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Proceedings of The 26th International Workshop on Vertex Detectors — PoS(Vertex 2017)最新文献

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Simulation of material budget measurements with beam telescopes 光束望远镜测量材料收支的模拟
H. Jansen, P. Schuetze
High-precision particle tracking devices allow for a two-dimensional analysis of the material budget distribution of, e.g., particle detectors and their periphery. These tracking devices, called beam telescopes, enable a precise measurement of the trajectory of charged particles with a position resolution of a few micrometer and an angular resolution of the order of a few ten microradian. In this contribution, the material budget of a structured aluminium cube is reconstructed from various estimators based on the deflection angles of simulated electron trajectories. Probing a target under various rotation angles enables a tomographic reconstruction of the target. We discuss the performance of width estimators of the scattering angle distributions and their impact on the contrast and the resolution of the reconstructed two- and three-dimensional images. At a voxel size of 0.1 mm $times$ 0.1 mm $times$ 0.1 mm, we reconstruct the material budget with a contrast to noise ratio of $5.6pm0.2$ and an edge resolution of about $(70pm10)$ micrometre.
高精度粒子跟踪设备允许二维分析的材料预算分布,例如,粒子探测器及其外围。这些跟踪装置被称为光束望远镜,能够精确测量带电粒子的轨迹,其位置分辨率为几微米,角度分辨率为几十微度。在这篇贡献中,基于模拟电子轨迹的偏转角度,从各种估计量重建了结构铝立方体的材料预算。在不同的旋转角度下探测目标可以实现目标的层析重建。讨论了散射角分布宽度估计器的性能及其对重建的二维和三维图像的对比度和分辨率的影响。在体素尺寸为0.1 mm × 0.1 mm × 0.1 mm的情况下,我们重建了材料预算,对比度为5.6pm0.2$,边缘分辨率约为$(70pm10)$微米。
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引用次数: 1
Modeling Radiation Damage Effects in 3D Pixel Digitization for the ATLAS Detector ATLAS探测器三维像素数字化辐射损伤效应建模
V. Wallangen
Silicon Pixel detectors are at the core of the current and planned upgrade of the ATLAS detector. As the detector in closest proximity to the interaction point, these detectors will be exposed to a significant amount of radiation over their lifetime: before the High Luminosity phase of the Large Hadron Collider (HL-LHC) the innermost layers will receive a fluence in excess of $10^{15}$ n$_mathrm{eq}$/cm$^2$ and the HL-LHC detector upgrades must cope with an order of magnitude higher fluence integrated over their lifetimes. This work presents the details of a new simulation model that includes radiation damage effects to the 3D Pixel sensors for the ATLAS detector.
硅像素探测器是ATLAS探测器当前和计划升级的核心。探测器的最接近的交互点,这些探测器将暴露在大量的辐射在他们的一生中:高亮度阶段前的大型强子对撞机(HL-LHC)最里层将收到影响超过10美元^ {15}$ n $ _ mathrm {eq} /厘米^ 2美元和美元HL-LHC探测器升级必须应对高一个数量级的影响整合的一生。这项工作提出了一个新的模拟模型的细节,其中包括辐射损伤对ATLAS探测器的3D像素传感器的影响。
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引用次数: 0
The CMS Pixel Detector Upgrade and R&D developments for the High Luminosity LHC 高亮度大型强子对撞机CMS像素探测器的升级与研发
L. Viliani
The High Luminosity Large Hadron Collider (HL-LHC) at CERN is expected to collide protons at a centre-of-mass energy of $14,{rm TeV}$ and to reach an unprecedented peak instantaneous luminosity of $5 times 10^{34},{rm cm}^{-2} {rm s}^{-1}$ with an average number of pileup events of $140$. This will allow the ATLAS and CMS experiments to collect integrated luminosities of up to $3000,{rm fb}^{-1}$ during the project lifetime. To cope with this extreme scenario the CMS detector will be substantially upgraded before starting the HL-LHC, a plan known as CMS Phase-2 Upgrade. In the upgrade the entire CMS silicon pixel detector will be replaced and the new detector will feature increased radiation hardness, higher granularity and capability to handle higher data rate and longer trigger latency. In this report the Phase-2 Upgrade of the CMS silicon pixel detector will be reviewed, focusing on the features of the detector layout and on the development of new pixel devices.
