Pub Date : 2024-06-04DOI: 10.1088/2631-7990/ad5424
Zhiqi Fan, Qiyang Tan, Chengwei Kang, Han Huang
Ceramic oxides, renowned for their exceptional combination of mechanical, thermal, and chemical properties, are indispensable in numerous crucial applications across diverse engineering fields. However, conventional manufacturing methods frequently grapple with limitations, such as challenges in shaping intricate geometries, extended processing durations, elevated porosity, and substantial shrinkage deformations. Direct additive manufacturing (dAM) technology stands out as a state-of-the-art solution for ceramic oxides production. It facilitates the one-step fabrication of high-performance, intricately designed components characterized by dense structures. Importantly, dAM eliminates the necessity for post-heat treatments, streamlining the manufacturing process and enhancing overall efficiency. This study undertakes a comprehensive review of recent developments in dAM for ceramic oxides, with a specific emphasis on the laser powder bed fusion and laser directed energy deposition techniques. A thorough investigation is conducted into the shaping quality, microstructure, and properties of diverse ceramic oxides produced through dAM. Critical examination is given to key aspects including feedstock preparation, laser–material coupling, formation and control of defects, in-situ monitoring and simulation. This paper concludes by outlining future trends and potential breakthrough directions, taking into account current gaps in this rapidly evolving field.
陶瓷氧化物因其卓越的机械、热和化学特性而闻名，在各个工程领域的众多关键应用中都不可或缺。然而，传统的制造方法经常会遇到各种限制，例如难以塑造复杂的几何形状、加工时间过长、孔隙率过高以及收缩变形过大等问题。直接添加制造（dAM）技术是生产陶瓷氧化物的最先进解决方案。它有助于一步法制造高性能、设计复杂、结构致密的部件。重要的是，直接成型技术无需进行后热处理，从而简化了制造流程，提高了整体效率。本研究全面回顾了陶瓷氧化物 dAM 的最新发展，特别强调了激光粉末床熔融和激光定向能沉积技术。对通过 dAM 生产的各种陶瓷氧化物的成型质量、微观结构和性能进行了深入研究。对包括原料制备、激光与材料耦合、缺陷的形成与控制、原位监测和模拟等关键方面进行了严格审查。最后，考虑到这一快速发展领域目前存在的差距，本文概述了未来趋势和潜在的突破方向。
{"title":"Advances and Challenges in Direct Additive Manufacturing of Dense Ceramic Oxides","authors":"Zhiqi Fan, Qiyang Tan, Chengwei Kang, Han Huang","doi":"10.1088/2631-7990/ad5424","DOIUrl":"https://doi.org/10.1088/2631-7990/ad5424","url":null,"abstract":"\u0000 Ceramic oxides, renowned for their exceptional combination of mechanical, thermal, and chemical properties, are indispensable in numerous crucial applications across diverse engineering fields. However, conventional manufacturing methods frequently grapple with limitations, such as challenges in shaping intricate geometries, extended processing durations, elevated porosity, and substantial shrinkage deformations. Direct additive manufacturing (dAM) technology stands out as a state-of-the-art solution for ceramic oxides production. It facilitates the one-step fabrication of high-performance, intricately designed components characterized by dense structures. Importantly, dAM eliminates the necessity for post-heat treatments, streamlining the manufacturing process and enhancing overall efficiency. This study undertakes a comprehensive review of recent developments in dAM for ceramic oxides, with a specific emphasis on the laser powder bed fusion and laser directed energy deposition techniques. A thorough investigation is conducted into the shaping quality, microstructure, and properties of diverse ceramic oxides produced through dAM. Critical examination is given to key aspects including feedstock preparation, laser–material coupling, formation and control of defects, in-situ monitoring and simulation. This paper concludes by outlining future trends and potential breakthrough directions, taking into account current gaps in this rapidly evolving field.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"1 11","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-06-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141266216","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-06-03DOI: 10.1088/2631-7990/ad5391
Zijian Chen, Chi Zhang, Zijian Zheng
The burgeoning interest in flexible electronics necessitates the creation of patterning technology specifically tailored for flexible substrates and complex surface morphologies. Among a variety of patterning techniques, transfer printing emerges as one of the most efficient, cost-effective, and scalable methods. It boasts the ability for high-throughput fabrication of 0-3D micro- and nano-structures on flexible substrates, working in tandem with traditional lithography methods. This review highlights the critical issue of transfer printing: the flawless transfer of devices during the pick-up and printing process. We encapsulate recent advancements in numerous transfer printing techniques, with a particular emphasis on strategies to control adhesion forces at the substrate/device/stamp interfaces. These strategies are employed to meet the requirements of competing fractures for successful pick-up and print processes. The mechanism, advantages, disadvantages, and typical applications of each transfer printing technique will be thoroughly discussed. The conclusion section provides design guidelines and probes potential directions for future advancements.
