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VLSI and Post-CMOS Electronics. Volume 1: Design, modelling and simulation最新文献

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Negative bias temperature instability (NBTI) aware low leakage circuit design 负偏置温度不稳定性(NBTI)感知低漏电电路设计
Pub Date : 2019-09-27 DOI: 10.1049/pbcs073f_ch2
V. Sharma, M. Pattanaik
The tremendous scaling of the semiconductor devices is producing the high-density integrated circuits (ICs). Metal-oxide-semiconductor field-effect transistors (MOSFETs) are the basic building blocks for the ICs. The lower area requirement with increased numbers of devices on a substrate makes it an interesting field of very-large-scale integration (VLSI) design. The reliability of the logic circuits is the concern issue in modern-era electronics. Reliability affects the overall performance of the logic circuits and possibility to the failure of the semiconductor devices. Negative bias temperature instability (NBTI) degradation is the major concern in ultra-deep submicron (DSM) regime. The negative threshold voltage of PMOS device when shifted in NBTI effect causes performance degradation over the time. NBTI degradation is the aging effect for PMOS device. This chapter presents the overview of NBTI effect and its possible solution.
半导体器件的巨大规模正在产生高密度集成电路(ic)。金属氧化物半导体场效应晶体管(mosfet)是集成电路的基本组成部分。随着衬底上器件数量的增加,对面积的要求降低,使其成为非常大规模集成电路(VLSI)设计的一个有趣领域。逻辑电路的可靠性是现代电子学关注的问题。可靠性影响着逻辑电路的整体性能和半导体器件发生故障的可能性。负偏置温度不稳定性(NBTI)降解是超深亚微米(DSM)体系中的主要问题。在NBTI效应下,PMOS器件的负阈值电压会随着时间的推移而导致性能下降。NBTI的退化是PMOS器件的老化效应。本章概述了NBTI效应及其可能的解决方案。
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引用次数: 0
Theory and modelling of spin-transfer-torque based electronic devices 基于自旋传递转矩的电子器件的理论与建模
Pub Date : 2019-09-27 DOI: 10.1049/pbcs073f_ch9
A. Singha
In this chapter, we have mainly discussed STT-based classical devices. However, the promise of spin-based computing extends far beyond the devices discussed in this chapter. Some of the other promising technologies that can be employed for spin-based classical computation include quantum dots, quantum Hall bars, spins trapped in nitrogen vacancy centers, etc. Such technologies are still in their infancy and a lot of progress need to be made before such technologies may be incorporated in consumer level systems.
在本章中,我们主要讨论了基于stt的经典器件。然而,基于自旋的计算的前景远远超出了本章讨论的设备。其他一些有前途的技术可以用于基于自旋的经典计算,包括量子点、量子霍尔棒、困在氮空位中心的自旋等。这些技术仍处于起步阶段,在将这些技术纳入消费者级系统之前,还需要取得许多进展。
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引用次数: 0
Tunneling field effect transistors for energy efficient digital, RF and power management circuit designs enabling IoT edge computing platforms 隧道场效应晶体管,用于节能数字,射频和电源管理电路设计,支持物联网边缘计算平台
Pub Date : 2019-09-27 DOI: 10.1049/pbcs073f_ch11
A. Japa, T. Nagateja, R. Vaddi
In this chapter, we have studied the device structure and characteristics of TFETs for energy-efficient circuit design useful for IoT edge computing platforms. TFET shows better electrical characteristics in terms of SS, transconductance, current efficiency, and device FoM. Unlike MOSFETs, TFETs exhibit distinct electrical properties like ambipolar conduction and unidirectional current conduction. TFET-based digital logic gates and buffer circuits are analyzed and benchmarked with Si FinFET for energy efficiency. TFETs outperform FinFET designs and achieve better energy efficiency at low V DD . Due to the high ON-current of the devices, TFET RO reports a frequency of 21 GHz, whereas FinFET RO achieves 13 GHz under similar design conditions. It was shown that due to the enhanced Miller capacitance effect in TFETs, transient characteristics of TFET RO suffers from high overshoots and undershoots. We further looked into TFET-based VCRO design wherein TFET design achieves wide tuning range compared to FinFET designs. Finally, we demonstrate TFET-based DLDO achieving low quiescent current with high-energy efficiency. In summary, TFETs have some unique characteristics that make them an ideal candidate for low voltage IoT platforms with specific design challenges to circuit and system design community as discussed.
在本章中,我们研究了tfet的器件结构和特性,用于物联网边缘计算平台的节能电路设计。在SS、跨导、电流效率和器件FoM等方面均表现出较好的电学特性。与mosfet不同,tfet具有独特的电学特性,如双极传导和单向电流传导。分析了基于tfet的数字逻辑门和缓冲电路,并用Si FinFET对其能量效率进行了基准测试。tfet优于FinFET设计,并在低电压DD下实现更好的能量效率。由于器件的高导通电流,TFET RO报告的频率为21 GHz,而FinFET RO在类似的设计条件下达到13 GHz。结果表明,由于TFET中米勒电容效应的增强,TFET反激效应的瞬态特性受到高过调和低调的影响。我们进一步研究了基于TFET的VCRO设计,其中与FinFET设计相比,TFET设计实现了更宽的调谐范围。最后,我们演示了基于tfet的DLDO以高能效实现低静态电流。综上所述,tfet具有一些独特的特性,使其成为具有电路和系统设计界特定设计挑战的低压物联网平台的理想候选者。
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引用次数: 0
Back Matter 回到问题
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引用次数: 0
期刊
VLSI and Post-CMOS Electronics. Volume 1: Design, modelling and simulation
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