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Neutron irradiation-induced intergranular solute segregation in iron base alloys 中子辐照诱导铁基合金晶间溶质偏析
Pub Date : 1989-12-01 Epub Date: 2003-06-11 DOI: 10.1016/0001-6160(89)90201-0
J. Kameda, A.J. Bevolo

The effect of neutron irradiation (9.4 × 1022 n/m2 at 395°C) on solute segregation to grain or interfacial boundaries in several iron base alloys doped with P, Cu and/or C has been investigated using scanning Auger microscopy. It was found by fracture surface Auger analyses that while neutron irradiation enhanced intergranular segregation of S in a Cu-doped alloy with the absence of P segregation, it mitigated S segregation and promoted P segregation in P containing alloys. The quantity of segregated P was much greater for the irradiated alloys than for the thermally 1000 h aged alloys. The P-doped alloy showed a stronger effect of neutron irradiation on the enrichment of P segregation than the P-Cu-doped and P-C-doped alloys. Argon sputtering experiments indicated that the segregation profiles for S and P were more broadly and narrowly distributed during irradiation, respectively. A remarkable transition of the P segregation profile was observed near the interface of particles lying along grain boundaries where S was preferentially segregated because of the competitive segregation between S and P. The mechanism for neutron irradiation-induced solute segregation is discussed in light of inverse Kirkendall effects and the formation of defect-solute complexes arising from the dynamic interaction between solute and defect fluxes. The relationship of intergranular solute segregation to embrittlement is presented.

用扫描俄歇显微镜研究了395℃下9.4 × 1022 n/m2中子辐照对几种掺杂P、Cu和/或C的铁基合金中溶质向晶界或界面偏析的影响。断口表面俄歇分析发现,中子辐照增强了无P偏析的cu掺杂合金中S的晶间偏析,但减轻了含P合金中S的偏析,促进了P的偏析。辐照合金的P偏析量远大于热时效合金。P掺杂合金的中子辐照对P偏析富集的影响强于P- cu和P- c掺杂合金。氩溅射实验表明,辐照过程中S和P的偏析分布更宽,P的偏析分布更窄。在沿晶界的粒子界面附近,由于S和P之间的竞争偏析,S优先偏析,观察到P偏析剖面的显著转变。根据逆Kirkendall效应和溶质与缺陷通量之间的动态相互作用产生的缺陷-溶质络合物的形成,讨论了中子辐照引起溶质偏析的机制。提出了晶间溶质偏析与脆化的关系。
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引用次数: 27
Laser surface alloying of ni film on al-based alloy 铝基合金上ni薄膜的激光表面合金化
Pub Date : 1989-12-01 Epub Date: 2003-06-11 DOI: 10.1016/0001-6160(89)90192-2
E. Gaffet , J.M. Pelletier , S. Bonnet-Jobez

Based on SIMS analyses, X-ray diffraction patterns, scanning and transmission electron microscopy observations and chemical analyses at various scales, the mechanisms of LASER surface alloying of Ni coating of Al-based alloy have been investigated. The formation of Al3Ni primary dendrites in the case of the low thickness of the initial Ni coating is reported and a double dendritic mode is observed in the case of the thicker coating, Al3Ni2 followed by Al3Ni dendrites. A segregation in Si has been observed just below the exposed surface and related to the dendritic solidification mode. The optimized surface treatment parameters have been experimentally determined as a function of the initial thickness of the Ni coating.

基于SIMS分析、x射线衍射图、扫描电镜和透射电镜观察以及不同尺度的化学分析,研究了al基合金Ni涂层激光表面合金化的机理。在初始Ni涂层厚度较低的情况下,形成了Al3Ni初生枝晶,而在较厚的涂层情况下,观察到双枝晶模式,Al3Ni2随后是Al3Ni枝晶。在暴露表面以下的Si中观察到偏析,这与枝晶凝固模式有关。通过实验确定了最佳表面处理参数与Ni涂层初始厚度的关系。
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引用次数: 0
Rapid solidification of Al-Cu eutectic alloy by laser remelting 激光重熔Al-Cu共晶合金的快速凝固
Pub Date : 1989-12-01 Epub Date: 2003-06-11 DOI: 10.1016/0001-6160(89)90203-4
M. Zimmermann , M. Carrard , W. Kurz

Rapid surface resolidification using a high powered CO2-laser has been performed on eutectic Al-32.7 wt% Cu at speeds between 0.2 and 8 m/s. By means of longitudinal cuts through the centre of the laser trace, the local growth rate has been measured by observation of the orientation of the microstructure using transmission electron microscopy. The various microstructures as a function of growth rate, are:

  • 1.