{"title":"Advancements in Transfer Printing Techniques for Flexible Electronics: Adjusting Interfaces and Promoting Versatility","authors":"Zijian Chen, Chi Zhang, Zijian Zheng","doi":"10.1088/2631-7990/ad5391","DOIUrl":"https://doi.org/10.1088/2631-7990/ad5391","url":null,"abstract":"\u0000 The burgeoning interest in flexible electronics necessitates the creation of patterning technology specifically tailored for flexible substrates and complex surface morphologies. Among a variety of patterning techniques, transfer printing emerges as one of the most efficient, cost-effective, and scalable methods. It boasts the ability for high-throughput fabrication of 0-3D micro- and nano-structures on flexible substrates, working in tandem with traditional lithography methods. This review highlights the critical issue of transfer printing: the flawless transfer of devices during the pick-up and printing process. We encapsulate recent advancements in numerous transfer printing techniques, with a particular emphasis on strategies to control adhesion forces at the substrate/device/stamp interfaces. These strategies are employed to meet the requirements of competing fractures for successful pick-up and print processes. The mechanism, advantages, disadvantages, and typical applications of each transfer printing technique will be thoroughly discussed. The conclusion section provides design guidelines and probes potential directions for future advancements.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"22 4","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-06-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141271705","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Understanding the complex interactions between the work material and abrasives is a difficult and hot topic during grinding of Gallium nitride (GaN) single crystals. In this work, molecular dynamics (MD) simulations of double-grits interacted grinding of GaN crystals were performed, and the grinding force, coefficient of friction, stress distribution, plastic damage behaviors, and abrasive damage were systematically investigated. The results demonstrated that interacted distance with both radial and transverse directions achieved better grinding quality than that with only one direction or single-grit grinding. The grinding force, grinding induced stress, subsurface damage depth, and abrasive wear increases as the transverse interacted distance increases. However, the influence laws of the interacted distance on atom number of phase transition and dislocation length are not distinct. Appropriate interacted distances between abrasives can decrease grinding force, coefficient of friction, grinding induced stress, subsurface damage depth, and abrasive wear during the grinding process. Grinding test combined with the cross-sectional TEM detection verified the reliability of the simulated damage behaviors, i.e. amorphous, high-pressure phase transition, dislocations, stacking faults, and lattice distortions. The results not only enhance the understanding of damage accumulation and material removal caused by the coupling actions of abrasives in grinding process, but also provide a feasible approach for the wheel design of ordered abrasives.
在氮化镓（GaN）单晶的磨削过程中，理解工件材料与磨料之间复杂的相互作用是一个困难而热门的课题。本文对氮化镓晶体的双磨粒交互磨削进行了分子动力学（MD）模拟，系统研究了磨削力、摩擦系数、应力分布、塑性损伤行为和磨料损伤。结果表明，径向和横向交互距离的磨削质量优于单向或单粒磨削。随着横向交互距离的增加，磨削力、磨削诱导应力、表面下损伤深度和磨料磨损也随之增加。然而，相互作用距离对相变原子数和位错长度的影响规律并不明显。适当的磨料间相互作用距离可降低磨削过程中的磨削力、摩擦系数、磨削诱导应力、表面下损伤深度和磨料磨损。磨削试验结合横截面 TEM 检测验证了模拟损伤行为的可靠性，即非晶态、高压相变、位错、堆积断层和晶格畸变。这些结果不仅加深了对磨削过程中磨料耦合作用导致的损伤累积和材料去除的理解，而且为有序磨料的砂轮设计提供了可行的方法。
{"title":"Damage evolution and removal behaviors of GaN crystals involved in double-grits grinding","authors":"Chen Li, Yuxiu Hu, Zongze Wei, Chongjun Wu, Yunfeng Peng, Feihu Zhang, Yanquan Geng","doi":"10.1088/2631-7990/ad207f","DOIUrl":"https://doi.org/10.1088/2631-7990/ad207f","url":null,"abstract":"\u0000 Understanding the complex interactions between the work material and abrasives is a difficult and hot topic during grinding of Gallium nitride (GaN) single crystals. In this work, molecular dynamics (MD) simulations of double-grits interacted grinding of GaN crystals were performed, and the grinding force, coefficient of friction, stress distribution, plastic damage behaviors, and abrasive damage were systematically investigated. The results demonstrated that interacted distance with both radial and transverse directions achieved better grinding quality than that with only one direction or single-grit grinding. The grinding force, grinding induced stress, subsurface damage depth, and abrasive wear increases as the transverse interacted