Pub Date : 2018-12-14DOI: 10.5772/INTECHOPEN.82394
W. Chiu, Chun-Yi Chen, T. Chang, T. Hashimoto, H. Kurosu
MEMS gas sensors could exert a significant impact on the automotive sec-tor since future legislation is expected to stipulate the monitoring of NO x and unburned fuel gases in vehicle exhausts. Among the materials, zinc oxide and TiO 2 are the most promising and extensively used materials for monitoring of NO x gas since zinc oxide and TiO 2 show the high sensitivity, good stability, and fast response. Electrochemistry is a potential method to fabricate zinc oxide and TiO 2 for the applications since it is carried out at relatively low temperature and can cooperate with photolithography, which is an important process in MEMS. This study integrated zinc oxide/gold-layered structure and TiO 2 /NiP hybrid structure on elastic fabrics, respectively, to realize an elastic gas sensor. Electroless plating (EP) and cathodic deposition were used to metallize and deposit metal oxides on elastic fabrics. Supercritical carbon dioxide (scCO 2 ) was further introduced into the electrochemical process to enhance the composite reliability.
{"title":"Electrodeposition of High-Functional Metal Oxide on Noble Metal for MEMS Devices","authors":"W. Chiu, Chun-Yi Chen, T. Chang, T. Hashimoto, H. Kurosu","doi":"10.5772/INTECHOPEN.82394","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.82394","url":null,"abstract":"MEMS gas sensors could exert a significant impact on the automotive sec-tor since future legislation is expected to stipulate the monitoring of NO x and unburned fuel gases in vehicle exhausts. Among the materials, zinc oxide and TiO 2 are the most promising and extensively used materials for monitoring of NO x gas since zinc oxide and TiO 2 show the high sensitivity, good stability, and fast response. Electrochemistry is a potential method to fabricate zinc oxide and TiO 2 for the applications since it is carried out at relatively low temperature and can cooperate with photolithography, which is an important process in MEMS. This study integrated zinc oxide/gold-layered structure and TiO 2 /NiP hybrid structure on elastic fabrics, respectively, to realize an elastic gas sensor. Electroless plating (EP) and cathodic deposition were used to metallize and deposit metal oxides on elastic fabrics. Supercritical carbon dioxide (scCO 2 ) was further introduced into the electrochemical process to enhance the composite reliability.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"42 4 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126094798","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-11-29DOI: 10.5772/INTECHOPEN.82226
Masatsugu Fujishige, S. Arai
Gold was used by Chinese and Egyptians of ancient times (at least ca 3000 BC). For many years, gold based materials have received great attention from people, due to the good conductor, high chemical stability, unique optical and processable properties. Electrodeposition technology is a long established technique for synthesizing metals on conductive substrates. Advances in equipment and creations of nanomaterials could carry out new technological progress, a large duty ratio with a pulse overvoltage became possible and new composite fillers (for example, carbon nanotubes: CNTs) appeared. Moreover, environmental considerations have become more important as Sustainable Development Goals (SDGs). SDGs were adopted at the United Nations Summit in September 2015 and are the goals set by the 193 member countries to achieve in the 15 years from 2016 to 2030. For the global environment and workers, friendly manufacturing methods have become more important. In this chapter, two nanostructured golds (hard pure-gold plating and gold-CNT composite plating) are discussed. They are a method of hardening the metal as pure-gold by pulsed electrodeposition and a method of combining CNT by controlling the zeta potential with additives, and their application as a contact material was investigated. Additionally, the synthesis and characteristics of electrostatic deposition films with properties using environmentally friendly sulfite bath are discussed.