欧洲核子研究中心(CERN)的高亮度大型强子对撞机(HL-LHC)有望使质心能量为$14,{rm TeV}$的质子发生碰撞,并达到前所未有的瞬时亮度峰值$5 乘以10^{34},{rm cm}^{-2} {rm s}^{-1}$,平均堆积事件数为$140$。这将允许ATLAS和CMS实验在项目生命周期内收集高达$3000,{rm fb}^{-1}$的综合光度。为了应对这种极端情况,CMS探测器将在启动HL-LHC之前进行大规模升级,这一计划被称为CMS第二阶段升级。在升级中,整个CMS硅像素探测器将被替换,新的探测器将具有更高的辐射硬度,更高的粒度和处理更高数据速率和更长的触发延迟的能力。本报告将回顾CMS硅像元探测器的第二阶段升级,重点介绍探测器布局的特点和新的像元器件的发展。
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引用次数: 0
MAPS-based Vertex Detectors: Operational Experience in STAR and Future Applications 基于地图的顶点检测器:STAR和未来应用的操作经验
G. Contin
The STAR PiXeL detector (HFT PXL) at RHIC is the first application of the thin Monolithic Active Pixel Sensors (MAPS) technology in a collider environment. It is based on 50~$mu$m-thin MAPS sensors with a pitch of 20.7~$mu$m. The sensor is read-out in rolling shutter mode in 185.6~$mu$s. The 170 mW/cm$^2$ power dissipation allows for air cooling and contributes to reducing the global material budget to 0.4% radiation length on the innermost layer. This system took data in Au+Au collisions, p+p and p+Au collisions at $sqrt{s_{NN}}$~=~200~GeV at RHIC, during the period 2014-2016. Operational experience and lessons learned from the construction and the 3 years of data-taking will be presented in this paper. Detector performance and results from 2014 Au+Au data analysis, demonstrating the STAR capabilities of charm reconstruction, will be shown. Following this successful experience, the next-generation MAPS sensor, featuring an integration time shorter than 20~$mu$s, will be used to upgrade the ALICE Inner Tracking System (ITS) at LHC and has been proposed for the vertex detector (MVTX) for sPHENIX, the future nuclear physics experiment for the study of the QGP planned for RHIC. A short outlook on these future applications will conclude the paper.
RHIC的STAR像素探测器(HFT PXL)是薄单片有源像素传感器(MAPS)技术在对撞机环境中的首次应用。它基于50个$mu$ m薄的MAPS传感器,其节距为20.7 $mu$ m。传感器以滚动快门模式在185.6 $mu$ s内读出。170 mW/cm $^2$的功耗允许空气冷却,并有助于将最内层的整体材料预算减少到0.4%的辐射长度。该系统采集了2014-2016年RHIC中$sqrt{s_{NN}}$ = 200 GeV的Au+Au碰撞、p+p和p+Au碰撞数据。本文将介绍从建设和3年数据采集中获得的操作经验和教训。将展示探测器的性能和2014年Au+Au数据分析的结果,展示其魅力重构的STAR能力。根据这一成功经验,集成时间短于20 $mu$ s的下一代MAPS传感器将用于升级大型强子对撞机的ALICE内部跟踪系统(ITS),并已被提议用于sPHENIX的顶点探测器(MVTX), sPHENIX是RHIC计划用于QGP研究的未来核物理实验。最后对这些未来的应用作了简要的展望。
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引用次数: 1
Operation and Performance of the CMS outer tracker CMS外部跟踪器的运行和性能
E. Butz
The CMS Silicon Strip Tracker with its more than 15000 silicon modules and 200 m$^2$ of active silicon area has been running together with the other subsystems of CMS for several years. We present the performance of the detector in the LHC Run 2 data taking. Results for signal-to-noise, hit efficiency and single hit resolution will be presented. We review the behavior of the system when running at beyond-design instantaneous luminosity and describe challenges observed under these conditions. The evolution of detector parameters under the influence of radiation damage are presented and compared to simulations.
