mce.2024.3442451
Jiang-Yi Zeng, Fan-Hsun Tseng, Chee-Wei Tan
{"title":"Physical Adversarial Example in Car Plate Recognition Systems based on SA Algorithm","authors":"Jiang-Yi Zeng, Fan-Hsun Tseng, Chee-Wei Tan","doi":"10.1109/mce.2024.3442451","DOIUrl":"https://doi.org/10.1109/mce.2024.3442451","url":null,"abstract":"","PeriodicalId":54330,"journal":{"name":"IEEE Consumer Electronics Magazine","volume":null,"pages":null},"PeriodicalIF":4.5,"publicationDate":"2024-08-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142196727","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
CTSOC Technical Talks CTSOC 技术讲座
IF 4.5 4区 计算机科学 Q1 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-08-06 DOI: 10.1109/mce.2024.3430671
{"title":"CTSOC Technical Talks","authors":"","doi":"10.1109/mce.2024.3430671","DOIUrl":"https://doi.org/10.1109/mce.2024.3430671","url":null,"abstract":"","PeriodicalId":54330,"journal":{"name":"IEEE Consumer Electronics Magazine","volume":null,"pages":null},"PeriodicalIF":4.5,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141947328","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE CEM: Call for Research & Review Articles IEEE CEM:征集研究和评论文章
IF 4.5 4区 计算机科学 Q1 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-08-06 DOI: 10.1109/mce.2024.3430683
{"title":"IEEE CEM: Call for Research & Review Articles","authors":"","doi":"10.1109/mce.2024.3430683","DOIUrl":"https://doi.org/10.1109/mce.2024.3430683","url":null,"abstract":"","PeriodicalId":54330,"journal":{"name":"IEEE Consumer Electronics Magazine","volume":null,"pages":null},"PeriodicalIF":4.5,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141947319","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Dear IEEE CTSoc Members 尊敬的 IEEE CTSoc 成员
IF 4.5 4区 计算机科学 Q1 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-08-06 DOI: 10.1109/mce.2024.3430668
{"title":"Dear IEEE CTSoc Members","authors":"","doi":"10.1109/mce.2024.3430668","DOIUrl":"https://doi.org/10.1109/mce.2024.3430668","url":null,"abstract":"","PeriodicalId":54330,"journal":{"name":"IEEE Consumer Electronics Magazine","volume":null,"pages":null},"PeriodicalIF":4.5,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141947330","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Consumer Technology Driving Future Industrial Advancements 消费技术推动未来工业进步
IF 4.5 4区 计算机科学 Q1 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-08-06 DOI: 10.1109/mce.2024.3422768
Norbert Herencsar
I welcome the readers to the fifth issue of the year 2024, the September/October issue of the IEEE Consumer Electronics Magazine (MCE).
欢迎读者阅读 2024 年第五期,即 IEEE 消费电子杂志(MCE)9/10 月刊。
{"title":"Consumer Technology Driving Future Industrial Advancements","authors":"Norbert Herencsar","doi":"10.1109/mce.2024.3422768","DOIUrl":"https://doi.org/10.1109/mce.2024.3422768","url":null,"abstract":"I welcome the readers to the fifth issue of the year 2024, the September/October issue of the IEEE Consumer Electronics Magazine (MCE).","PeriodicalId":54330,"journal":{"name":"IEEE Consumer Electronics Magazine","volume":null,"pages":null},"PeriodicalIF":4.5,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141947326","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Stefan G. Mozar Received 2024 IEEE Richard M. Emberson Award Stefan G. Mozar 荣获 2024 年度电气和电子工程师学会理查德-M-恩伯森奖
IF 4.5 4区 计算机科学 Q1 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-08-06 DOI: 10.1109/mce.2024.3423528
Wen-Chung Kao
In 1986, the Board of Directors established the IEEE Richard M. Emberson Award. The Award is named in honor of Dr. Richard M. Emberson, whose 23-year association with the Institute at both the staff and volunteer levels, including the Director of Technical Services, the Executive Director and the General Manager, and a Member of the Board of Directors, exemplified loyal and dedicated service to the Institute, especially its technical activities.
