首页 > 最新文献

IEEE Industrial Electronics Magazine最新文献

英文 中文
Interoperability in Software-Defined Process Automation Using the Open Process Automation Standard and IEC 61499: Adapter Connections of IEC 61499 and OPAS Enable Plug-and-Play Integration 使用开放式过程自动化标准和 IEC 61499 实现软件定义过程自动化的互操作性:IEC 61499 和 OPAS 的适配器连接实现了即插即用集成
IF 6.3 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-08-28 DOI: 10.1109/mie.2024.3442448
Pranay Jhunjhunwala, S. Stephen Bitar, Kirill Zhukovskii, Udayanto Dwi Atomojo, Valeriy Vyatkin
{"title":"Interoperability in Software-Defined Process Automation Using the Open Process Automation Standard and IEC 61499: Adapter Connections of IEC 61499 and OPAS Enable Plug-and-Play Integration","authors":"Pranay Jhunjhunwala, S. Stephen Bitar, Kirill Zhukovskii, Udayanto Dwi Atomojo, Valeriy Vyatkin","doi":"10.1109/mie.2024.3442448","DOIUrl":"https://doi.org/10.1109/mie.2024.3442448","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"7 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-08-28","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142090126","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Tech RXIV: Share Your Preprint Research with the World! IEEE Tech RXIV:与世界分享您的预印本研究成果!
IF 6.3 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1109/mie.2024.3413120
{"title":"IEEE Tech RXIV: Share Your Preprint Research with the World!","authors":"","doi":"10.1109/mie.2024.3413120","DOIUrl":"https://doi.org/10.1109/mie.2024.3413120","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"21 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141545866","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Industrial Internet of Things and Machine Learning: New Synergies, Applications, and Challenges 工业物联网和机器学习:新的协同效应、应用和挑战
IF 6.3 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1109/mie.2024.3392088
Eric Monmasson
This spring issue is devoted to the new synergies between the Industrial Internet of Things (IIoT) and machine learning (ML) technologies. At the junction of industrial electronics and industrial informatics, the IIoT is one of the most dynamic topics of our research community, and when combined with the recent and significant advancements of ML, it represents huge potential for innovation in many fields of application, like Industry 4.0, transportation, energy, and much more.
本期春季刊专门讨论工业物联网(IIoT)与机器学习(ML)技术之间的新协同作用。IIoT 是工业电子学和工业信息学的结合点,是我们研究界最具活力的课题之一,如果与最近取得重大进展的 ML 相结合,它将为工业 4.0、交通、能源等许多应用领域带来巨大的创新潜力。
{"title":"Industrial Internet of Things and Machine Learning: New Synergies, Applications, and Challenges","authors":"Eric Monmasson","doi":"10.1109/mie.2024.3392088","DOIUrl":"https://doi.org/10.1109/mie.2024.3392088","url":null,"abstract":"This spring issue is devoted to the new synergies between the Industrial Internet of Things (IIoT) and machine learning (ML) technologies. At the junction of industrial electronics and industrial informatics, the IIoT is one of the most dynamic topics of our research community, and when combined with the recent and significant advancements of ML, it represents huge potential for innovation in many fields of application, like Industry 4.0, transportation, energy, and much more.","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"20 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141545802","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Extraordinary Women-in-IES Webinars and WIE Lectures at ONCON 2023 [Women in IES News] 2023 年国际教育大会(ONCON 2023)上的非凡国际教育专业妇女网络研讨会和 WIE 讲座 [国际教育专业妇女新闻
IF 6.3 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1109/mie.2024.3392070
Ya-Jun Pan
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供从业人员和研究人员感兴趣的社会信息,包括新闻、评论或技术说明。
{"title":"Extraordinary Women-in-IES Webinars and WIE Lectures at ONCON 2023 [Women in IES News]","authors":"Ya-Jun Pan","doi":"10.1109/mie.2024.3392070","DOIUrl":"https://doi.org/10.1109/mie.2024.3392070","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"53 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141545854","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IES Moving Faster Than Ever—United, Collaborative, With Novel Entry Points for Young Leaders [Message From the President] 国际教育规划研究所比以往任何时候都发展得更快--团结协作,为青年领袖提供新的切入点 [校长致辞]
IF 6.3 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1109/mie.2024.3409092
Milos Manic
It gives me a great pleasure to address IEEE Industrial Electronics Society (IES) membership in this June edition of IEEE Industrial Electronics Magazine. At the time of writing this column, we are preparing for our June Administrative Committee (AdCom) to be held in Ulsan, Korea. I am thrilled to report that the changes we have implemented this year have brought great dividends already.
