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Journal of Japan Institute of Electronics Packaging最新文献

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オーストラリアQueensland大学で,日本スペリア電子材料製造研究センター (NS CMEM) を設立してみた。 日前,日本斯佩利亚电子材料制造研究中心(NS CMEM)在澳大利亚Queensland大学成立。
Q4 Engineering Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.571
Kazuhiro Nogita
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引用次数: 0
News 新闻
Q4 Engineering Pub Date : 2023-09-01 DOI: 10.5104/jiep.26.631
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引用次数: 0
Heterogeneous Integration Technology Using Low-Temperature Bonding and Its Application to Electronic Devices 低温键合异质集成技术及其在电子器件中的应用
Q4 Engineering Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.427
E. Higurashi
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引用次数: 0
Contents (in English) 内容(英文)
Q4 Engineering Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.c52
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引用次数: 0
特集に寄せて 寄来特辑
Q4 Engineering Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.412
Akinobu Yamaguchi
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引用次数: 0
学会新役員のご紹介 学会新干部介绍
Q4 Engineering Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.513
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引用次数: 0
簡便な検査技術の実現に向けたラボオンディスクの開発 为实现简便检测技术而开发的实验室光盘
Q4 Engineering Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.497
Y. Ukita
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引用次数: 0
目次 目次
Q4 Engineering Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.c51
{"title":"目次","authors":"","doi":"10.5104/jiep.26.c51","DOIUrl":"https://doi.org/10.5104/jiep.26.c51","url":null,"abstract":"","PeriodicalId":38475,"journal":{"name":"Journal of Japan Institute of Electronics Packaging","volume":"37 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-08-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"135931062","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Introduction to Synchrotron Radiation Photoemission Electron Microscopy~Toward Application to Electronics Devices~ 同步辐射光电电子显微镜导论——在电子器件中的应用
Q4 Engineering Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.472
T. Ohkochi
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引用次数: 0
磁気センサの進展と非破壊検査応用 磁性传感器的进展与无损检测应用
Q4 Engineering Pub Date : 2023-08-01 DOI: 10.5104/jiep.26.467
Hiroaki Kikuchi
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引用次数: 0
期刊
Journal of Japan Institute of Electronics Packaging
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