首页 > 最新文献

IEEE Solid-State Circuits Magazine最新文献

英文 中文
“Synergy Unveiled”: Rendering the path to innovation: Sri Sai Ram Engineering College, SSCS Student Branch [Chapters] "揭开协同效应的面纱渲染创新之路:斯里赛拉姆工程学院,SSCS学生分会 [章节]
Pub Date : 2024-08-23 DOI: 10.1109/MSSC.2024.3417788
L. Kurinjimalar
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供从业人员和研究人员感兴趣的社会信息,包括新闻、评论或技术说明。
{"title":"“Synergy Unveiled”: Rendering the path to innovation: Sri Sai Ram Engineering College, SSCS Student Branch [Chapters]","authors":"L. Kurinjimalar","doi":"10.1109/MSSC.2024.3417788","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3417788","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 3","pages":"90-91"},"PeriodicalIF":0.0,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10645531","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142045134","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
SSCS Utah Chapter Update [Chapters] SSCS 犹他州分会最新情况 [章节]
Pub Date : 2024-08-23 DOI: 10.1109/MSSC.2024.3417770
Jared Bytheway
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供从业人员和研究人员感兴趣的社会信息,包括新闻、评论或技术说明。
{"title":"SSCS Utah Chapter Update [Chapters]","authors":"Jared Bytheway","doi":"10.1109/MSSC.2024.3417770","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3417770","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 3","pages":"88-89"},"PeriodicalIF":0.0,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10645517","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142045235","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Process-Scalable and Loew-Power Amplifiers: Progress and prospects in dynamic amplifier research 过程可变和 Loew 功率放大器:动态放大器研究的进展与前景
Pub Date : 2024-08-23 DOI: 10.1109/MSSC.2024.3416094
Sein Oh;Minkyu Je
Amplifiers are critical components in many applications. They simply perform signal amplification, but real-world implementation must consider several challenges, such as finite BW, signal distortion, noise, stability, and so on. Solutions to these problems typically involve circuit techniques that lead to high power consumption. Therefore, numerous studies have been conducted to break the tradeoff between performance and power. Among the most promising candidates is the current-reuse structure [1], [2], [3], [4], [5], [6]. Such amplifiers have continuously improved their power efficiency factor (PEF) performance year by year. However, there are essential limitations to consider. First, the supply voltage significantly decreases as the process node advances. This process scaling not only makes it challenging for amplifiers to achieve high gain but also significantly degrades linearity. Second, conventional amplifiers, meaning continuous-time (CT) amplifiers, operate with a static current. While better PEFs of CT amplifiers improve overall performance envelopes in many CT-domain applications, they exhibit clear limitations in discrete-time (DT)-domain or mixed-signal applications.
放大器是许多应用中的关键元件。它们只需进行信号放大,但在实际应用中必须考虑几个挑战,如有限的 BW、信号失真、噪声、稳定性等。这些问题的解决方案通常涉及导致高功耗的电路技术。因此,为了打破性能与功耗之间的平衡,人们进行了大量研究。其中最有前途的候选方案是电流重复使用结构 [1]、[2]、[3]、[4]、[5]、[6]。这类放大器的功率效率因子(PEF)性能逐年提高。然而,也有一些基本限制需要考虑。首先,随着工艺节点的发展,电源电压会明显降低。这种工艺缩放不仅给放大器实现高增益带来了挑战,而且还大大降低了线性度。其次,传统放大器,即连续时间(CT)放大器,以静态电流工作。虽然 CT 放大器更好的 PEF 改善了许多 CT 域应用的整体性能范围,但在离散时间 (DT) 域或混合信号应用中却表现出明显的局限性。
{"title":"Process-Scalable and Loew-Power Amplifiers: Progress and prospects in dynamic amplifier research","authors":"Sein Oh;Minkyu Je","doi":"10.1109/MSSC.2024.3416094","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3416094","url":null,"abstract":"Amplifiers are critical components in many applications. They simply perform signal amplification, but real-world implementation must consider several challenges, such as finite BW, signal distortion, noise, stability, and so on. Solutions to these problems typically involve circuit techniques that lead to high power consumption. Therefore, numerous studies have been conducted to break the tradeoff between performance and power. Among the most promising candidates is the current-reuse structure \u0000<xref>[1]</xref>\u0000, \u0000<xref>[2]</xref>\u0000, \u0000<xref>[3]</xref>\u0000, \u0000<xref>[4]</xref>\u0000, \u0000<xref>[5]</xref>\u0000, \u0000<xref>[6]</xref>\u0000. Such amplifiers have continuously improved their power efficiency factor (PEF) performance year by year. However, there are essential limitations to consider. First, the supply voltage significantly decreases as the process node advances. This process scaling not only makes it challenging for amplifiers to achieve high gain but also significantly degrades linearity. Second, conventional amplifiers, meaning continuous-time (CT) amplifiers, operate with a static current. While better PEFs of CT amplifiers improve overall performance envelopes in many CT-domain applications, they exhibit clear limitations in discrete-time (DT)-domain or mixed-signal applications.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 3","pages":"55-66"},"PeriodicalIF":0.0,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142045230","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Prolific Innovator Was Inspired by Visionary Professor James D. Meindl [Society News] 富有远见的詹姆斯-迈德尔教授启发了一位多产的创新者 [社会新闻]