我非常高兴在本期六月刊《IEEE 工业电子杂志》上向 IEEE 工业电子学会 (IES) 会员致辞。在撰写本专栏时,我们正在筹备将于 6 月在韩国蔚山举行的行政委员会 (AdCom)。我很高兴地向大家报告,我们今年实施的变革已经带来了巨大的收益。
{"title":"IES Moving Faster Than Ever—United, Collaborative, With Novel Entry Points for Young Leaders [Message From the President]","authors":"Milos Manic","doi":"10.1109/mie.2024.3409092","DOIUrl":"https://doi.org/10.1109/mie.2024.3409092","url":null,"abstract":"It gives me a great pleasure to address IEEE Industrial Electronics Society (IES) membership in this June edition of <italic xmlns:mml=\"http://www.w3.org/1998/Math/MathML\" xmlns:xlink=\"http://www.w3.org/1999/xlink\">IEEE Industrial Electronics Magazine</i>\u0000. At the time of writing this column, we are preparing for our June Administrative Committee (AdCom) to be held in Ulsan, Korea. I am thrilled to report that the changes we have implemented this year have brought great dividends already.","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"108 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141545803","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Prof. Sri Niwas Singh Delivers a Distinguished Lecture at the IEEE IES Madhya Pradesh Chapter [Society News] Sri Niwas Singh 教授在 IEEE IES 中央邦分会发表杰出演讲 [学会新闻]
IF 6.3 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1109/mie.2024.3392075
Óscar Lucía
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供从业人员和研究人员感兴趣的社会信息,包括新闻、评论或技术说明。
{"title":"Prof. Sri Niwas Singh Delivers a Distinguished Lecture at the IEEE IES Madhya Pradesh Chapter [Society News]","authors":"Óscar Lucía","doi":"10.1109/mie.2024.3392075","DOIUrl":"https://doi.org/10.1109/mie.2024.3392075","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"27 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141545850","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
DC–DC Converter Topologies: Basic to Advanced [Book News] 直流-直流转换器拓扑:从基础到高级 [图书新闻]
IF 6.3 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1109/mie.2024.3392028
Giovanni Spagnuolo
Presents reviews for the following list of books, DC–DC Converter Topologies: Basic to Advanced.
介绍以下书单的评论:《直流-直流转换器拓扑:从基础到高级。
{"title":"DC–DC Converter Topologies: Basic to Advanced [Book News]","authors":"Giovanni Spagnuolo","doi":"10.1109/mie.2024.3392028","DOIUrl":"https://doi.org/10.1109/mie.2024.3392028","url":null,"abstract":"Presents reviews for the following list of books, DC–DC Converter Topologies: Basic to Advanced.","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"66 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141545855","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Access IEEE Access
IF 6.3 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1109/mie.2024.3413248
{"title":"IEEE Access","authors":"","doi":"10.1109/mie.2024.3413248","DOIUrl":"https://doi.org/10.1109/mie.2024.3413248","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"53 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141545863","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE App IEEE 应用程序
IF 6.3 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1109/mie.2024.3413119
{"title":"IEEE App","authors":"","doi":"10.1109/mie.2024.3413119","DOIUrl":"https://doi.org/10.1109/mie.2024.3413119","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"21 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141545869","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Proceedings 电气和电子工程师学会论文集
IF 6.3 2区 工程技术 Q1 ENGINEERING, ELECTRICAL & ELECTRONIC Pub Date : 2024-07-04 DOI: 10.1109/mie.2024.3413229
{"title":"IEEE Proceedings","authors":"","doi":"10.1109/mie.2024.3413229","DOIUrl":"https://doi.org/10.1109/mie.2024.3413229","url":null,"abstract":"","PeriodicalId":55600,"journal":{"name":"IEEE Industrial Electronics Magazine","volume":"1515 1","pages":""},"PeriodicalIF":6.3,"publicationDate":"2024-07-04","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141545868","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":2,"RegionCategory":"工程技术","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
IEEE Industrial Electronics Magazine
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1