distance increases. However, the influence laws of the interacted distance on atom number of phase transition and dislocation length are not distinct. Appropriate interacted distances between abrasives can decrease grinding force, coefficient of friction, grinding induced stress, subsurface damage depth, and abrasive wear during the grinding process. Grinding test combined with the cross-sectional TEM detection verified the reliability of the simulated damage behaviors, i.e. amorphous, high-pressure phase transition, dislocations, stacking faults, and lattice distortions. The results not only enhance the understanding of damage accumulation and material removal caused by the coupling actions of abrasives in grinding process, but also provide a feasible approach for the wheel design of ordered abrasives.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"90 9","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-01-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139612932","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-12DOI: 10.1088/2631-7990/ad1e25
Yaqian Liu, Minrui Lian, Wei Chen, Huipeng Chen
The development of various artificial electronics and machines would explosive increase the information and data, which need to be processed in-situ remediation. Bioinspired synapse devices can store and process signals in a parallel way, then improve fault tolerance and decrease the power consumption of artificial systems. The organic field effect transistor (OFET) is a promising component for bioinspired neuromorphic systems because it is suitable for large-scale integrated circuits and flexible devices. In this review, the organic semiconductor materials, structures and fabrication, and different artificial sensory perception systems functions based on micro-sized neuromorphic OFET devices are summarized. Finally, a summary and challenges of neuromorphic OFET devices are provided. This review presents a detailed introduction to the recent progress of neuromorphic OFET devices from semiconductor materials to perception systems, which would provide a reference for the achievement of neuromorphic systems in future bioinspired electronics.
{"title":"Recent advances in fabrication and functions of neuromorphic system based on organic field effect transistor","authors":"Yaqian Liu, Minrui Lian, Wei Chen, Huipeng Chen","doi":"10.1088/2631-7990/ad1e25","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1e25","url":null,"abstract":"\u0000 The development of various artificial electronics and machines would explosive increase the information and data, which need to be processed in-situ remediation. Bioinspired synapse devices can store and process signals in a parallel way, then improve fault tolerance and decrease the power consumption of artificial systems. The organic field effect transistor (OFET) is a promising component for bioinspired neuromorphic systems because it is suitable for large-scale integrated circuits and flexible devices. In this review, the organic semiconductor materials, structures and fabrication, and different artificial sensory perception systems functions based on micro-sized neuromorphic OFET devices are summarized. Finally, a summary and challenges of neuromorphic OFET devices are provided. This review presents a detailed introduction to the recent progress of neuromorphic OFET devices from semiconductor materials to perception systems, which would provide a reference for the achievement of neuromorphic systems in future bioinspired electronics.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":" 3","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-01-12","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139624619","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-11DOI: 10.1088/2631-7990/ad1dca
Shuni Chen, Yanming Guo, Qinghui Pan, Yong Shuai
The burning of fossil fuels in industry results in significant carbon emissions, and the heat generated is often not fully utilized. For high-temperature industries, thermophotovoltaics (TPV) is an effective means of waste heat recovery. This review covers two aspects of high-efficiency TPV systems and industrial waste heat applications. At the system level, representative results of TPV complete systems, selective emitters and photovoltaic cells in the last decade are compiled, and key points of components to improve energy conversion efficiency is further analyzed. At the application level, the feasibility of TPV in high-temperature industrial applications is shown from the world waste heat utilization situation, and then the potential of TPV in waste heat recovery is illustrated with the steel industry as an example.
