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Thermal Conductivity 23最新文献

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Combined Radiation and Conduction in Fibrous Insulation (from 24°C to 400°C) 纤维绝缘中的综合辐射和传导(从24°C到400°C)
Pub Date : 2021-07-27 DOI: 10.1201/9781003210719-46
P. Boulet, G. Jeandel, P. De Dianous, F. Pincemin
{"title":"Combined Radiation and Conduction in Fibrous Insulation (from 24°C to 400°C)","authors":"P. Boulet, G. Jeandel, P. De Dianous, F. Pincemin","doi":"10.1201/9781003210719-46","DOIUrl":"https://doi.org/10.1201/9781003210719-46","url":null,"abstract":"","PeriodicalId":109951,"journal":{"name":"Thermal Conductivity 23","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132216489","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Composition Effects on MMC's Thermal Properties and Behavior under Transient High Fluxes 组分对瞬态高通量下MMC热性能和行为的影响
Pub Date : 2021-07-27 DOI: 10.1201/9781003210719-31
J. Serra, E. Milcent, P. Louvigne
{"title":"Composition Effects on MMC's Thermal Properties and Behavior under Transient High Fluxes","authors":"J. Serra, E. Milcent, P. Louvigne","doi":"10.1201/9781003210719-31","DOIUrl":"https://doi.org/10.1201/9781003210719-31","url":null,"abstract":"","PeriodicalId":109951,"journal":{"name":"Thermal Conductivity 23","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129202432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermal Conductivity of Spun Glass Fibers as Filler Material for Vacuum Insulations 真空绝缘填充材料玻璃纤维的导热性能
Pub Date : 2021-07-27 DOI: 10.1201/9781003210719-40
R. Caps, J. Hetfleisch, T. Rettelbach, J. Fricke
{"title":"Thermal Conductivity of Spun Glass Fibers as Filler Material for Vacuum Insulations","authors":"R. Caps, J. Hetfleisch, T. Rettelbach, J. Fricke","doi":"10.1201/9781003210719-40","DOIUrl":"https://doi.org/10.1201/9781003210719-40","url":null,"abstract":"","PeriodicalId":109951,"journal":{"name":"Thermal Conductivity 23","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127606351","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Laser-Assisted AC Measurement of Thin-Film Thermal Diffusivity with Different Laser Beam Configurations 激光辅助交流测量不同激光束结构的薄膜热扩散系数
Pub Date : 2021-07-27 DOI: 10.1201/9781003210719-22
X. Y. Yu, L. Zhang, G. Chen
{"title":"Laser-Assisted AC Measurement of Thin-Film Thermal Diffusivity with Different Laser Beam Configurations","authors":"X. Y. Yu, L. Zhang, G. Chen","doi":"10.1201/9781003210719-22","DOIUrl":"https://doi.org/10.1201/9781003210719-22","url":null,"abstract":"","PeriodicalId":109951,"journal":{"name":"Thermal Conductivity 23","volume":"149 ","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114092481","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Thermistor Based Method for Measuring Thermal Conductivity and Thermal Diffusivity of Moist Food Materials at High Temperatures 基于热敏电阻的高温湿性食品材料导热系数和热扩散系数测量方法
Pub Date : 2021-07-27 DOI: 10.1201/9781003210719-66
M. van Gelder, K. C. Diehl
{"title":"A Thermistor Based Method for Measuring Thermal Conductivity and Thermal Diffusivity of Moist Food Materials at High Temperatures","authors":"M. van Gelder, K. C. Diehl","doi":"10.1201/9781003210719-66","DOIUrl":"https://doi.org/10.1201/9781003210719-66","url":null,"abstract":"","PeriodicalId":109951,"journal":{"name":"Thermal Conductivity 23","volume":"93 12 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128940630","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Theoretical Aspects of the Thermal Conductivity in Thin Films 薄膜热导率的理论研究
Pub Date : 2021-07-27 DOI: 10.1201/9781003210719-16
F. Voelklein, Thilo Franke
{"title":"Theoretical Aspects of the Thermal Conductivity in Thin Films","authors":"F. Voelklein, Thilo Franke","doi":"10.1201/9781003210719-16","DOIUrl":"https://doi.org/10.1201/9781003210719-16","url":null,"abstract":"","PeriodicalId":109951,"journal":{"name":"Thermal Conductivity 23","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130237180","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reference Materials and Transfer Standards for Use in Measurements on Low Thermal Conductivity Materials and Systems 用于低导热材料和系统测量的参考物质和转移标准
Pub Date : 2021-07-27 DOI: 10.1201/9781003210719-44
R. Tye, U. S. Riko
{"title":"Reference Materials and Transfer Standards for Use in Measurements on Low Thermal Conductivity Materials and Systems","authors":"R. Tye, U. S. Riko","doi":"10.1201/9781003210719-44","DOIUrl":"https://doi.org/10.1201/9781003210719-44","url":null,"abstract":"","PeriodicalId":109951,"journal":{"name":"Thermal Conductivity 23","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127616433","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Thermal Conductivity of Resorcinol-Formaldehyde Aerogels 间苯二酚-甲醛气凝胶的导热性能
Pub Date : 2021-07-27 DOI: 10.1201/9781003210719-43
T. Rettelbach, H. Ebert, R. Caps, J. Fricke, C. Alviso, R. Pekala
{"title":"Thermal Conductivity of Resorcinol-Formaldehyde Aerogels","authors":"T. Rettelbach, H. Ebert, R. Caps, J. Fricke, C. Alviso, R. Pekala","doi":"10.1201/9781003210719-43","DOIUrl":"https://doi.org/10.1201/9781003210719-43","url":null,"abstract":"","PeriodicalId":109951,"journal":{"name":"Thermal Conductivity 23","volume":"30 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115203447","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Precision and Bias of the Large Scale Climate Simulator in the Guarded Hot Box and Cold Box Modes 大尺度气候模拟器在冷热箱模式下的精度和偏差
Pub Date : 2021-07-27 DOI: 10.1201/9781003210719-42
K. Wilkes, T. Petrie, P. Childs
{"title":"Precision and Bias of the Large Scale Climate Simulator in the Guarded Hot Box and Cold Box Modes","authors":"K. Wilkes, T. Petrie, P. Childs","doi":"10.1201/9781003210719-42","DOIUrl":"https://doi.org/10.1201/9781003210719-42","url":null,"abstract":"","PeriodicalId":109951,"journal":{"name":"Thermal Conductivity 23","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122628478","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Low-Pressure Thermophysical Properties of EPB–Expanded Perlite Board epb膨胀珍珠岩板的低压热物理性能
Pub Date : 2021-07-27 DOI: 10.1201/9781003210719-39
G. Milano, F. Scarpa, G. Timmermans
{"title":"Low-Pressure Thermophysical Properties of EPB–Expanded Perlite Board","authors":"G. Milano, F. Scarpa, G. Timmermans","doi":"10.1201/9781003210719-39","DOIUrl":"https://doi.org/10.1201/9781003210719-39","url":null,"abstract":"","PeriodicalId":109951,"journal":{"name":"Thermal Conductivity 23","volume":"58 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2021-07-27","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114649748","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
Thermal Conductivity 23
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