Pub Date : 2001-05-01DOI: 10.1109/ARFTG.2001.327454
E. Strid
This paper surveys the state of RFIC wafer testing as performed on production floors today, and the trends and expectations for the future. Currently, most RF chips sold as known-good die (KGD) and relatively complex RFICs are tested at-speed at the wafer level. RF wafer testing is used to reduce the cost of scrap at the next level of packaging, and various test strategies are pursued to reduce test costs. The hardware options and tradeoffs for production testing are surveyed. Finally, the outlook for test cost, ATE resources, chip connection density, and for emerging technologies such as built-in self-test, are discussed.
{"title":"High-Throughput RFIC Wafer Testing","authors":"E. Strid","doi":"10.1109/ARFTG.2001.327454","DOIUrl":"https://doi.org/10.1109/ARFTG.2001.327454","url":null,"abstract":"This paper surveys the state of RFIC wafer testing as performed on production floors today, and the trends and expectations for the future. Currently, most RF chips sold as known-good die (KGD) and relatively complex RFICs are tested at-speed at the wafer level. RF wafer testing is used to reduce the cost of scrap at the next level of packaging, and various test strategies are pursued to reduce test costs. The hardware options and tradeoffs for production testing are surveyed. Finally, the outlook for test cost, ATE resources, chip connection density, and for emerging technologies such as built-in self-test, are discussed.","PeriodicalId":248678,"journal":{"name":"57th ARFTG Conference Digest","volume":"10 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"117054616","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2001-05-01DOI: 10.1109/ARFTG.2001.327455
Alberto Rodriguez, L. Dunleavy, P. Kirby
Equations are developed for convenient, but rigorous, corrections to on-wafer noise figure measurements based on the radiometer equation. The suitability of the approach for millimeter-wave measurements is demonstrated by presenting measured results for a W-Band (75-110GHz) MMIC low-noise amplifier (LNA). The measured quantities are vector-corrected to specified measurement planes by processing received noise temperatures (or noise power) and applying the developed equations to the measured system characteristics, such as probe S-parameters and noise source reflection coefficients. This technique provides a more rigorous treatment of the losses and mismatches present in a measurement system, yielding more accurate noise figure results compared to those obtained using scalar-corrected quantities. The results for the selected LNA show the noise figure to be on the order of 4 dB over 93-95 GHz, with an average discrepancy of 0.7 dB between noise figure corrections using only scalar loss information and the rigorous noise figure corrections based on vector S-parameter corrections presented here.
{"title":"Best Practice for On-Wafer Millimeter Wave Noise Figure Measurements","authors":"Alberto Rodriguez, L. Dunleavy, P. Kirby","doi":"10.1109/ARFTG.2001.327455","DOIUrl":"https://doi.org/10.1109/ARFTG.2001.327455","url":null,"abstract":"Equations are developed for convenient, but rigorous, corrections to on-wafer noise figure measurements based on the radiometer equation. The suitability of the approach for millimeter-wave measurements is demonstrated by presenting measured results for a W-Band (75-110GHz) MMIC low-noise amplifier (LNA). The measured quantities are vector-corrected to specified measurement planes by processing received noise temperatures (or noise power) and applying the developed equations to the measured system characteristics, such as probe S-parameters and noise source reflection coefficients. This technique provides a more rigorous treatment of the losses and mismatches present in a measurement system, yielding more accurate noise figure results compared to those obtained using scalar-corrected quantities. The results for the selected LNA show the noise figure to be on the order of 4 dB over 93-95 GHz, with an average discrepancy of 0.7 dB between noise figure corrections using only scalar loss information and the rigorous noise figure corrections based on vector S-parameter corrections presented here.","PeriodicalId":248678,"journal":{"name":"57th ARFTG Conference Digest","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2001-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127682848","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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