CMS硅条跟踪器拥有超过15000个硅模块和2亿美元的有效硅面积,已经与CMS的其他子系统一起运行了好几年。介绍了该探测器在LHC Run 2数据采集中的性能。将给出信噪比、命中效率和单命中分辨率的结果。我们回顾了系统在超出设计的瞬时亮度下运行时的行为,并描述了在这些条件下观察到的挑战。给出了探测器参数在辐射损伤影响下的演化规律,并与仿真结果进行了比较。
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引用次数: 2
Status & Challenges of Tracker Design for FCC-hh FCC-hh跟踪器设计现状与挑战
Z. Drasal
A 100 TeV proton collider represents a core aspect of the Future Circular Collider (FCC) study. An integral part of this project is the conceptual design of individual detector systems that can be operated under luminosities up to $3times10^{35} mathrm{cm}^{-2} mathrm{s}^{-1}$. Compared to HL-LHC scenario, one of the key limitations in the design arises from an increased number of pile-up events O(1000), c.f. O(140) at HL-LHC, making both particle tracking and identification of vertices extremely challenging. This paper reviews the general ideas that conceptually drive the current tracker/vertex detector design for the FCC-hh (proton-proton). These include material budget, detector granularity, pattern recognition, primary vertexing/pile-up mitigation and occupancy/data rates. Finally, the limits of current tracker technologies and requirements on their future progress, i.e. the dedicated R&D, are discussed.
100 TeV质子对撞机是未来环形对撞机(FCC)研究的一个核心方面。该项目的一个组成部分是单个探测器系统的概念设计,该系统可以在高达$3times10^{35} mathrm{cm}^{-2} mathrm{s}^{-1}$的光度下工作。与HL-LHC方案相比,设计中的一个关键限制来自HL-LHC增加的堆积事件数量O(1000), c.f.o(140),使得粒子跟踪和顶点识别都极具挑战性。本文综述了从概念上驱动FCC-hh(质子-质子)电流跟踪器/顶点探测器设计的一般思想。这些包括材料预算、检测器粒度、模式识别、主要顶点/堆积缓解和占用/数据率。最后,讨论了当前跟踪器技术的局限性和对其未来发展的要求,即专门的研发。
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引用次数: 1
MuPix8 - A large-area HV-MAPS chip MuPix8 -大面积HV-MAPS芯片
H. Augustin, N. Berger, S. Dittmeier, F. Ehrler, J. Hammerich, A. Herkert, L. Huth, D. Immig, J. Kröger, I. Perić, M. Prathapan, R. Schimassek, A. Schöning, A. Weber, D. Wiedner, H. Zhang
The architecture of the first large area $2times 1, text{cm}^2$ MuPix8 prototype, produced in an AMS $180, text{nm}$ HV-CMOS process, is presented. The MuPix8 chip is a High Voltage Monolithic Active Pixel Sensor (HV-MAPS) being developed for the Mu3e experiment which will search for the lepton flavour violating decay $mu^{+} rightarrow e^{+}e^{-}e^{+}$ with an unprecedented sensitivity of one in $10^{16}$ decays. To reach this sensitivity goal an ultralight-pixel tracker with $10^{-3}$ radiation lenghts per tracking layer and high rate capability is being built. The Mu3e pixel tracker will be based on MuPix chips with a thickness of $50, text{textmu m}$ and a pixel size of $80times80,mutext{m}^2$. The hits are readout by on-chip state machines and the data are streamed out via four $1.25, text{Gbit/s}$ data links. The MuPix8 is the first prototype which fulfills all above requirements and features the full column length of the final chip. In addition, it implements circuitry providing pulse height information, thus allowing for timewalk suppression aiming at a time resolution of $10, text{ns}$ or better.