Pub Date : 2024-08-23 DOI: 10.1109/MSSC.2024.3417054
Michael Deering
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供从业人员和研究人员感兴趣的社会信息,包括新闻、评论或技术说明。
{"title":"A Prolific Innovator Was Inspired by Visionary Professor James D. Meindl [Society News]","authors":"Michael Deering","doi":"10.1109/MSSC.2024.3417054","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3417054","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 3","pages":"67-68"},"PeriodicalIF":0.0,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10645507","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142045243","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
A Brief History of SEDRA/SMITH: Microelectronic Circuits [Society News] SEDRA/SMITH 简史:微电子电路 [社会新闻]
Pub Date : 2024-08-23 DOI: 10.1109/MSSC.2024.3419488
Adel Sedra
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供从业人员和研究人员感兴趣的社会信息,包括新闻、评论或技术说明。
{"title":"A Brief History of SEDRA/SMITH: Microelectronic Circuits [Society News]","authors":"Adel Sedra","doi":"10.1109/MSSC.2024.3419488","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3419488","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 3","pages":"75-79"},"PeriodicalIF":0.0,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10645499","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142045264","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE Tech RXVI Filler IEEE Tech RXVI 填料
Pub Date : 2024-08-23 DOI: 10.1109/MSSC.2024.3435210
{"title":"IEEE Tech RXVI Filler","authors":"","doi":"10.1109/MSSC.2024.3435210","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3435210","url":null,"abstract":"","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 3","pages":"C4-C4"},"PeriodicalIF":0.0,"publicationDate":"2024-08-23","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10645332","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"142045179","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
IEEE CASS/EDS/SSCS HUST Student Branch Chapter Organizes Themed Social Event and Robot Chips Lecture Series [Chapters] IEEE CASS/EDS/SSCS 华中科技大学学生分会举办主题社交活动和机器人芯片系列讲座 [章节]。
Pub Date : 2024-07-03 DOI: 10.1109/MSSC.2024.3391413
Yuansheng Zhao;Chao Wang
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供从业人员和研究人员感兴趣的社会信息,包括新闻、评论或技术说明。
{"title":"IEEE CASS/EDS/SSCS HUST Student Branch Chapter Organizes Themed Social Event and Robot Chips Lecture Series [Chapters]","authors":"Yuansheng Zhao;Chao Wang","doi":"10.1109/MSSC.2024.3391413","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3391413","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 2","pages":"114-115"},"PeriodicalIF":0.0,"publicationDate":"2024-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10584387","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141500199","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Kristofer S. J. Pister, Borivoje Nikolic, and Ali M. Niknejad Receive the 2024 IEEE Solid-State Circuits Society Innovative Education Award [Awards] Kristofer S. J. Pister、Borivoje Nikolic 和 Ali M. Niknejad 荣获 2024 年度 IEEE 固态电路学会创新教育奖 [奖项]
Pub Date : 2024-07-03 DOI: 10.1109/MSSC.2024.3389412
Danielle Marinese
Presents the recipients of IEEE SSCS Innovative Education awards for 2024.
颁发 2024 年度 IEEE SSCS 创新教育奖。
{"title":"Kristofer S. J. Pister, Borivoje Nikolic, and Ali M. Niknejad Receive the 2024 IEEE Solid-State Circuits Society Innovative Education Award [Awards]","authors":"Danielle Marinese","doi":"10.1109/MSSC.2024.3389412","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3389412","url":null,"abstract":"Presents the recipients of IEEE SSCS Innovative Education awards for 2024.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 2","pages":"125-127"},"PeriodicalIF":0.0,"publicationDate":"2024-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10584392","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141500265","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
Pulse of Innovation: Engineering Tomorrow’s Innovators Today—IEEE SSCS Sri Sai Ram Engineering College Student Branch Chapter [Chapters] 创新的脉搏:明日创新者的今日工程--IEEE SSCS 斯里兰卡赛拉姆工程学院学生分会 [章节]
Pub Date : 2024-07-03 DOI: 10.1109/MSSC.2024.3391414
L. Kurinjimalar
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供从业人员和研究人员感兴趣的社会信息,包括新闻、评论或技术说明。
{"title":"Pulse of Innovation: Engineering Tomorrow’s Innovators Today—IEEE SSCS Sri Sai Ram Engineering College Student Branch Chapter [Chapters]","authors":"L. Kurinjimalar","doi":"10.1109/MSSC.2024.3391414","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3391414","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 2","pages":"116-117"},"PeriodicalIF":0.0,"publicationDate":"2024-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10584409","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141500354","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
ISSCC 2024 Circuit Insights : An In-Person Event Bringing Students Together From the United States and Canada [Conference Reports] ISSCC 2024 电路透视:美国和加拿大学生齐聚一堂的现场活动 [会议报告]
Pub Date : 2024-07-03 DOI: 10.1109/MSSC.2024.3393075
Ali Sheikholeslami
Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.
