Fei-Fei Li is known for leading the development of ImageNet, which helped catalyze machine learning approaches to vision recognition, and for being an essential voice shaping the science behind artificial intelligence (AI) today. She offers an extended, thoughtful, and heartfelt memoir in this book.1 Beautifully written and grounded in many rich, thought-provoking observations, the book describes her journey from being a child immigrant from China to her present position as a Stanford professor.
{"title":"The Worlds I See: Curiosity, Exploration, and the Discovery at the Dawn of AI—Fei-Fei Li (New York, NY, USA: Flatiron Books, 2023, 336 pp.)","authors":"Reviewed by Shane Greenstein","doi":"10.1109/mm.2024.3390268","DOIUrl":"https://doi.org/10.1109/mm.2024.3390268","url":null,"abstract":"Fei-Fei Li is known for leading the development of ImageNet, which helped catalyze machine learning approaches to vision recognition, and for being an essential voice shaping the science behind artificial intelligence (AI) today. She offers an extended, thoughtful, and heartfelt memoir in this book.1 Beautifully written and grounded in many rich, thought-provoking observations, the book describes her journey from being a child immigrant from China to her present position as a Stanford professor.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"16 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141516081","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"IEEE Computer Society Career Center","authors":"","doi":"10.1109/mm.2024.3396016","DOIUrl":"https://doi.org/10.1109/mm.2024.3396016","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"88 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141530893","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This special issue of IEEE Micro is devoted to selected top-pick articles presented at Hot Chips 2023. The Hot Chips Conference serves as a leading venue for presenting the technical details of innovative microchips on a wide range of topics, including computing, memory, interconnection, and cooling technologies. This particular issue features articles from AMD, Intel, UC Berkeley, Samsung, Cerebras, and Fabric8Labs on different topics including server CPUs, photonic interconnects, processing-in-memory, and artificial intelligence accelerators, as well as new cooling technologies.
{"title":"Special Issue on Hot Chips 2023","authors":"Heiner Litz, Natalia Vassilieva","doi":"10.1109/mm.2024.3396008","DOIUrl":"https://doi.org/10.1109/mm.2024.3396008","url":null,"abstract":"This special issue of IEEE Micro is devoted to selected top-pick articles presented at Hot Chips 2023. The Hot Chips Conference serves as a leading venue for presenting the technical details of innovative microchips on a wide range of topics, including computing, memory, interconnection, and cooling technologies. This particular issue features articles from AMD, Intel, UC Berkeley, Samsung, Cerebras, and Fabric8Labs on different topics including server CPUs, photonic interconnects, processing-in-memory, and artificial intelligence accelerators, as well as new cooling technologies.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"177 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141516080","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
This article is the next article in the series on the patenting behavior and characteristics of computer architecture companies. This article continues to analyze the characteristics for patent families.
本文是计算机体系结构公司专利行为和特点系列的下一篇文章。本文将继续分析专利族的特点。
{"title":"Analysis of Historical Patenting Behavior and Patent Characteristics of Computer Architecture Companies—Part X: Patent Families","authors":"Joshua J. Yi","doi":"10.1109/mm.2024.3394670","DOIUrl":"https://doi.org/10.1109/mm.2024.3394670","url":null,"abstract":"This article is the next article in the series on the patenting behavior and characteristics of computer architecture companies. This article continues to analyze the characteristics for patent families.","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"89 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-06-21","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141516084","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
{"title":"Tales of the Tail: Past and Future","authors":"Christina Delimitrou, Michael Marty","doi":"10.1109/mm.2024.3413649","DOIUrl":"https://doi.org/10.1109/mm.2024.3413649","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"83 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-06-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141942816","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Haocong Luo, Ataberk Olgun, A. Giray Yağlıkçı, Yahya Can Tuğrul, Steve Rhyner, Meryem Banu Cavlak, Joël Lindegger, Mohammad Sadrosadati, Onur Mutlu
{"title":"RowPress Vulnerability in Modern DRAM Chips","authors":"Haocong Luo, Ataberk Olgun, A. Giray Yağlıkçı, Yahya Can Tuğrul, Steve Rhyner, Meryem Banu Cavlak, Joël Lindegger, Mohammad Sadrosadati, Onur Mutlu","doi":"10.1109/mm.2024.3409521","DOIUrl":"https://doi.org/10.1109/mm.2024.3409521","url":null,"abstract":"","PeriodicalId":13100,"journal":{"name":"IEEE Micro","volume":"31 1","pages":""},"PeriodicalIF":3.6,"publicationDate":"2024-06-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141942817","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":3,"RegionCategory":"计算机科学","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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