Pub Date : 2023-02-01DOI: 10.1109/3D-PEIM55914.2023.10052133
Ghaleb Al Duhni, J. Volakis, P. Raj
This paper presents electromagnetic interference (EMI) analysis and the performance of graphene-enhanced shielding. Two types of graphene have practical relevance. The first is synthesized through Chemical Vapor Deposition (CVD) techniques as thin films (1–5 μm) that feature pristine quality and high conductivity. The second type is based on polymer composite films that typically have a thickness of 100–200 μm with lower electrical conductivity but effortless scalability. The first part of the paper studies the shielding effectiveness (SE) of the 5 μm graphene film that has 80% electrical conductivity of that of copper (Cu). Using the NSA 65-6 standard set-up, a SE of 25–36 dB was achieved in the frequency range of 30–100 MHz. Alternatively, using the IEEE 299 standard, the SE of the same graphene varies between 33–41 dB. The second part of the paper demonstrates two simulation scenarios for communication and mobile circuits. The first scenario represents the coupling between an inductor and a planar inverted F antenna (PIFA) antenna. The second scenario expresses the EMI between a PIFA antenna and an aggressor IC like Power Management Integrated Chip (PMIC) modeled by a patch antenna. Both scenarios operate at the LTE band frequency. In Scenario#1, an isolation of 60 dB is observed between the shielded inductor and the PIFA antenna using a graphene EMI shield. Based on the second scenario, graphene films are shown to be suitable for EMI shielding between active devices, such as PMIC, and RF components. This shielding helps to enhance the isolation by 10 dB compared to standard metal shields when operating in the WiFi band (2.4 GHz). The last part of the paper compares the SE of thin versus thick graphene composite films. Thick composite films with lower electrical conductivity offer higher SE than thinner films of higher electrical conductivity based on the NSA 65-6 standard. However, when using the IEEE 299 standard, both thick and thin graphene films exhibit the same SE.
{"title":"EMI Shielding Performance of Thin and Thick Graphene Films Placed Within Integrated Power Modules","authors":"Ghaleb Al Duhni, J. Volakis, P. Raj","doi":"10.1109/3D-PEIM55914.2023.10052133","DOIUrl":"https://doi.org/10.1109/3D-PEIM55914.2023.10052133","url":null,"abstract":"This paper presents electromagnetic interference (EMI) analysis and the performance of graphene-enhanced shielding. Two types of graphene have practical relevance. The first is synthesized through Chemical Vapor Deposition (CVD) techniques as thin films (1–5 μm) that feature pristine quality and high conductivity. The second type is based on polymer composite films that typically have a thickness of 100–200 μm with lower electrical conductivity but effortless scalability. The first part of the paper studies the shielding effectiveness (SE) of the 5 μm graphene film that has 80% electrical conductivity of that of copper (Cu). Using the NSA 65-6 standard set-up, a SE of 25–36 dB was achieved in the frequency range of 30–100 MHz. Alternatively, using the IEEE 299 standard, the SE of the same graphene varies between 33–41 dB. The second part of the paper demonstrates two simulation scenarios for communication and mobile circuits. The first scenario represents the coupling between an inductor and a planar inverted F antenna (PIFA) antenna. The second scenario expresses the EMI between a PIFA antenna and an aggressor IC like Power Management Integrated Chip (PMIC) modeled by a patch antenna. Both scenarios operate at the LTE band frequency. In Scenario#1, an isolation of 60 dB is observed between the shielded inductor and the PIFA antenna using a graphene EMI shield. Based on the second scenario, graphene films are shown to be suitable for EMI shielding between active devices, such as PMIC, and RF components. This shielding helps to enhance the isolation by 10 dB compared to standard metal shields when operating in the WiFi band (2.4 GHz). The last part of the paper compares the SE of thin versus thick graphene composite films. Thick composite films with lower electrical conductivity offer higher SE than thinner films of higher electrical conductivity based on the NSA 65-6 standard. However, when using the IEEE 299 standard, both thick and thin graphene films exhibit the same SE.","PeriodicalId":106578,"journal":{"name":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"23 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126904138","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-02-01DOI: 10.1109/3D-PEIM55914.2023.10052175
Gang Liu, O. Causse
NMOS/NLDMOS LSS dead-time minority carrier isolation is critical for Synchronous Step-down converter products both for reliability and die size cost. We evaluate MAAP isolation ring design effectiveness using TCAD simulation with 1, 10 and 100uA/um dead-time currents. Instead of using a simple diode as injection source, we took a wholistic approach to include the LSS NMOS or NLDMOS in the test structures. Transient simulation results show that instead of body diode, MOS channels conduct most of the current. This is verified by NMOS and NLDMOS transistor silicon material measurements. With the low level of actual body diode current and substrate electron injection, we found there is a lot of room to achieve high performance minority carrier isolation and significant die size cost reduction on the isolation ring region at the same time.
