Pub Date : 2013-05-01DOI: 10.31399/asm.cp.istfa2021tpl1
Susan X. Li
Presentation slides from the ISTFA 2021 tutorial, “[Failure Analysis Challenges for Chip Scale Packages].”
来自ISTFA 2021教程的演示幻灯片，“[芯片规模封装的故障分析挑战]”。
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