    (a) regular lamellar eutectic α-Al/θ-Al2Cu structure for growth rates below 20 cm/s with interlamellar spacing as fine as 17 nm;

  • 2.

    (b) a new wavy eutectic α-Al/θ'-Al2Cu morphology for growth rates of between 20 and 50 cm/s;

  • 3.

    (c) a banded structure formed by alternating supersaturated α-Al solid solution and the wavy eutectic for growth rates greater than 50 cm/s.

A recent analytical model for eutectic growth under rapid solidification condition is compared to the experimental results. Contrary to the classical λ2Vs = const. relationship, which predicts a continuous decrease in spacing as the growth rate increases, this new theoretical model clearly predicts a limit for the coupled eutectic growth which finds its analogy in single phase solidification in the limit of absolute stability.
使用高功率co2激光器对共晶al - 32.7% wt% Cu进行了快速表面再凝固,速度在0.2 ~ 8 m/s之间。通过激光迹线中心的纵向切割,利用透射电子显微镜观察微观结构的取向,测量了局部生长速率。随生长速率变化的显微组织有:(a)生长速率低于20 cm/s时,α-Al/θ-Al2Cu为规则的片层共晶结构,片层间距可达17 nm; (b)生长速率为20 ~ 50 cm/s时,α-Al/θ′-Al2Cu为新的波状共晶形貌;(c)生长速率大于50 cm/s时,α-Al固溶体与波状共晶交替形成的带状结构。对快速凝固条件下共晶生长的最新分析模型与实验结果进行了比较。与经典公式λ2Vs = const相反。关系预测随着生长速率的增加,晶粒间距会不断减小,这个新的理论模型清楚地预测了耦合共晶生长的极限,这与单相凝固的绝对稳定极限相类似。
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引用次数: 187
Temperature and rate dependence of saturation stress for low amplitude fatigue of Cu crystals between 4.2 and 350 K Cu晶体在4.2 ~ 350 K范围内低振幅疲劳饱和应力的温度和速率依赖性
Pub Date : 1989-12-01 Epub Date: 2003-06-11 DOI: 10.1016/0001-6160(89)90198-3
Z.S. Basinski, S.J. Basinski

Copper single crystals oriented for single glide were fatigued at temperatures from 4.2 to 350 K in inert atmosphere. Fatigue behaviour was similar at all temperatures. Saturation stress decreased smoothly with increasing fatigue temperature from ≈85 MPa at 4.2 K to ≈27 MPa at 350 K. The effect of cycling rate on saturation stress was also measured. The observations suggest that the same fundamental mechanism, which must be mechanical in nature, operates throughout the temperature interval studied. The activation energy of the operating mechanism, calculated from the observed temperature and rate dependence of the saturation stress, increases linearly with temperature, from ≈0.175 eV at 77.4 K to ≈ 0.7 eV at room temperature. At 77.4 K (as at room temperature) fatigue life is shorter in reactive than in inert environment.

在惰性气氛中,在4.2 ~ 350 K的温度范围内对单滑动取向铜单晶进行了疲劳试验。在所有温度下,疲劳行为相似。随着疲劳温度的升高,饱和应力从4.2 K时的≈85 MPa平稳下降到350 K时的≈27 MPa。测定了循环速率对饱和应力的影响。这些观察结果表明,在整个研究的温度区间内,同样的基本机制(本质上必须是机械的)都在起作用。根据观察到的温度和饱和应力的速率依赖关系计算出的操作机制的活化能随温度线性增加,从77.4 K时的≈0.175 eV增加到室温时的≈0.7 eV。在77.4 K时(与室温一样),反应态疲劳寿命比惰性环境短。
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引用次数: 29
The geometry of glide in Ni3Al at temperatures above the flow stress peak 温度高于流动应力峰值时Ni3Al滑动的几何形状
Pub Date : 1989-12-01 Epub Date: 2003-06-11 DOI: 10.1016/0001-6160(89)90195-8
P.M. Hazzledine , M.H. Yoo , Y.Q. Sun

At temperatures above the flow stress peak in Ni3Al the slip system is 〈110〉{001}. At higher temperatures still a second system, 〈010〉{001}, also operates. Both types of dislocation form glide loops which dissociate into 12 〈110〉 APB-linked partials and both glide loops show ranges of elastic instability. Three types of dislocation may lower their energy further by a second dissociation on {111} planes: the screw 〈110〉 forms a Kear-Wilsdorf lock, the edge 〈110〉 forms a Lomer-Cottrell lock and the 45° 〈010〉 forms a B5 lock. Interactions between 〈110〉 and 〈010〉 dislocations give rise to two more dislocations with non-planar cores, the 〈110〉 lock and the 〈111〉 lock. All these locked dislocations are slow moving or immobile and all, except for the 〈111〉 lock, have been observed in the electron microscope. The formation of 〈110〉 and 〈111〉 locks and the mixing of the two slip systems through interactions between them give an explanation for the high-temperature work-hardening peak found in Ni3Al.