{"title":"NMOS/NLDMOS LSS dead-time minority carrier isolation optimization","authors":"Gang Liu, O. Causse","doi":"10.1109/3D-PEIM55914.2023.10052175","DOIUrl":"https://doi.org/10.1109/3D-PEIM55914.2023.10052175","url":null,"abstract":"NMOS/NLDMOS LSS dead-time minority carrier isolation is critical for Synchronous Step-down converter products both for reliability and die size cost. We evaluate MAAP isolation ring design effectiveness using TCAD simulation with 1, 10 and 100uA/um dead-time currents. Instead of using a simple diode as injection source, we took a wholistic approach to include the LSS NMOS or NLDMOS in the test structures. Transient simulation results show that instead of body diode, MOS channels conduct most of the current. This is verified by NMOS and NLDMOS transistor silicon material measurements. With the low level of actual body diode current and substrate electron injection, we found there is a lot of room to achieve high performance minority carrier isolation and significant die size cost reduction on the isolation ring region at the same time.","PeriodicalId":106578,"journal":{"name":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"40 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"126328743","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-02-01DOI: 10.1109/3D-PEIM55914.2023.10052364
S. M. S. H. Rafin, Rejaul Islam, O. Mohammed
A detailed assessment of high-power wind energy systems is offered in this work, with an emphasis on electrical technology. The application of power electronics in wind turbine systems is discussed in this study. The use of power electronics in several types of wind turbine generation systems is demonstrated. After this brief review, it can be seen from the two-level converter the Parallel BTB 2L-VSCs with Common DC-Link and the multi-level converter, the three-level Neutral Point diode Clamped back-to-back topology (3L NPC-BTB) shows great performance.
{"title":"Power Electronic Converters for Wind Power Generation","authors":"S. M. S. H. Rafin, Rejaul Islam, O. Mohammed","doi":"10.1109/3D-PEIM55914.2023.10052364","DOIUrl":"https://doi.org/10.1109/3D-PEIM55914.2023.10052364","url":null,"abstract":"A detailed assessment of high-power wind energy systems is offered in this work, with an emphasis on electrical technology. The application of power electronics in wind turbine systems is discussed in this study. The use of power electronics in several types of wind turbine generation systems is demonstrated. After this brief review, it can be seen from the two-level converter the Parallel BTB 2L-VSCs with Common DC-Link and the multi-level converter, the three-level Neutral Point diode Clamped back-to-back topology (3L NPC-BTB) shows great performance.","PeriodicalId":106578,"journal":{"name":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"98 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116958430","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-02-01DOI: 10.1109/3D-PEIM55914.2023.10052535
S. M. S. H. Rafin, Md. Asikul Haque, Rejaul Islam, O. Mohammed
The vehicular sector is undergoing an electric revolution, and the aircraft industry is expected to be able to embrace fundamental disruption. The impact on the environment, cost savings, maintenance, noise pollution, and safety benefits of switching to electric aircraft are undisputable. Nonetheless, several technical challenges must be overcome before electric airplanes can be built to meet public acceptance and trust. This paper presents a state-of-the-art review of airplane electrification. This review paper also investigates challenges such as electric power increase, and voltage bus increase to name a few. Moreover, ways of reducing them such as wide bandgap (WBG) devices, system integration, etc. This paper also investigates several tremendous power electric converter topologies with their features and shortcomings. Furthermore, the performance of electric airplanes is greatly influenced by power electronics. Therefore, safety, efficiency, power density, and power quality were considered.
