首页 > 最新文献

Photomask Technology 2022最新文献

英文 中文
Optimum OPC methodology and visualization technique for photomask compensation in flat panel display lithography 平板显示光刻中掩模补偿的最佳OPC方法和可视化技术
Pub Date : 2022-11-16 DOI: 10.1117/12.2644331
Y. Ham, T. Pistor, C. Progler
{"title":"Optimum OPC methodology and visualization technique for photomask compensation in flat panel display lithography","authors":"Y. Ham, T. Pistor, C. Progler","doi":"10.1117/12.2644331","DOIUrl":"https://doi.org/10.1117/12.2644331","url":null,"abstract":"","PeriodicalId":339778,"journal":{"name":"Photomask Technology 2022","volume":"110 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127981180","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Accelerated discovery of materials for a sustainable future of computing 加速发现可持续未来计算的材料
Pub Date : 2022-11-15 DOI: 10.1117/12.2652970
D. Sanders
{"title":"Accelerated discovery of materials for a sustainable future of computing","authors":"D. Sanders","doi":"10.1117/12.2652970","DOIUrl":"https://doi.org/10.1117/12.2652970","url":null,"abstract":"","PeriodicalId":339778,"journal":{"name":"Photomask Technology 2022","volume":"91 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127048872","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Selective leading-edge mask writing and high-throughput mask writing in multi-beam mask writer MBM-2000PLUS 多波束掩码写入器MBM-2000PLUS的选择性前沿掩码写入和高通量掩码写入
Pub Date : 2022-11-11 DOI: 10.1117/12.2641449
H. Nomura, Hiroshi Matsumoto, Keisuke Yamaguchi, Hayato Kimura, N. Nakayamada
{"title":"Selective leading-edge mask writing and high-throughput mask writing in multi-beam mask writer MBM-2000PLUS","authors":"H. Nomura, Hiroshi Matsumoto, Keisuke Yamaguchi, Hayato Kimura, N. Nakayamada","doi":"10.1117/12.2641449","DOIUrl":"https://doi.org/10.1117/12.2641449","url":null,"abstract":"","PeriodicalId":339778,"journal":{"name":"Photomask Technology 2022","volume":"41 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132690668","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Holistic imaging for yield improvements enabled by high-availability, and low-environmental impact Cymer ArFi lightsource 采用高可用性、低环境影响的Cymer ArFi光源,实现成品率提高的整体成像
Pub Date : 2022-11-11 DOI: 10.1117/12.2648306
S. Luo, W. Conley, James Bonefede, Natallia S. Karlitskaya, Thomas Yang, david manley, peter Oh, Rajasekhar M. Rao, M. Sells, J. Thornes
{"title":"Holistic imaging for yield improvements enabled by high-availability, and low-environmental impact Cymer ArFi lightsource","authors":"S. Luo, W. Conley, James Bonefede, Natallia S. Karlitskaya, Thomas Yang, david manley, peter Oh, Rajasekhar M. Rao, M. Sells, J. Thornes","doi":"10.1117/12.2648306","DOIUrl":"https://doi.org/10.1117/12.2648306","url":null,"abstract":"","PeriodicalId":339778,"journal":{"name":"Photomask Technology 2022","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127415645","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Critical dimension performance and defect control on multi-etching 多重刻蚀关键尺寸性能及缺陷控制
Pub Date : 2022-11-11 DOI: 10.1117/12.2641684
C. C. Han
{"title":"Critical dimension performance and defect control on multi-etching","authors":"C. C. Han","doi":"10.1117/12.2641684","DOIUrl":"https://doi.org/10.1117/12.2641684","url":null,"abstract":"","PeriodicalId":339778,"journal":{"name":"Photomask Technology 2022","volume":"38 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129195003","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Enabling process optimization for EUV phase shift masks using AIMS(R) EUV phase metrology 使用AIMS(R) EUV相位计量实现EUV相移掩模的工艺优化