当温度高于Ni3Al流变应力峰值时,滑移体系< 110 >{001}。在较高的温度下,第二个系统< 010 >{001}也在工作。两种类型的位错都形成滑动环,这些滑动环解离成12个< 110 > apb连接的部分,两种滑动环都表现出弹性不稳定性。有三种类型的位错可以通过在{111}平面上的二次解离进一步降低它们的能量:螺旋< 110 >形成Kear-Wilsdorf锁,边缘< 110 >形成lomo - cottrell锁,45°< 010 >形成B5锁。< 110 >和< 010 >位错之间的相互作用产生了另外两种具有非平面核的位错,< 110 >锁和< 111 >锁。所有这些锁定位错都是缓慢移动或不移动的,除了< 111 >锁定外,所有这些锁定位错都可以在电子显微镜下观察到。< 110 >和< 111 >锁的形成以及两种滑移体系相互作用的混合,解释了Ni3Al中高温加工硬化峰的形成。
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引用次数: 29
Diffusion induced grain boundary migration in Ni-Cu Diffusion couples Ni-Cu扩散偶的扩散诱导晶界迁移
Pub Date : 1989-12-01 Epub Date: 2003-06-11 DOI: 10.1016/0001-6160(89)90209-5
D. Liu, W.A. Miller, K.T. Aust

Diffusion induced grain boundary migration (DIGM) was investigated in the Ni substrate of Ni-Cu diffusion couples. After annealing at 615°C for 26 h, TEM/STEM revealed:

  • 1.

    (1) dislocation walls at the initial grain boundary positions,

  • 2.

    (2) a small misorientation (0.1–0.5°) between the DIGM zone and the Ni matrix,

  • 3.

    (3) highest Cu concentrations in the DIGM zones adjacent to the original grain boundary positions,

  • 4.

    (4) steps and line defects at the DIGM boundaries and

  • 5.

    (5) grain boundary faceting caused by DIGM.

After 92 h of annealing at 615°C, two major changes were observed as compared with the shorter 26 h anneal at the same temperature:
  • 1.

    (1) a decrease in the dislocation densities in the DIGM zones, in the matrix and at the original grain boundary positions

  • 2.

    (2) a change in Cu concentration profiles across the DIGM zones. The experimental results are interpreted in terms of current DIGM theories.

研究了Ni- cu扩散偶在Ni基体中的扩散诱导晶界迁移(DIGM)现象。在615℃退火26 h后,TEM/STEM显示:(1)初始晶界位置有位错壁,(2)DIGM区与Ni基体之间存在较小的位错(0.1-0.5°),(3)靠近原始晶界位置的DIGM区Cu浓度最高,(4)DIGM边界处有台阶和线缺陷,(5)DIGM引起的晶界面化。在615℃下退火92 h后,与相同温度下较短的26 h退火相比,观察到两个主要变化:(1)DIGM区、基体和原始晶界位置的位错密度降低;(2)DIGM区的Cu浓度分布发生变化。实验结果用现有的DIGM理论进行了解释。
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引用次数: 43
Elastic anisotropy and the substitutional bainite formation in copper base alloys 铜基合金中弹性各向异性与取代贝氏体的形成
Pub Date : 1989-12-01 Epub Date: 2003-06-11 DOI: 10.1016/0001-6160(89)90186-7
A. Schmitz, M. Chandrasekaran , G. Ghosh , L. Delaey

The importance of elastic anisotropy in the substitutional bainite (α1 plate) formation at defects in copper base alloys has been emphasized in this work. It has been argued that a defect such as a dislocation in an elastically anisotropic medium could lower its energy by reducing the energy factor K (elastic anisotropy and thus composition dependent) which in turn would lead to higher elastic anisotropy around the defect through solute reduction. Proof for this is provided through TEM evidence, monitoring the elastic anisotropy dependent bend angles of directionally unstable dislocations in β Cu-Zn-Al as a function of isothermal ageing which eventually leads to bainite formation. The role of elastic anisotropy in promoting both solute diffusion and shear and its implications on the initial stages of bainite formation are discussed.

