首页 > 最新文献

2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)最新文献

英文 中文
Basics of Medical EMC 医疗EMC基础知识
D. P. Ray
{"title":"Basics of Medical EMC","authors":"D. P. Ray","doi":"10.1109/EMCSI.2018.8495237","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495237","url":null,"abstract":"","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121356677","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Mitigation of High-Frequency CM Conducted EMI in Offline Switching Power Supplies 离线开关电源高频CM传导电磁干扰的抑制
M. Ashritha, M. Sudheer
This paper presents a new technique to minimize high-frequency CM conducted EMI noise in offline flyback SMPS and Near Unity Power Factor (NUPF) converter. In this technique, separate ground paths are provided for noise sources on the primary and secondary side of the high-frequency transformer. This is achieved by splitting the Cz capacitor of line filter into Cm1 and Cm2 with their mid-point grounded. By this method, a considerable reduction in CM conducted EMI in the high-frequency range can be achieved. Hence the size of the EMI line filter can be reduced. Experimentation and simulations are carried out with Cm1, Cm2 and Cz capacitor for offline flyback configured NUPF and SMPS in the critical conduction mode. The experimental and simulation results are presented and are found to be in close agreement.
提出了一种降低离线反激式SMPS和近单位功率因数(NUPF)变换器高频CM传导EMI噪声的新方法。在这种技术中,在高频变压器的一次侧和二次侧为噪声源提供了单独的接地路径。这是通过将线路滤波器的Cz电容器分成Cm1和Cm2,其中点接地来实现的。通过这种方法,可以实现高频范围内CM传导EMI的显著降低。因此,可以减小EMI线滤波器的尺寸。对临界导通模式下的离线反激NUPF和SMPS进行了Cm2、Cm2和Cz电容的实验和仿真。给出了实验结果和仿真结果,两者非常吻合。
{"title":"Mitigation of High-Frequency CM Conducted EMI in Offline Switching Power Supplies","authors":"M. Ashritha, M. Sudheer","doi":"10.1109/EMCSI.2018.8495332","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495332","url":null,"abstract":"This paper presents a new technique to minimize high-frequency CM conducted EMI noise in offline flyback SMPS and Near Unity Power Factor (NUPF) converter. In this technique, separate ground paths are provided for noise sources on the primary and secondary side of the high-frequency transformer. This is achieved by splitting the C<inf>z</inf> capacitor of line filter into C<inf>m</inf><inf>1</inf> and C<inf>m</inf><inf>2</inf> with their mid-point grounded. By this method, a considerable reduction in CM conducted EMI in the high-frequency range can be achieved. Hence the size of the EMI line filter can be reduced. Experimentation and simulations are carried out with C<inf>m</inf><inf>1</inf>, C<inf>m</inf><inf>2</inf> and C<inf>z</inf> capacitor for offline flyback configured NUPF and SMPS in the critical conduction mode. The experimental and simulation results are presented and are found to be in close agreement.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126579303","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Lightning performance and protection systems 雷电性能和保护系统
R. Procopio
Introduction
介绍
{"title":"Lightning performance and protection systems","authors":"R. Procopio","doi":"10.1109/EMCSI.2018.8495220","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495220","url":null,"abstract":"Introduction","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125854479","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
An Update on U.S. and Canada Wireless Rulemakings 美国和加拿大无线规则制定的最新情况
G. Kiemel
This article consists only of a collection of slides from the author's conference presentation.
本文仅由作者在会议上发表的一些幻灯片组成。
{"title":"An Update on U.S. and Canada Wireless Rulemakings","authors":"G. Kiemel","doi":"10.1109/emcsi.2018.8495281","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495281","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"124062124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Workshop, WED-PM-5 EMC for Home Appliances, Including Power Converters Applications 研讨会,家用电器的EMC,包括电源转换器的应用
F. Leferink
{"title":"Workshop, WED-PM-5 EMC for Home Appliances, Including Power Converters Applications","authors":"F. Leferink","doi":"10.1109/EMCSI.2018.8495234","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495234","url":null,"abstract":"","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126601101","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs 快速全板串扰扫描信号完整性签名高速PCB设计
F. Ling, Kevin Cai, Bidyut Sen
Crosstalk analysis for high speed PCB design becomes more and more important due to the high data rate and tightly coupled routing. Traditional circuit-based analysis can not meet the accuracy demand. Three-dimensional (3D) full-wave electromagnetic solver is required to capture the complex 3D PCB environment and the frequency-dependent phenomena. However it is prohibitively expensive to simulate the practical large board cases and the resultant tabulated S-parameter cannot be directly used to quantify the crosstalk level. This paper introduces a novel hybrid solver techniques with improved speed and accuracy. The new crosstalk metrics to quantify the crosstalk level are also developed by post-processing S-parameter. Combining these two techniques allows designers to achieve full board crosstalk in a few hours as planned intended with using the tool, which significantly reduces the post-layout review time, allows layout optimization and ensures a timely sign-off.