介绍了采用AMS $180, text{nm}$ HV-CMOS工艺制作的首个大面积$2times 1, text{cm}^2$ MuPix8原型机的结构。MuPix8芯片是为Mu3e实验开发的高压单片有源像素传感器(HV-MAPS),它将以前所未有的$10^{16}$衰减1的灵敏度搜索违反衰减$mu^{+} rightarrow e^{+}e^{-}e^{+}$的轻子风味。为了达到这一灵敏度目标,一种每个跟踪层具有$10^{-3}$辐射长度和高速率能力的超轻像素跟踪器正在构建中。Mu3e像素跟踪器将以厚度为$50, text{textmu m}$、像素尺寸为$80times80,mutext{m}^2$的MuPix芯片为基础。命中由片上状态机读出,数据通过四个$1.25, text{Gbit/s}$数据链接流输出。MuPix8是第一个满足上述所有要求的原型,并具有最终芯片的全柱长度。此外,它还实现了提供脉冲高度信息的电路,从而允许以$10, text{ns}$或更好的时间分辨率进行时间行走抑制。
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引用次数: 1
Edge-TCT Characterisation on TowerJazz CMOS Sensor for the ITK Phase II Upgrade 用于ITK二期升级的TowerJazz CMOS传感器的边缘tct特性
Abhishek Sharma, C. S. Sánchez, D. Bortoletto
The upcoming Phase II upgrade of the Large Hadron Collider (LHC) for the High Luminosity LHC requires the characterisation of new pixel sensors intended to be installed within the ATLAS experiment's inner tracker by 2024. The Edge Transient Current Technique is used to probe prototype TowerJazz Investigator I test structures to study their radiation hardness performance including depletion levels and charge sharing.
即将到来的大型强子对撞机(LHC)高亮度LHC的第二阶段升级需要在2024年之前安装在ATLAS实验内部跟踪器中的新像素传感器的特性。边缘瞬态电流技术用于探测原型TowerJazz研究者I测试结构,以研究其辐射硬度性能,包括损耗水平和电荷共享。
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引用次数: 0
The CMS Outer Tracker Upgrade for the High Luminosity LHC 高亮度LHC的CMS外部跟踪器升级
J. Luetić
The era of High Luminosity Large Hadron Collider will pose unprecedented challenges for detector design and operation. The planned luminosity of the upgraded machine is $5$x$10^{34} $ cm$^{-2}$s$^{-1}$, reaching an integrated luminosity of more than 3000 fb$^{-1}$ by the end of 2037. CMS Tracker detector will have to be replaced in order to fully exploit the delivered luminosity and cope with the demanding operating conditions. The new detector will provide robust tracking as well as input for the first level trigger. This report is focusing on the replacement of the CMS Outer Tracker system, describing new layout and technological choices together with some highlights of research and development activities.
高亮度大型强子对撞机时代将对探测器的设计和运行提出前所未有的挑战。升级后的机器计划光度为$5$x$10 $ {34} $ cm$^{-2}$s$^{-1}$,到2037年底达到3000 fb$^{-1}$以上的综合光度。CMS跟踪探测器必须更换,以充分利用交付的亮度和应对苛刻的操作条件。新的探测器将提供稳健的跟踪以及输入的第一级触发。本报告重点介绍了CMS外部跟踪系统的替换,描述了新的布局和技术选择以及一些研究和开发活动的亮点。
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引用次数: 0
3D Integration of Sensors and Electronics 传感器和电子的三维集成
R. Lipton
A three dimensional integrated circuit is composed of multiple tiers of integrated electronics and sensors integrated vertically by wafer bonding, thinning and insertion of through-silicon-vias. The technologies associated with three dimensional integrated circuits can provide new capabilities for high energy physics and x-ray imaging experiments. These include finer pixel pitch, lower interconnect capacitance, the ability to separate analog and digital functions, and better power distribution and connectivity. In this paper we review the status of 3DIC demonstration projects at Fermilab, discuss several possible applications, and summarize the current availability of commercial processes. Results of a three-tier demonstration project that includes designs for x-ray imaging, CMS track triggering, and ILC vertex are described. We discuss the status of several ongoing 3D projects and prospects for future evolution of the technology.
三维集成电路由多层集成电子器件和传感器组成,通过晶圆键合、减薄和插入硅通孔垂直集成。与三维集成电路相关的技术可以为高能物理和x射线成像实验提供新的能力。其中包括更精细的像素间距,更低的互连电容,分离模拟和数字功能的能力,以及更好的功率分配和连接。在本文中,我们回顾了费米实验室的3DIC示范项目的现状,讨论了几种可能的应用,并总结了目前商业过程的可用性。本文描述了一个三层演示项目的结果,包括x射线成像、CMS轨道触发和ILC顶点的设计。我们讨论了几个正在进行的3D项目的现状和对未来技术发展的展望。
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引用次数: 2
期刊
Proceedings of The 26th International Workshop on Vertex Detectors — PoS(Vertex 2017)
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