{"title":"A Review of Power Electronic Converters for Electric Aircrafts","authors":"S. M. S. H. Rafin, Md. Asikul Haque, Rejaul Islam, O. Mohammed","doi":"10.1109/3D-PEIM55914.2023.10052535","DOIUrl":"https://doi.org/10.1109/3D-PEIM55914.2023.10052535","url":null,"abstract":"The vehicular sector is undergoing an electric revolution, and the aircraft industry is expected to be able to embrace fundamental disruption. The impact on the environment, cost savings, maintenance, noise pollution, and safety benefits of switching to electric aircraft are undisputable. Nonetheless, several technical challenges must be overcome before electric airplanes can be built to meet public acceptance and trust. This paper presents a state-of-the-art review of airplane electrification. This review paper also investigates challenges such as electric power increase, and voltage bus increase to name a few. Moreover, ways of reducing them such as wide bandgap (WBG) devices, system integration, etc. This paper also investigates several tremendous power electric converter topologies with their features and shortcomings. Furthermore, the performance of electric airplanes is greatly influenced by power electronics. Therefore, safety, efficiency, power density, and power quality were considered.","PeriodicalId":106578,"journal":{"name":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"116941008","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-02-01DOI: 10.1109/3D-PEIM55914.2023.10052633
Reshmi Banerjee, Denny John, Cheng Zhang, Arvind Agarwal, P. Raj
Size and weight have always been key concerns for power supplies. Today’s approaches of manufacturing integrated power electronics building block modules with the assembly of pre-packaged devices and low-volumetric density capacitors and inductors create major fundamental system integration limitations in reaching high power densities and efficiencies to meet the target SWaP-C (size, weight and performance with low cost). Cold-sprayed aluminum capacitors on leadframe metal foils are demonstrated for the first time for applications in 3D power package integration. This additive manufacturing process allows low-temperature processing of pre-patterned aluminum electrodes on metal lead-frames, insulated metal substrates or even heat-spreaders and cold-plates. Process optimization of cold-spray technologies requires careful study of particle velocity, deposition atmosphere and particle morphology design. Initial process design led to ~22X enhancement in surface area compared to planar capacitors. With further process design and optimization, this approach can extend to above 100X enhancement. Cold-sprayed capacitors are projected to eliminate several process integration and reliability issues that are associated with traditional discrete surface-assembled capacitors.
{"title":"Cold-sprayed aluminum capacitors on leadframes for 3D power packaging","authors":"Reshmi Banerjee, Denny John, Cheng Zhang, Arvind Agarwal, P. Raj","doi":"10.1109/3D-PEIM55914.2023.10052633","DOIUrl":"https://doi.org/10.1109/3D-PEIM55914.2023.10052633","url":null,"abstract":"Size and weight have always been key concerns for power supplies. Today’s approaches of manufacturing integrated power electronics building block modules with the assembly of pre-packaged devices and low-volumetric density capacitors and inductors create major fundamental system integration limitations in reaching high power densities and efficiencies to meet the target SWaP-C (size, weight and performance with low cost). Cold-sprayed aluminum capacitors on leadframe metal foils are demonstrated for the first time for applications in 3D power package integration. This additive manufacturing process allows low-temperature processing of pre-patterned aluminum electrodes on metal lead-frames, insulated metal substrates or even heat-spreaders and cold-plates. Process optimization of cold-spray technologies requires careful study of particle velocity, deposition atmosphere and particle morphology design. Initial process design led to ~22X enhancement in surface area compared to planar capacitors. With further process design and optimization, this approach can extend to above 100X enhancement. Cold-sprayed capacitors are projected to eliminate several process integration and reliability issues that are associated with traditional discrete surface-assembled capacitors.","PeriodicalId":106578,"journal":{"name":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"76 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"133551929","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-02-01DOI: 10.1109/3D-PEIM55914.2023.10052607
Allen Templeton, Nathan Reed, Hunter Hayes, James Davis, J. Bultitude
There is increased interest in packaging snubber capacitors close to Wide Band Gap (WBG) device switches to improve performance, ultimately being most effective packaged inside power modules. The performance of Multi-Layer Ceramics Capacitors (MLCCs) at the higher switching frequencies used by Wide Band Gap (WBG) devices are not well documented in the literature with respect to dV/dt capability. In this work the internal current stresses induced by high dV/dt pulses in low capacitance, high voltage rated MLCCs (> 500 VDC) used as snubbers in WBG device switching cells was studied. Electrode current densities > 2 ×109 A/m2 were calculated for dV/dt transients > 50 V/nS observed during fast switching with a double pulse test setup. ANSYS® Maxwell® EM Models provide insight into internal MLCC electric fields and current density for these excitations. Post stress measurements show these MLCCs are not degraded. This study will help provide guidance on capacitor selection for different customer snubber applications.