{"title":"Hard Pure-Gold and Gold-CNT Composite Plating Using Electrodeposition Technique with Environmentally Friendly Sulfite Bath","authors":"Masatsugu Fujishige, S. Arai","doi":"10.5772/INTECHOPEN.82226","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.82226","url":null,"abstract":"Gold was used by Chinese and Egyptians of ancient times (at least ca 3000 BC). For many years, gold based materials have received great attention from people, due to the good conductor, high chemical stability, unique optical and processable properties. Electrodeposition technology is a long established technique for synthesizing metals on conductive substrates. Advances in equipment and creations of nanomaterials could carry out new technological progress, a large duty ratio with a pulse overvoltage became possible and new composite fillers (for example, carbon nanotubes: CNTs) appeared. Moreover, environmental considerations have become more important as Sustainable Development Goals (SDGs). SDGs were adopted at the United Nations Summit in September 2015 and are the goals set by the 193 member countries to achieve in the 15 years from 2016 to 2030. For the global environment and workers, friendly manufacturing methods have become more important. In this chapter, two nanostructured golds (hard pure-gold plating and gold-CNT composite plating) are discussed. They are a method of hardening the metal as pure-gold by pulsed electrodeposition and a method of combining CNT by controlling the zeta potential with additives, and their application as a contact material was investigated. Additionally, the synthesis and characteristics of electrostatic deposition films with properties using environmentally friendly sulfite bath are discussed.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"19 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126626078","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-11-19DOI: 10.5772/INTECHOPEN.81832
K. Machida, T. Konishi, D. Yamane, H. Toshiyoshi, Hiroyuki Ito
This chapter describes technical features and solutions to realize a highly sensitive CMOS-MEMS accelerometer with gold proof mass. The multi-physics simulation platform for designing the CMOS-MEMS device has been developed to understand simultaneously both mechanical and electrical behaviors of MEMS stacked on LSI. MEMS accelerometer fabrication process is established by the multilayer metal technology, which consists of the gold electroplating and the photo-sensitive polyimide film. The proposed MEMS accelerometers are fabricated and evaluated to verify the effectiveness of the proposed techniques regarding sub-1G MEMS and arrayed MEMS devices. The experimental results show that the Brownian noise of the sub-1G MEMS accelerometer can achieve 780 nG/(Hz) 1/2 and the arrayed MEMS accelerometer has a wide detection, ranging from 1.0 to 20 G. Moreover, using the developed simulation platform, we demonstrate the proposed capacitive CMOS-MEMS accelerometer implemented by the multi-layer metal technology. In conclusion, it is confirmed that the multi-physics simulation platform and the multi-layer metal technology for the CMOS-MEMS device have a potential to realize a nano-gravity sensing technology.
{"title":"Multi-Physics Simulation Platform and Multi-Layer Metal Technology for CMOS-MEMS Accelerometer with Gold Proof Mass","authors":"K. Machida, T. Konishi, D. Yamane, H. Toshiyoshi, Hiroyuki Ito","doi":"10.5772/INTECHOPEN.81832","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.81832","url":null,"abstract":"This chapter describes technical features and solutions to realize a highly sensitive CMOS-MEMS accelerometer with gold proof mass. The multi-physics simulation platform for designing the CMOS-MEMS device has been developed to understand simultaneously both mechanical and electrical behaviors of MEMS stacked on LSI. MEMS accelerometer fabrication process is established by the multilayer metal technology, which consists of the gold electroplating and the photo-sensitive polyimide film. The proposed MEMS accelerometers are fabricated and evaluated to verify the effectiveness of the proposed techniques regarding sub-1G MEMS and arrayed MEMS devices. The experimental results show that the Brownian noise of the sub-1G MEMS accelerometer can achieve 780 nG/(Hz) 1/2 and the arrayed MEMS accelerometer has a wide detection, ranging from 1.0 to 20 G. Moreover, using the developed simulation platform, we demonstrate the proposed capacitive CMOS-MEMS accelerometer implemented by the multi-layer metal technology. In conclusion, it is confirmed that the multi-physics simulation platform and the multi-layer metal technology for the CMOS-MEMS device have a potential to realize a nano-gravity sensing technology.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"8 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"132570342","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-11-16DOI: 10.5772/INTECHOPEN.80846
Brij Mohan Mundotiya, W. Ullah
The gold nanostructures find several technological applications in MEMS, optoelectronics, and electronics industries. To enhance the applicability and suitability of the gold nanostructures in these fields, modification of the morphology of the deposited nanostructure is required. In recent years, the electrodeposition method has emerged as a widely known method for the deposition of the nanostructures of different dimensions and morphologies due to its time efficiency, cost-effectiveness, and absence of vacuum technology. In this method, the morphology of the deposited gold nanostructure can also be easily controlled by tuning the electrodeposition process parameters such as electrolyte concentration, electrolyte temperature, current density, deposition time, etc. This chapter gives a detailed overview of the crucial electrodeposition parameters affecting the morphology of the gold nanostructures deposits.
