Pub Date : 2019-08-01DOI: 10.1109/HOTCHIPS.2019.8875657
Rangharajan Venkatesan, Y. Shao, B. Zimmer, Jason Clemons, Matthew R. Fojtik, Nan Jiang, Ben Keller, Alicia Klinefelter, N. Pinckney, Priyanka Raina, S. Tell, Yanqing Zhang, W. Dally, J. Emer, C. T. Gray, S. Keckler, Brucek Khailany
{"title":"A 0.11 PJ/OP, 0.32-128 Tops, Scalable Multi-Chip-Module-Based Deep Neural Network Accelerator Designed with A High-Productivity vlsi Methodology","authors":"Rangharajan Venkatesan, Y. Shao, B. Zimmer, Jason Clemons, Matthew R. Fojtik, Nan Jiang, Ben Keller, Alicia Klinefelter, N. Pinckney, Priyanka Raina, S. Tell, Yanqing Zhang, W. Dally, J. Emer, C. T. Gray, S. Keckler, Brucek Khailany","doi":"10.1109/HOTCHIPS.2019.8875657","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875657","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"86 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122946844","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-08-01DOI: 10.1109/HOTCHIPS.2019.8875639
Sagheer Ahmad, Sridhar P. Subramanian, V. Boppana, Shankar Lakka, F. Ho, Tomai Knopp, Juanjo Noguera, Gaurav Singh, Ralph Wittig
{"title":"Xilinx First 7nm Device: Versal AI Core (VC1902)","authors":"Sagheer Ahmad, Sridhar P. Subramanian, V. Boppana, Shankar Lakka, F. Ho, Tomai Knopp, Juanjo Noguera, Gaurav Singh, Ralph Wittig","doi":"10.1109/HOTCHIPS.2019.8875639","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875639","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"104 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127963640","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-08-01DOI: 10.1109/HOTCHIPS.2019.8875673
David Suggs, Dan Bouvier, Michael Clark, Kevin Lepak, Mahesh Subramony
{"title":"AMD “ZEN 2”","authors":"David Suggs, Dan Bouvier, Michael Clark, Kevin Lepak, Mahesh Subramony","doi":"10.1109/HOTCHIPS.2019.8875673","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875673","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"92 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"121615004","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-08-01DOI: 10.1109/HOTCHIPS.2019.8875669
E. Terry
{"title":"Silicon at the Heart of HoloLens 2","authors":"E. Terry","doi":"10.1109/HOTCHIPS.2019.8875669","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875669","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"134429691","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-08-01DOI: 10.1109/HOTCHIPS.2019.8875649
Mike Mantor
{"title":"7NM “NAVI” GPU - A GPU Built for Performance and Efficiency","authors":"Mike Mantor","doi":"10.1109/HOTCHIPS.2019.8875649","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875649","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"15 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127478465","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2019-08-01DOI: 10.1109/HOTCHIPS.2019.8875681
K. Medepalli
{"title":"CYW89459: High Performance and Low Power Wi-Fi and Bluetooth 5.1 Combo Chip for IoT and Automotive","authors":"K. Medepalli","doi":"10.1109/HOTCHIPS.2019.8875681","DOIUrl":"https://doi.org/10.1109/HOTCHIPS.2019.8875681","url":null,"abstract":"","PeriodicalId":273415,"journal":{"name":"2019 IEEE Hot Chips 31 Symposium (HCS)","volume":"49 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2019-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"122766397","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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