首页 > 最新文献

2019 IEEE Hot Chips 31 Symposium (HCS)最新文献

英文 中文
TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth in-Package Optical I/O TeraPHY:一种低功耗、高带宽封装内光输入/输出的芯片技术
2019 IEEE Hot Chips 31 Symposium (HCS)
Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875658
M. Wade
{"title":"TeraPHY: A Chiplet Technology for Low-Power, High-Bandwidth in-Package Optical I/O","authors":"M. Wade","doi":"10.1109/HOTCHIPS.2019.8875658","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875658","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"120962587","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
Delivering the Future of High-Performance Computing 交付高性能计算的未来
2019 IEEE Hot Chips 31 Symposium (HCS)
Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875685
Lisa T. Su
{"title":"Delivering the Future of High-Performance Computing","authors":"Lisa T. Su","doi":"10.1109/HOTCHIPS.2019.8875685","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875685","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121922054","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 14
[Habana Labs presentation] [哈瓦那实验室演示]
2019 IEEE Hot Chips 31 Symposium (HCS)
Pub Date : 2019-08-01 DOI: 10.1109/hotchips.2019.8875670
Eitan Medina
{"title":"[Habana Labs presentation]","authors":"Eitan Medina","doi":"10.1109/hotchips.2019.8875670","DOIUrl":"https://doi.org/10.1109/hotchips.2019.8875670","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"94 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131092203","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Gen-Z Chipsetfor Exascale Fabrics 用于百亿亿次结构的Gen-Z芯片组
2019 IEEE Hot Chips 31 Symposium (HCS)
Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875646
P. Knebel, Dan Berkram, A. Davis, Darel N. Emmot, P. Faraboschi, G. Gostin
{"title":"Gen-Z Chipsetfor Exascale Fabrics","authors":"P. Knebel, Dan Berkram, A. Davis, Darel N. Emmot, P. Faraboschi, G. Gostin","doi":"10.1109/HOTCHIPS.2019.8875646","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875646","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128995555","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 7
Deep Learning Training At Scale Spring Crest Deep Learning Accelerator (Intel® Nervana™ NNP-T)
2019 IEEE Hot Chips 31 Symposium (HCS)
Pub Date : 2019-08-01 DOI: 10.1109/HOTCHIPS.2019.8875643
A. Yang
{"title":"Deep Learning Training At Scale Spring Crest Deep Learning Accelerator (Intel® Nervana™ NNP-T)","authors":"A. Yang","doi":"10.1109/HOTCHIPS.2019.8875643","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875643","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"44 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121677810","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 21
Creating An Agile Hardware Flow 创建一个敏捷的硬件流程
2019 IEEE Hot Chips 31 Symposium (HCS)
Pub Date : 1900-01-01 DOI: 10.1109/HOTCHIPS.2019.8875630
{"title":"Creating An Agile Hardware Flow","authors":"","doi":"10.1109/HOTCHIPS.2019.8875630","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875630","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126473569","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 2
Wafer-Scale Deep Learning 晶圆级深度学习
2019 IEEE Hot Chips 31 Symposium (HCS)
Pub Date : 1900-01-01 DOI: 10.1109/HOTCHIPS.2019.8875628
{"title":"Wafer-Scale Deep Learning","authors":"","doi":"10.1109/HOTCHIPS.2019.8875628","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875628","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133081421","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 26
Intel Optane Data Center Persistent Memory 英特尔Optane数据中心持久内存
2019 IEEE Hot Chips 31 Symposium (HCS)
Pub Date : 1900-01-01 DOI: 10.1109/HOTCHIPS.2019.8875668
{"title":"Intel Optane Data Center Persistent Memory","authors":"","doi":"10.1109/HOTCHIPS.2019.8875668","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875668","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"6 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"1900-01-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"128055066","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 12
首页 上一页
类型
全部 化学•材料 生命科学 医学 物理 工程技术 环境•农林 材料科学 地球科学 法学 管理学 化学 环境科学与生态学 计算机科学 教育学 经济学 农林科学 人文科学 生物学 数学 物理与天体物理 心理学 综合性期刊 其他 工业工程 理学 历史学 农学 文学 信息工程
数据库
全部 ACS Publications Elsevier ieeexplore Springer The Royal Society of Chemistry Wiley
期刊
2019 IEEE Hot Chips 31 Symposium (HCS)
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
﹀
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整，为了账户安全，请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号：481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们：info@booksci.cn
Book学术提供免费学术资源搜索服务，方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1