本文强调了弹性各向异性在铜基合金缺陷处取代贝氏体(α1板)形成中的重要性。有人认为,在弹性各向异性介质中,像位错这样的缺陷可以通过降低能量因子K(弹性各向异性,因此取决于成分)来降低其能量,这反过来又会通过溶质还原导致缺陷周围更高的弹性各向异性。通过监测β Cu-Zn-Al中方向不稳定位错的弹性各向异性相关弯曲角作为等温时效最终导致贝氏体形成的函数,TEM证据证明了这一点。讨论了弹性各向异性在促进溶质扩散和剪切中的作用及其在贝氏体形成初期的意义。
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引用次数: 13
On crack path selection and the interface fracture energy in bimaterial systems 双材料体系中裂纹路径选择与界面断裂能
Pub Date : 1989-12-01 Epub Date: 2003-06-11 DOI: 10.1016/0001-6160(89)90197-1
A.G. Evans , B.J. Dalgleish , M. He , J.W. Hutchinson

The intent of this article is to apply recent solutions for the mechanics of cracks at and near bimaterial interfaces to rationalize crack trajectories observed by experiment and to provide a basis for interpreting measurements of the interface fracture energy, Γi. It is demonstrated that the choice of test specimen governs the tendency of cracks to either remain at interfaces or deviate away, based on considerations of the phase angle of loading, ψ. It is further revealed that the measured interface fracture energy may be strongly influenced by the crack trajectory, as governed by ψ, through crack shielding and plasticity effects. Consequently, interfaces do not typically have unique fracture energies, but instead Γi depends on ψ which, in turn, is influenced by the test method.

本文的目的是应用双材料界面处和附近裂纹力学的最新解决方案,以使实验观察到的裂纹轨迹合理化,并为解释界面断裂能的测量提供基础,Γi。这证明了试样的选择决定了裂纹的倾向,要么留在界面上,要么偏离,基于加载的相位角,ψ。结果表明,裂纹轨迹通过裂纹屏蔽效应和塑性效应对界面断裂能产生强烈的影响,并受ψ的支配。因此,界面通常不具有唯一的断裂能,而是Γi取决于ψ,而ψ又受测试方法的影响。
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引用次数: 127
Copper single crystal PSB morphology between 4.2 and 350 K 铜单晶PSB在4.2 ~ 350 K之间的形貌
Pub Date : 1989-12-01 Epub Date: 2003-06-11 DOI: 10.1016/0001-6160(89)90199-5
Z.S. Basinski, S.J. Basinski

For fatigue at temperatures from 4.2 to 350 K, crystals in saturation comprise PSB and matrix regions, however, details of PSB morphology are temperature-dependent. There are three main types of profile. Type I: at very low temperatrures, mildly bulged PSBs comprising smooth extrusions. Type II: from ≈15 to ≈250 K, triangular bulges reaching > 10 μm in height. Type III: above 300 K, non-bulged PSBs comprising both intrusions and extrusions. Transition regions with PSBs of mixed character are found between the distinct types. Room temperature is near the end of a transition region, PSB morphology therefore depends on fatigue conditions. PSB profile development is independent of fatigue environment; crack propagation is environment dependent. There is no correlation betwen PSB morphology and point defect mobility.

在4.2至350 K的疲劳温度下,饱和晶体包括PSB和基体区域,然而,PSB形态的细节与温度有关。配置文件主要有三种类型。I型:在非常低的温度下,由光滑挤出物组成的轻度膨大的psb。II型:≈15 ~≈250k,三角形凸起达到>高度为10 μm。III型:300k以上,非膨出psb,包括侵入和挤压。在不同类型之间发现了具有混合特征的psb过渡区。室温接近过渡区的末端,因此PSB的形貌取决于疲劳条件。PSB型材的开发与疲劳环境无关;裂纹扩展与环境有关。PSB的形貌与点缺陷迁移率无相关性。
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引用次数: 43
Energetics of the break-up of dislocation dipoles into prismatic loops 位错偶极子分裂成棱柱环的能量学
Pub Date : 1989-12-01 Epub Date: 2003-06-11 DOI: 10.1016/0001-6160(89)90204-6
K.P.D. Lagerlöf, T.E. Mitchell , A.H. Heuer

The energetics of two different models leading to the formation of a row of prismatic loops from the fluctuation and subsequent break-up of dislocation dipoles or elongated dislocation loops have been evaluated as a function of fluctuation amplitude and wavelength. Break-up most likely occurs by spontaneous pinching off of small circular loops at the ends of closed-ended dipoles or elongated loops. The theoretical results agree well with experimental observations of the dislocation substructure in Ti4+-doped sapphire (α-Al2O3) deformed by basal slip.

从位错偶极子的波动和随后的破裂或拉长的位错环中导致形成一排棱柱环的两种不同模型的能量学已经作为波动幅度和波长的函数进行了评估。破裂最可能发生在闭合偶极子或长环末端的小环的自发夹断。理论结果与实验观察的Ti4+掺杂蓝宝石(α-Al2O3)基底滑移变形的位错亚结构吻合较好。
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引用次数: 24
期刊
Acta Metallurgica
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