高数据速率和紧密耦合布线使得串扰分析在高速PCB设计中变得越来越重要。传统的基于电路的分析已不能满足精度要求。三维(3D)全波电磁求解器需要捕获复杂的3D PCB环境和频率相关现象。然而,模拟实际的大型电路板情况是非常昂贵的,并且由此产生的表s参数不能直接用于量化串扰水平。本文介绍了一种新的混合求解技术,提高了求解速度和精度。通过对s参数的后处理,提出了量化串扰电平的新串扰指标。结合这两种技术,设计人员可以在几个小时内按照计划使用该工具实现全板串扰,这大大减少了布局后的审查时间,允许布局优化并确保及时签署。
{"title":"Fast Full Board Crosstalk Scan for Signal Integrity Sign-Off for High Speed PCB Designs","authors":"F. Ling, Kevin Cai, Bidyut Sen","doi":"10.1109/EMCSI.2018.8495173","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495173","url":null,"abstract":"Crosstalk analysis for high speed PCB design becomes more and more important due to the high data rate and tightly coupled routing. Traditional circuit-based analysis can not meet the accuracy demand. Three-dimensional (3D) full-wave electromagnetic solver is required to capture the complex 3D PCB environment and the frequency-dependent phenomena. However it is prohibitively expensive to simulate the practical large board cases and the resultant tabulated S-parameter cannot be directly used to quantify the crosstalk level. This paper introduces a novel hybrid solver techniques with improved speed and accuracy. The new crosstalk metrics to quantify the crosstalk level are also developed by post-processing S-parameter. Combining these two techniques allows designers to achieve full board crosstalk in a few hours as planned intended with using the tool, which significantly reduces the post-layout review time, allows layout optimization and ensures a timely sign-off.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117341124","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 3
Long Beach Tutorial WED-PM-4 Introduction to Medical EMC Risk Management of Electromagnetic Disturbances, or EMI 长滩教程wd - pm -4介绍电磁干扰的医疗EMC风险管理,或EMI
K. Armstrong
Contents Introduction to Functional Safety IEC 61508 and ISO 14971 EMC immunity testing: it's deficiencies for Risk Management Ed.4's requirements for Risk Managing EM disturbances The first practical approach to Risk-Managing EM disturbances Applying the first practical approach to complying with 60601-1-2 Ed.4 60601-1-2 Ed.4 and compliance with Product Liability Legislation
功能安全简介IEC 61508和ISO 14971 EMC抗扰度测试:风险管理Ed.4对风险管理EM干扰的要求的不足风险管理EM干扰的第一个实用方法应用第一个实用方法来符合60601-1-2 Ed.4 60601-1-2 Ed.4和符合产品责任立法
{"title":"Long Beach Tutorial WED-PM-4 Introduction to Medical EMC Risk Management of Electromagnetic Disturbances, or EMI","authors":"K. Armstrong","doi":"10.1109/emcsi.2018.8495431","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495431","url":null,"abstract":"Contents Introduction to Functional Safety IEC 61508 and ISO 14971 EMC immunity testing: it's deficiencies for Risk Management Ed.4's requirements for Risk Managing EM disturbances The first practical approach to Risk-Managing EM disturbances Applying the first practical approach to complying with 60601-1-2 Ed.4 60601-1-2 Ed.4 and compliance with Product Liability Legislation","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127480838","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Special Issues Related to the Frequency Range 2kHz-150kHz 频率范围2kHz-150kHz的特殊问题
A. Mceachern
2kHz-150kHz Emissions
2 khz - 150千赫的排放
{"title":"Special Issues Related to the Frequency Range 2kHz-150kHz","authors":"A. Mceachern","doi":"10.1109/emcsi.2018.8495308","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495308","url":null,"abstract":"2kHz-150kHz Emissions","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129062390","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
EMI Modeling and Reduction in Modern Power Electronics Systems 现代电力电子系统中的电磁干扰建模与降低
Shuo Wang
A. EMI Measurement
A.电磁干扰测量
{"title":"EMI Modeling and Reduction in Modern Power Electronics Systems","authors":"Shuo Wang","doi":"10.1109/EMCSI.2018.8495226","DOIUrl":"https://doi.org/10.1109/EMCSI.2018.8495226","url":null,"abstract":"A. EMI Measurement","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130322545","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 4
Measurements of Wireless Devices in Reverberation Chambers 混响室中无线设备的测量
D. Senic, K. Remley
This article consists only of a collection of slides from the author's conference presentation.
本文仅由作者在会议上发表的一些幻灯片组成。
{"title":"Measurements of Wireless Devices in Reverberation Chambers","authors":"D. Senic, K. Remley","doi":"10.1109/emcsi.2018.8495440","DOIUrl":"https://doi.org/10.1109/emcsi.2018.8495440","url":null,"abstract":"This article consists only of a collection of slides from the author's conference presentation.","PeriodicalId":120342,"journal":{"name":"2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)","volume":null,"pages":null},"PeriodicalIF":0.0,"publicationDate":"2018-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130620521","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
期刊
2018 IEEE Symposium on Electromagnetic Compatibility, Signal Integrity and Power Integrity (EMC, SI & PI)
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1