{"title":"A review on current development of thermophotovoltaic technology in heat recovery","authors":"Shuni Chen, Yanming Guo, Qinghui Pan, Yong Shuai","doi":"10.1088/2631-7990/ad1dca","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1dca","url":null,"abstract":"\u0000 The burning of fossil fuels in industry results in significant carbon emissions, and the heat generated is often not fully utilized. For high-temperature industries, thermophotovoltaics (TPV) is an effective means of waste heat recovery. This review covers two aspects of high-efficiency TPV systems and industrial waste heat applications. At the system level, representative results of TPV complete systems, selective emitters and photovoltaic cells in the last decade are compiled, and key points of components to improve energy conversion efficiency is further analyzed. At the application level, the feasibility of TPV in high-temperature industrial applications is shown from the world waste heat utilization situation, and then the potential of TPV in waste heat recovery is illustrated with the steel industry as an example.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":" 5","pages":""},"PeriodicalIF":0.0,"publicationDate":"2024-01-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139626538","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
There is a perpetual pursuit for free-form glasses and ceramics featuring outstanding mechanical properties as well as chemical and thermal resistance. It is a promising idea to shape inorganic materials in three-dimensional (3D) forms to reduce their weight while maintaining high mechanical properties. A popular strategy for the preparation of 3D inorganic materials is to mold the organic-inorganic hybrid photoresists into 3D micro- and nano-structures and remove the organic components by subsequent sintering. However, due to the discrete arrangement of inorganic components in the organic-inorganic hybrid photoresists, it remains a huge challenge to attain isotropic shrinkage during sintering. Herein, we demonstrate the isotropic sintering shrinkage by forming the consecutive -Si-O-Si-O-Zr-O- inorganic backbone in photoresists and fabricate 3D glass-ceramic nanolattices with enhanced mechanical properties. The femtosecond (fs) laser is used for two-photon polymerization (TPP) to fabricate 3D green body structures. After subsequent sintering at 1000 ℃, high-quality 3D glass-ceramic microstructures can be obtained with perfectly intact and smooth morphology. In-suit compression experiments and finite-element simulations reveal that octahedral-truss (Oct-Truss) lattices possess remarkable adeptness in bearing stress concentration and maintain the structural integrity to resist rod bending, indicating that this structure is a candidate for preparing lightweight and high stiffness glass-ceramic nanolattices. 3D printing of such glasses and ceramics has significant implications in a number of industrial applications, including metamaterials, microelectromechanical systems, photonic crystals, and damage-tolerant lightweight materials.
{"title":"Isotropic sintering shrinkage of 3D glass-ceramic nanolattices: backbone preforming and mechanical enhancement","authors":"Nianyao Chai, Yunfan Yue, Xiangyu Chen, Zhongle Zeng, Sheng Li, Xuewen Wang","doi":"10.1088/2631-7990/ad1857","DOIUrl":"https://doi.org/10.1088/2631-7990/ad1857","url":null,"abstract":"There is a perpetual pursuit for free-form glasses and ceramics featuring outstanding mechanical properties as well as chemical and thermal resistance. It is a promising idea to shape inorganic materials in three-dimensional (3D) forms to reduce their weight while maintaining high mechanical properties. A popular strategy for the preparation of 3D inorganic materials is to mold the organic-inorganic hybrid photoresists into 3D micro- and nano-structures and remove the organic components by subsequent sintering. However, due to the discrete arrangement of inorganic components in the organic-inorganic hybrid photoresists, it remains a huge challenge to attain isotropic shrinkage during sintering. Herein, we demonstrate the isotropic sintering shrinkage by forming the consecutive -Si-O-Si-O-Zr-O- inorganic backbone in photoresists and fabricate 3D glass-ceramic nanolattices with enhanced mechanical properties. The femtosecond (fs) laser is used for two-photon polymerization (TPP) to fabricate 3D green body structures. After subsequent sintering at 1000 ℃, high-quality 3D glass-ceramic microstructures can be obtained with perfectly intact and smooth morphology. In-suit compression experiments and finite-element simulations reveal that octahedral-truss (Oct-Truss) lattices possess remarkable adeptness in bearing stress concentration and maintain the structural integrity to resist rod bending, indicating that this structure is a candidate for preparing lightweight and high stiffness glass-ceramic nanolattices. 3D printing of such glasses and ceramics has significant implications in a number of industrial applications, including metamaterials, microelectromechanical systems, photonic crystals, and damage-tolerant lightweight materials.","PeriodicalId":502508,"journal":{"name":"International Journal of Extreme Manufacturing","volume":"58 6","pages":""},"PeriodicalIF":0.0,"publicationDate":"2023-12-22","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139164334","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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