提供从业人员和研究人员感兴趣的社会信息,包括新闻、评论或技术说明。
{"title":"ISSCC 2024 Circuit Insights <isscc.org/insights>: An In-Person Event Bringing Students Together From the United States and Canada [Conference Reports]","authors":"Ali Sheikholeslami","doi":"10.1109/MSSC.2024.3393075","DOIUrl":"https://doi.org/10.1109/MSSC.2024.3393075","url":null,"abstract":"Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.","PeriodicalId":100636,"journal":{"name":"IEEE Solid-State Circuits Magazine","volume":"16 2","pages":"145-146"},"PeriodicalIF":0.0,"publicationDate":"2024-07-03","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"https://ieeexplore.ieee.org/stamp/stamp.jsp?tp=&arnumber=10584395","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"141500391","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"OA","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
引用次数: 0
期刊
IEEE Solid-State Circuits Magazine
全部 Acc. Chem. Res. ACS Applied Bio Materials ACS Appl. Electron. Mater. ACS Appl. Energy Mater. ACS Appl. Mater. Interfaces ACS Appl. Nano Mater. ACS Appl. Polym. Mater. ACS BIOMATER-SCI ENG ACS Catal. ACS Cent. Sci. ACS Chem. Biol. ACS Chemical Health & Safety ACS Chem. Neurosci. ACS Comb. Sci. ACS Earth Space Chem. ACS Energy Lett. ACS Infect. Dis. ACS Macro Lett. ACS Mater. Lett. ACS Med. Chem. Lett. ACS Nano ACS Omega ACS Photonics ACS Sens. ACS Sustainable Chem. Eng. ACS Synth. Biol. Anal. Chem. BIOCHEMISTRY-US Bioconjugate Chem. BIOMACROMOLECULES Chem. Res. Toxicol. Chem. Rev. Chem. Mater. CRYST GROWTH DES ENERG FUEL Environ. Sci. Technol. Environ. Sci. Technol. Lett. Eur. J. Inorg. Chem. IND ENG CHEM RES Inorg. Chem. J. Agric. Food. Chem. J. Chem. Eng. Data J. Chem. Educ. J. Chem. Inf. Model. J. Chem. Theory Comput. J. Med. Chem. J. Nat. Prod. J PROTEOME RES J. Am. Chem. Soc. LANGMUIR MACROMOLECULES Mol. Pharmaceutics Nano Lett. Org. Lett. ORG PROCESS RES DEV ORGANOMETALLICS J. Org. Chem. J. Phys. Chem. J. Phys. Chem. A J. Phys. Chem. B J. Phys. Chem. C J. Phys. Chem. Lett. Analyst Anal. Methods Biomater. Sci. Catal. Sci. Technol. Chem. Commun. Chem. Soc. Rev. CHEM EDUC RES PRACT CRYSTENGCOMM Dalton Trans. Energy Environ. Sci. ENVIRON SCI-NANO ENVIRON SCI-PROC IMP ENVIRON SCI-WAT RES Faraday Discuss. Food Funct. Green Chem. Inorg. Chem. Front. Integr. Biol. J. Anal. At. Spectrom. J. Mater. Chem. A J. Mater. Chem. B J. Mater. Chem. C Lab Chip Mater. Chem. Front. Mater. Horiz. MEDCHEMCOMM Metallomics Mol. Biosyst. Mol. Syst. Des. Eng. Nanoscale Nanoscale Horiz. Nat. Prod. Rep. New J. Chem. Org. Biomol. Chem. Org. Chem. Front. PHOTOCH PHOTOBIO SCI PCCP Polym. Chem.
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
0
微信
客服QQ
Book学术公众号 扫码关注我们
反馈
×
意见反馈
请填写您的意见或建议
请填写您的手机或邮箱
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
现在去查看 取消
×
提示
确定
Book学术官方微信
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术
文献互助 智能选刊 最新文献 互助须知 联系我们:info@booksci.cn
Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。
Copyright © 2023 Book学术 All rights reserved.
ghs 京公网安备 11010802042870号 京ICP备2023020795号-1