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2019 19th Non-Volatile Memory Technology Symposium (NVMTS)最新文献

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Gate Stack Optimization Toward Disturb-Free Operation of Ferroelectric HSO based FeFET for NAND Applications 面向NAND应用的基于铁电HSO的ffet无扰动工作的栅极堆栈优化
Pub Date : 2019-10-01 DOI: 10.1109/NVMTS47818.2019.8986166
K. Seidel, K. Biedermann, J. V. Houdt, T. Ali, R. Hoffmann, K. Kühnel, M. Czernohorsky, M. Rudolph, B. Pätzold, P. Steinke, K. Zimmermann
The utilization of FeFET technology in NAND based architectures is dependent on the role of pass voltage disturb of pass cells during the readout of selected cells. This disturb effect becomes dependent on the FeFET stack parameters and potential optimization for a disturb free operation. In this paper, the impact of pass voltage on the disturb properties of a standard 10 nm Si-doped hafnium oxide (HSO) based FeFETs in a twin gate NAND string is reported. This shows a rather low margin between the pass voltage and strong disturb of pass cells and suggests FeFET stack optimization. A laminate HSO based FE stack (2 × 10nm) with an optimized interface layer (IL) is proposed in benchmark to the standard one to achieve a higher pass window for disturb free operation of the NAND cells. $text{A}sim 2text{x}$ pass window is obtained on the laminated FeFET stack compared to the standard one without jeopardizing the optimal write conditions of the FeFET. The pass voltage disturb properties of unselected NAND cells is reported with emphasis on the potential of an optimized laminate based stack to reduce the pass disturb effect.
在基于NAND的结构中,效应场效应管技术的应用取决于在读出选定单元时通压干扰的作用。这种干扰效应取决于ffet的堆叠参数和无干扰操作的潜在优化。本文报道了通压对双栅NAND串中标准10nm掺硅氧化铪(HSO)场效应管干扰特性的影响。这表明通过电压和通过单元的强干扰之间的裕度相当低,并建议对ffet堆栈进行优化。在基准测试中,提出了一种基于层状HSO的2 × 10nm FE堆叠,并优化了接口层(IL),以实现NAND单元无干扰工作的更高通窗。$text{A}sim 2text{x}$通过窗口,在不影响ffet最佳写入条件的情况下,在层叠ffet堆栈上获得了与标准层相比的通窗。报告了非选择NAND电池的通电压干扰特性,重点讨论了优化的层压板基堆栈减少通电压干扰效应的潜力。
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引用次数: 4
NVMTS 2019 Cover Page NVMTS 2019封面
Pub Date : 2019-10-01 DOI: 10.1109/nvmts47818.2019.8986208
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引用次数: 0
True random number generation exploiting SET voltage variability in resistive RAM memory arrays 利用电阻式RAM存储器阵列中的SET电压可变性产生真随机数
Pub Date : 2019-10-01 DOI: 10.1109/NVMTS47818.2019.9043369
J. Postel-Pellerin, Hussein Bazzi, H. Aziza, P. Canet, M. Moreau, V. D. Marca, A. Harb
A novel True Random Number Generator circuit fabricated in a 130nm HfO2-based resistive RAM process is presented. The generation of the random bit stream is based on a specific programming sequence applied to a dedicated memory array. In the proposed programming scheme, the voltage applied to the cells of the memory array is fixed at the median SET voltage of the distribution, to program only a subset of the memory array, resulting in a stochastic distribution of cell resistance values. Some cells are switched in a low resistive state, while the remaining cells maintain their initial high resistance state. Resistance values are next converted into a bit stream and confronted to National Institute of Standards and Technology (NIST) test benchmarks. The generated random bit stream has successfully passed eleven NIST tests out of fifteen without any post-processing.
提出了一种新颖的真随机数发生器电路,该电路采用130nm hfo2基阻式RAM工艺制作。随机位流的生成基于应用于专用存储器阵列的特定编程序列。在本文提出的编程方案中,施加在存储阵列单元上的电压固定在分布的SET电压中位数,只对存储阵列的一个子集进行编程,导致单元电阻值的随机分布。一些电池在低电阻状态下切换,而其余的电池保持其初始的高电阻状态。电阻值接下来被转换成比特流,并面对美国国家标准与技术研究所(NIST)的测试基准。生成的随机比特流在没有任何后处理的情况下成功通过了NIST 15次测试中的11次。
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引用次数: 9
期刊
2019 19th Non-Volatile Memory Technology Symposium (NVMTS)
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