{"title":"Class I Multi-Layer Ceramic Capacitors (MLCCs) Performance as Wide Band Gap (WBG) Snubbers in Hard Switching Applications","authors":"Allen Templeton, Nathan Reed, Hunter Hayes, James Davis, J. Bultitude","doi":"10.1109/3D-PEIM55914.2023.10052607","DOIUrl":"https://doi.org/10.1109/3D-PEIM55914.2023.10052607","url":null,"abstract":"There is increased interest in packaging snubber capacitors close to Wide Band Gap (WBG) device switches to improve performance, ultimately being most effective packaged inside power modules. The performance of Multi-Layer Ceramics Capacitors (MLCCs) at the higher switching frequencies used by Wide Band Gap (WBG) devices are not well documented in the literature with respect to dV/dt capability. In this work the internal current stresses induced by high dV/dt pulses in low capacitance, high voltage rated MLCCs (> 500 VDC) used as snubbers in WBG device switching cells was studied. Electrode current densities > 2 ×109 A/m2 were calculated for dV/dt transients > 50 V/nS observed during fast switching with a double pulse test setup. ANSYS® Maxwell® EM Models provide insight into internal MLCC electric fields and current density for these excitations. Post stress measurements show these MLCCs are not degraded. This study will help provide guidance on capacitor selection for different customer snubber applications.","PeriodicalId":106578,"journal":{"name":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"21 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"125925468","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
Pub Date : 2023-02-01DOI: 10.1109/3D-PEIM55914.2023.10052532
S. M. S. H. Rafin, Rejaul Islam, O. Mohammed
A rapidly growing market of electric vehicles (EVs) has been witnessed in the last decade due to being environmentally friendly, having enough resources, and being cost-efficient. For EV applications, several conductive charging rectifiers, powertrain dc-dc converters, and motor driving inverters have been discussed in this paper. To develop more efficient and environmentally friendly EVs, power converters such as AC-DC, DC-DC, and DC-AC are critical applications of modern power electronics. After this brief review, for the charging section, the Vienna rectifier presents great performance, for the powertrain high-power DC-DC converter section, the multidevice interleaved dc-dc boost converter seems to be an excellent candidate for EV application. For the powertrain DC-AC inverter, the third harmonic injected seven-level inverter can be considered a well-suited candidate for an electric vehicle’s powertrain. In this paper along with the description, the result of these power converters topologies (AC-DC, DC-DC, DC-AC) have been discussed.
{"title":"Overview of Power Electronic Converters in Electric Vehicle Applications","authors":"S. M. S. H. Rafin, Rejaul Islam, O. Mohammed","doi":"10.1109/3D-PEIM55914.2023.10052532","DOIUrl":"https://doi.org/10.1109/3D-PEIM55914.2023.10052532","url":null,"abstract":"A rapidly growing market of electric vehicles (EVs) has been witnessed in the last decade due to being environmentally friendly, having enough resources, and being cost-efficient. For EV applications, several conductive charging rectifiers, powertrain dc-dc converters, and motor driving inverters have been discussed in this paper. To develop more efficient and environmentally friendly EVs, power converters such as AC-DC, DC-DC, and DC-AC are critical applications of modern power electronics. After this brief review, for the charging section, the Vienna rectifier presents great performance, for the powertrain high-power DC-DC converter section, the multidevice interleaved dc-dc boost converter seems to be an excellent candidate for EV application. For the powertrain DC-AC inverter, the third harmonic injected seven-level inverter can be considered a well-suited candidate for an electric vehicle’s powertrain. In this paper along with the description, the result of these power converters topologies (AC-DC, DC-DC, DC-AC) have been discussed.","PeriodicalId":106578,"journal":{"name":"2023 Fourth International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)","volume":"73 1","pages":"0"},"PeriodicalIF":0.0,"publicationDate":"2023-02-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":null,"resultStr":null,"platform":"Semanticscholar","paperid":"129831834","PeriodicalName":null,"FirstCategoryId":null,"ListUrlMain":null,"RegionNum":0,"RegionCategory":"","ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":"","EPubDate":null,"PubModel":null,"JCR":null,"JCRName":null,"Score":null,"Total":0}
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