{"title":"Morphology Controlled Synthesis of the Nanostructured Gold by Electrodeposition Techniques","authors":"Brij Mohan Mundotiya, W. Ullah","doi":"10.5772/INTECHOPEN.80846","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.80846","url":null,"abstract":"The gold nanostructures find several technological applications in MEMS, optoelectronics, and electronics industries. To enhance the applicability and suitability of the gold nanostructures in these fields, modification of the morphology of the deposited nanostructure is required. In recent years, the electrodeposition method has emerged as a widely known method for the deposition of the nanostructures of different dimensions and morphologies due to its time efficiency, cost-effectiveness, and absence of vacuum technology. In this method, the morphology of the deposited gold nanostructure can also be easily controlled by tuning the electrodeposition process parameters such as electrolyte concentration, electrolyte temperature, current density, deposition time, etc. This chapter gives a detailed overview of the crucial electrodeposition parameters affecting the morphology of the gold nanostructures deposits.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"32 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125733366","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-11-15DOI: 10.5772/INTECHOPEN.81636
E. Kondoh
Process technologies that use supercritical CO 2 fluids to fabricate high-aspect-ratio three-dimensional nano- and micro-components are described. Supercritical CO 2 is a state of CO 2 above the critical point. Supercritical CO 2 fluids are used as alternatives to common media (gases and liquids) in MEMS device fabrication to both overcome the drawbacks of these materials and to realize a superior three-dimensional process opportunity. Supercritical fluids behave as both gases and liquids, offer many of the advantages of both, and have zero surface tension. Supercritical fluids are an ideal medium for fabricating very high-aspect-ratio features owing to their superior capability of diffusion transport. As MEMSs have complex and high-aspect-ratio structures, using a supercritical fluid as a process medium in MEMS fabrication provides ideal performance in film coating, plug filling of concave features, and the etching/cleaning of residues. In this chapter, the physicochemical properties of supercritical fluids are first described in terms of MEMS processing, but from a different point of view than that of the common literature on supercritical chemical processing. Next, various applications to thin film processing are described with a focus on interconnect/wiring fabrication of MEMS devices.
{"title":"Cu Wiring Fabrication by Supercritical Fluid Deposition for MEMS Devices","authors":"E. Kondoh","doi":"10.5772/INTECHOPEN.81636","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.81636","url":null,"abstract":"Process technologies that use supercritical CO 2 fluids to fabricate high-aspect-ratio three-dimensional nano- and micro-components are described. Supercritical CO 2 is a state of CO 2 above the critical point. Supercritical CO 2 fluids are used as alternatives to common media (gases and liquids) in MEMS device fabrication to both overcome the drawbacks of these materials and to realize a superior three-dimensional process opportunity. Supercritical fluids behave as both gases and liquids, offer many of the advantages of both, and have zero surface tension. Supercritical fluids are an ideal medium for fabricating very high-aspect-ratio features owing to their superior capability of diffusion transport. As MEMSs have complex and high-aspect-ratio structures, using a supercritical fluid as a process medium in MEMS fabrication provides ideal performance in film coating, plug filling of concave features, and the etching/cleaning of residues. In this chapter, the physicochemical properties of supercritical fluids are first described in terms of MEMS processing, but from a different point of view than that of the common literature on supercritical chemical processing. Next, various applications to thin film processing are described with a focus on interconnect/wiring fabrication of MEMS devices.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"18 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"114138966","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-11-05DOI: 10.5772/INTECHOPEN.80845
Chun-Yi Chen, Masaharu Yoshiba, Haochun Tang, T. Chang, T. Nagoshi, D. Yamane, T. Konishi, K. Machida
Pulse-current electrodeposition and a sulfite-based electrolyte were used in fabrication of pure gold films. Surface of the pulse-electrodeposited gold film possessed less defect, lower roughness, smaller grain size, and denser texture when compared with the gold film prepared by constant-current electrodeposition. Microstructures and compressive yield strength of the electrodeposited gold could be controlled by regulating the pulse on-time and off-time intervals in pulse-current electrodeposition. The gold film prepared under the optimum conditions showed an average grain size at 10.4 nm, and the compressive yield strength reached 800 MPa for a pillar-type micro-specimen having dimensions of 10 μm × 10 μm × 20 μm fabricated from the pulse-electrodeposited gold film. Average grain size of the pulse-electrodeposited gold film was much smaller, and the compressive yield strength was much higher than the values reported in other studies. The high strength is due to the grain boundary strengthening mechanism known as the Hall-Petch relationship. In general, the pulse-electrodeposited gold films showed yield strength ranging from 400 to 673 MPa when the average grain size varied by adjusting the pulse-electrodeposition parameters.