1986 年,董事会设立了 "电气和电子工程师学会理查德-恩伯森奖"。该奖项是为了纪念理查德-M-恩伯森博士,他在研究所工作了 23 年,担任过技术服务总监、执行董事、总经理和董事会成员等职务,既是工作人员也是志愿者,为研究所,尤其是研究所的技术活动提供了忠诚和奉献的服务。
{"title":"Stefan G. Mozar Received 2024 IEEE Richard M. Emberson Award","authors":"Wen-Chung Kao","doi":"10.1109/mce.2024.3423528","DOIUrl":"https://doi.org/10.1109/mce.2024.3423528","url":null,"abstract":"In 1986, the Board of Directors established the IEEE Richard M. Emberson Award. The Award is named in honor of Dr. Richard M. Emberson, whose 23-year association with the Institute at both the staff and volunteer levels, including the Director of Technical Services, the Executive Director and the General Manager, and a Member of the Board of Directors, exemplified loyal and dedicated service to the Institute, especially its technical activities.","PeriodicalId":54330,"journal":{"name":"IEEE Consumer Electronics Magazine","volume":null,"pages":null},"PeriodicalIF":4.5,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141947322","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
The Home of Innovators and Engineerswho Bring Consumer Technologies to Life 将消费技术带入生活的创新者和工程师之家
IF 4.5 4区 计算机科学 Q1 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-08-06 DOI: 10.1109/mce.2024.3430681
{"title":"The Home of Innovators and Engineerswho Bring Consumer Technologies to Life","authors":"","doi":"10.1109/mce.2024.3430681","DOIUrl":"https://doi.org/10.1109/mce.2024.3430681","url":null,"abstract":"","PeriodicalId":54330,"journal":{"name":"IEEE Consumer Electronics Magazine","volume":null,"pages":null},"PeriodicalIF":4.5,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141947320","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
CTSoc Members CTSoc 成员
IF 4.5 4区 计算机科学 Q1 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-08-06 DOI: 10.1109/mce.2024.3426749
{"title":"CTSoc Members","authors":"","doi":"10.1109/mce.2024.3426749","DOIUrl":"https://doi.org/10.1109/mce.2024.3426749","url":null,"abstract":"","PeriodicalId":54330,"journal":{"name":"IEEE Consumer Electronics Magazine","volume":null,"pages":null},"PeriodicalIF":4.5,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141947323","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Papers and Proposals 征集论文和提案
IF 4.5 4区 计算机科学 Q1 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-08-06 DOI: 10.1109/mce.2024.3426717
{"title":"Call for Papers and Proposals","authors":"","doi":"10.1109/mce.2024.3426717","DOIUrl":"https://doi.org/10.1109/mce.2024.3426717","url":null,"abstract":"","PeriodicalId":54330,"journal":{"name":"IEEE Consumer Electronics Magazine","volume":null,"pages":null},"PeriodicalIF":4.5,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141947327","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Call for Papers: International Conference on Consumer Technology - Pacific (ICCT-Pacific 2025) 征稿:太平洋地区消费技术国际会议(ICCT-Pacific 2025)
IF 4.5 4区 计算机科学 Q1 COMPUTER SCIENCE, HARDWARE & ARCHITECTURE Pub Date : 2024-08-06 DOI: 10.1109/mce.2024.3430684
{"title":"Call for Papers: International Conference on Consumer Technology - Pacific (ICCT-Pacific 2025)","authors":"","doi":"10.1109/mce.2024.3430684","DOIUrl":"https://doi.org/10.1109/mce.2024.3430684","url":null,"abstract":"","PeriodicalId":54330,"journal":{"name":"IEEE Consumer Electronics Magazine","volume":null,"pages":null},"PeriodicalIF":4.5,"publicationDate":"2024-08-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141947331","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":4,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
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IEEE Consumer Electronics Magazine
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