Pub Date : 2022-11-11 DOI: 10.1117/12.2645004
R. Capelli, N. Wilcox, S. Krannich, Dinumol Devasia, G. Kersteen, A. Sundaramurthy, Chang Ju Choi, S. Hoffmann, Zachary Rice, Patrick J. Straney, K. Gwosch, M. Koch, Tim Helbig
{"title":"Enabling process optimization for EUV phase shift masks using AIMS(R) EUV phase metrology","authors":"R. Capelli, N. Wilcox, S. Krannich, Dinumol Devasia, G. Kersteen, A. Sundaramurthy, Chang Ju Choi, S. Hoffmann, Zachary Rice, Patrick J. Straney, K. Gwosch, M. Koch, Tim Helbig","doi":"10.1117/12.2645004","DOIUrl":"https://doi.org/10.1117/12.2645004","url":null,"abstract":"","PeriodicalId":339778,"journal":{"name":"Photomask Technology 2022","volume":"1993 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125541695","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
DUV mask writer addressable to 90nm nodes with a sustainability profile DUV掩码写入器可寻址到90nm节点,具有可持续性配置文件
Pub Date : 2022-11-11 DOI: 10.1117/12.2641791
R. Eklund, M. Wahlsten, M. Rosling, Martin Glimtoft, Gunnar Gustafsson, Ylva Mjöberg Wentzel, Anna-Karin Drake, Youngjin Park
{"title":"DUV mask writer addressable to 90nm nodes with a sustainability profile","authors":"R. Eklund, M. Wahlsten, M. Rosling, Martin Glimtoft, Gunnar Gustafsson, Ylva Mjöberg Wentzel, Anna-Karin Drake, Youngjin Park","doi":"10.1117/12.2641791","DOIUrl":"https://doi.org/10.1117/12.2641791","url":null,"abstract":"","PeriodicalId":339778,"journal":{"name":"Photomask Technology 2022","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"115427380","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Feasibility study of alternative multilayer for EUV mask EUV掩膜替代多层材料的可行性研究
Pub Date : 2022-11-11 DOI: 10.1117/12.2644225
T. Umezawa, Y. Ikebe, Naoki Hayase, T. Onoue
{"title":"Feasibility study of alternative multilayer for EUV mask","authors":"T. Umezawa, Y. Ikebe, Naoki Hayase, T. Onoue","doi":"10.1117/12.2644225","DOIUrl":"https://doi.org/10.1117/12.2644225","url":null,"abstract":"","PeriodicalId":339778,"journal":{"name":"Photomask Technology 2022","volume":"19 12","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"113935162","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Reticle qualification and re-qualification for EUV production today and in the future 目前和未来EUV生产的光镜鉴定和再鉴定
Pub Date : 2022-11-11 DOI: 10.1117/12.2650339
Ming-Wu Li, Amo Chen, Vidyasagar Anantha, Ray Shi
{"title":"Reticle qualification and re-qualification for EUV production today and in the future","authors":"Ming-Wu Li, Amo Chen, Vidyasagar Anantha, Ray Shi","doi":"10.1117/12.2650339","DOIUrl":"https://doi.org/10.1117/12.2650339","url":null,"abstract":"","PeriodicalId":339778,"journal":{"name":"Photomask Technology 2022","volume":"34 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125495432","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Progress of multi-beam curvilinear mask writing 多波束曲线掩模书写的研究进展
Pub Date : 2022-10-31 DOI: 10.1117/12.2643253
Christof Zillner, J. Jeřábek, A. Moqanaki, Harald Höller-Lugmayr, E. Platzgummer
{"title":"Progress of multi-beam curvilinear mask writing","authors":"Christof Zillner, J. Jeřábek, A. Moqanaki, Harald Höller-Lugmayr, E. Platzgummer","doi":"10.1117/12.2643253","DOIUrl":"https://doi.org/10.1117/12.2643253","url":null,"abstract":"","PeriodicalId":339778,"journal":{"name":"Photomask Technology 2022","volume":"39 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2022-10-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"123065318","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 1
期刊
Photomask Technology 2022
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1