{"title":"Pulse-Current Electrodeposition of Gold","authors":"Chun-Yi Chen, Masaharu Yoshiba, Haochun Tang, T. Chang, T. Nagoshi, D. Yamane, T. Konishi, K. Machida","doi":"10.5772/INTECHOPEN.80845","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.80845","url":null,"abstract":"Pulse-current electrodeposition and a sulfite-based electrolyte were used in fabrication of pure gold films. Surface of the pulse-electrodeposited gold film possessed less defect, lower roughness, smaller grain size, and denser texture when compared with the gold film prepared by constant-current electrodeposition. Microstructures and compressive yield strength of the electrodeposited gold could be controlled by regulating the pulse on-time and off-time intervals in pulse-current electrodeposition. The gold film prepared under the optimum conditions showed an average grain size at 10.4 nm, and the compressive yield strength reached 800 MPa for a pillar-type micro-specimen having dimensions of 10 μm × 10 μm × 20 μm fabricated from the pulse-electrodeposited gold film. Average grain size of the pulse-electrodeposited gold film was much smaller, and the compressive yield strength was much higher than the values reported in other studies. The high strength is due to the grain boundary strengthening mechanism known as the Hall-Petch relationship. In general, the pulse-electrodeposited gold films showed yield strength ranging from 400 to 673 MPa when the average grain size varied by adjusting the pulse-electrodeposition parameters.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"2018 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"131462199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-11-05DOI: 10.5772/INTECHOPEN.80755
Haochun Tang, T. Chang, Chun-Yi Chen, T. Nagoshi, D. Yamane, T. Konishi, K. Machida
Strengthening of electrodeposited gold-based materials is achieved by alloying with copper according to the solid solution strengthening mechanism. Composition of the Au–Cu alloys is affected by the applied current density. The mechanical properties are evaluated by micro-compression tests to evaluate the mechanical properties in microscale to take consideration of the sample size effect for applications as microcomponents in MEMS devices. The yield strength reaches 1.15 GPa for the micropillar fabricated from constant current electrodeposited Au–Cu film, and the film is composed of 30.3 at% Cu with an average grain size of 5.3 nm. The yield strength further increases to 1.50 GPa when pulse current electrodeposition method is applied, and the Cu concentration is 36.9 at% with the average grain size at 4.4 nm.
{"title":"Electrodeposition of Gold Alloys and the Mechanical Properties","authors":"Haochun Tang, T. Chang, Chun-Yi Chen, T. Nagoshi, D. Yamane, T. Konishi, K. Machida","doi":"10.5772/INTECHOPEN.80755","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.80755","url":null,"abstract":"Strengthening of electrodeposited gold-based materials is achieved by alloying with copper according to the solid solution strengthening mechanism. Composition of the Au–Cu alloys is affected by the applied current density. The mechanical properties are evaluated by micro-compression tests to evaluate the mechanical properties in microscale to take consideration of the sample size effect for applications as microcomponents in MEMS devices. The yield strength reaches 1.15 GPa for the micropillar fabricated from constant current electrodeposited Au–Cu film, and the film is composed of 30.3 at% Cu with an average grain size of 5.3 nm. The yield strength further increases to 1.50 GPa when pulse current electrodeposition method is applied, and the Cu concentration is 36.9 at% with the average grain size at 4.4 nm.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"28 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"127696017","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2018-11-05DOI: 10.5772/INTECHOPEN.80589
T. Nagoshi, T. Chang
Micro-sized components have been widely used to microelectromechanical systems (MEMSs) and medical apparatus in recent years. Measurement methodologies of the mechanical property of small materials need to be improved for structural designing of these devices because of their component size reduced to microor nano-regime where sample size effects emerge. Mechanical properties and deformation behavior could be very different with their dimensions and geometries especially for small materials. Our experiments on the micro-specimen tested in different dimensions and loading directions are suitable for the evaluations of materials for MEMS components. In this chapter, recent studies on micro-testing of bending, compression, and tension with micro-sized samples will be presented including fabrication methods of non-tapered micro-sized specimens.
{"title":"Evaluation Methods of Mechanical Properties of Micro-Sized Specimens","authors":"T. Nagoshi, T. Chang","doi":"10.5772/INTECHOPEN.80589","DOIUrl":"https://doi.org/10.5772/INTECHOPEN.80589","url":null,"abstract":"Micro-sized components have been widely used to microelectromechanical systems (MEMSs) and medical apparatus in recent years. Measurement methodologies of the mechanical property of small materials need to be improved for structural designing of these devices because of their component size reduced to microor nano-regime where sample size effects emerge. Mechanical properties and deformation behavior could be very different with their dimensions and geometries especially for small materials. Our experiments on the micro-specimen tested in different dimensions and loading directions are suitable for the evaluations of materials for MEMS components. In this chapter, recent studies on micro-testing of bending, compression, and tension with micro-sized samples will be presented including fabrication methods of non-tapered micro-sized specimens.","PeriodicalId":374529,"journal":{"name":"Novel Metal Electrodeposition and the Recent Application","volume":"1 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2018-11-05","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"130839718","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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