{"title":"Server Architecture from Enterprise to Post-Moore","authors":"Babak Falsafi, Michael Ferdman, Boris Grot","doi":"10.1109/mm.2024.3418975","DOIUrl":"https://doi.org/10.1109/mm.2024.3418975","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"69 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-07-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141502005","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This issue presents top works selected from 2023 Hot Chips symposium (HotChips 2023.) Beyond their influence to our daily lives, semiconductor chips have also emerged as a critical asset in nation-to-nation geopolitics.
除了对我们的日常生活产生影响外，半导体芯片在国与国之间的地缘政治中也扮演着重要角色。
{"title":"An Incoming World of Decoupling Siliconomy","authors":"Hsien-Hsin S. Lee","doi":"10.1109/mm.2024.3394671","DOIUrl":"https://doi.org/10.1109/mm.2024.3394671","url":null,"abstract":"This issue presents top works selected from 2023 Hot Chips symposium (HotChips 2023.) Beyond their influence to our daily lives, semiconductor chips have also emerged as a critical asset in nation-to-nation geopolitics.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"27 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141516083","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Get Published in the New IEEE Transactions on Privacy","authors":"","doi":"10.1109/mm.2024.3396020","DOIUrl":"https://doi.org/10.1109/mm.2024.3396020","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"32 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141530891","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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