Pub Date : 2024-03-20DOI: 10.1109/mie.2024.3358067
Victor Huang
{"title":"InterOp 2023 at IECON 2023 [News in Industry Activities]","authors":"Victor Huang","doi":"10.1109/mie.2024.3358067","DOIUrl":"https://doi.org/10.1109/mie.2024.3358067","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"26 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140182663","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-03-20DOI: 10.1109/mie.2024.3357997
Victor Huang
{"title":"IES Industry Forums Fall 2023 Series: ETFA, IECON, and ONCON [News in Industry Activities]","authors":"Victor Huang","doi":"10.1109/mie.2024.3357997","DOIUrl":"https://doi.org/10.1109/mie.2024.3357997","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"7 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-03-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"140182680","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-02-14DOI: 10.1109/mie.2023.3321390
Wenbin Dai, Paulo Leitao, Kim Fung Tsang, Yang Shi, Gerhard Hancke, Lei Shu, Moris Behnam, Jan Haase, Valeriy Vyatkin
{"title":"Synergies of Operation, Information, and Communication Technology for Solving New Societal and Industrial Challenges: Future Directions","authors":"Wenbin Dai, Paulo Leitao, Kim Fung Tsang, Yang Shi, Gerhard Hancke, Lei Shu, Moris Behnam, Jan Haase, Valeriy Vyatkin","doi":"10.1109/mie.2023.3321390","DOIUrl":"https://doi.org/10.1109/mie.2023.3321390","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"1 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-02-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139952848","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2024-01-25DOI: 10.1109/mie.2023.3328106
Silvia García-Méndez, Francisco De Arriba-Pérez, María Del Carmen Somoza-López
{"title":"Informatics and Dairy Industry Coalition: Artificial Intelligence Trends and Present Challenges","authors":"Silvia García-Méndez, Francisco De Arriba-Pérez, María Del Carmen Somoza-López","doi":"10.1109/mie.2023.3328106","DOIUrl":"https://doi.org/10.1109/mie.2023.3328106","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"142 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-01-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"139952839","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-14DOI: 10.1109/mie.2023.3323158
Mariusz Malinowski
In the first part of my column, I start with congratulations. I want to extend congratulations to Prof. Giuseppe Buja, our longtime Administrative Committee (AdCom) member, who received the prestigious Richard Harold Kaufman IEEE Technical Field Award for outstanding contributions in industrial systems “for fundamental contributions to modulation and control of industrial drives,” and Prof. Milos Manic, our president-elect, who was inducted into the U.S. National Academy of Inventors as a senior member. Congratulations!
在我的专栏的第一部分,我首先表示祝贺。我要向Giuseppe Buja教授表示祝贺,他是我们的长期行政委员会(AdCom)成员,因在工业系统方面的杰出贡献而获得了著名的Richard Harold Kaufman IEEE技术领域奖,“对工业驱动的调制和控制做出了根本性贡献”,以及我们的当选总统Milos Manic教授,他被选入美国国家发明家学会作为高级成员。恭喜你!
{"title":"Half century of the Annual Conference of the IEEE Industrial Electronics Society (IECON) [Message From the President]","authors":"Mariusz Malinowski","doi":"10.1109/mie.2023.3323158","DOIUrl":"https://doi.org/10.1109/mie.2023.3323158","url":null,"abstract":"In the first part of my column, I start with congratulations. I want to extend congratulations to Prof. Giuseppe Buja, our longtime Administrative Committee (AdCom) member, who received the prestigious Richard Harold Kaufman IEEE Technical Field Award for outstanding contributions in industrial systems “for fundamental contributions to modulation and control of industrial drives,” and Prof. Milos Manic, our president-elect, who was inducted into the U.S. National Academy of Inventors as a senior member. Congratulations!","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"29 3","pages":""},"PeriodicalIF":6.3,"publicationDate":"2023-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138634808","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-12-14DOI: 10.1109/mie.2023.3325495
Kim Fung Tsang
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供社会信息,可能包括新闻,评论或技术笔记,从业者和研究人员应该感兴趣。
{"title":"The Second International Forum on Internet of Things and Intelligent Applications [Chapter News]","authors":"Kim Fung Tsang","doi":"10.1109/mie.2023.3325495","DOIUrl":"https://doi.org/10.1109/mie.2023.3325495","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"102 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2023-12-14","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"138635004","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}